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Stacked electronic component package having single-sided film spacer

  • US 20080237824A1
  • Filed: 02/17/2006
  • Published: 10/02/2008
  • Est. Priority Date: 02/17/2006
  • Status: Abandoned Application
First Claim
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1. A stacked electronic component package comprising:

  • a first electronic component having a first surface and a second surface comprising a plurality of bond pads;

    a single-sided film spacer coupled to the second surface of the first electronic component inward of the bond pads, the single-sided film spacer comprising;

    a non-adhesive organic film; and

    a spacer film adhesive; and

    a second electronic component having a first surface coupled to the single-sided film spacer by a second electronic component film adhesive, wherein the second electronic component film adhesive is applied to the entire first surface of the second electronic component.

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