Stacked electronic component package having single-sided film spacer

• US 20080237824A1
• Filed: 02/17/2006
• Published: 10/02/2008
• Est. Priority Date: 02/17/2006
• Status: Abandoned Application

• Current Assignee: Amkor Technology Incorporated
• Original Assignee: Amkor Technology Incorporated
• Inventors: St. Amand, Roger D., Park, KyungRok, Han, ChangSuk, Kim, YounSang
• Application Number:
  US11/356,919
• Publication Number:
  US 20080237824A1
• Time in Patent Office: Days
• US Class Current: 257/686
• CPC Class Codes: H01L 2224/32145 the bodies being stacked
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2224/92247 the second connecting process involving a wire connector
• CPC Class Codes: H01L 2225/0651 Wire or wire-like electrical connections from device to substrate
• CPC Class Codes: H01L 2225/06575 Auxiliary carrier between devices, the carrier having no electrical connection structure
• CPC Class Codes: H01L 23/3128 the substrate having spherical bumps for external connection
• CPC Class Codes: H01L 24/27 Manufacturing methods
• CPC Class Codes: H01L 24/73 Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
• CPC Class Codes: H01L 25/0657 Stacked arrangements of devices
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/14 Integrated circuits
• CPC Class Codes: H01L 2924/15311 being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/181 Encapsulation
• CPC Class Codes: H01L 2924/19103 interposed between the semiconductor or solid-state device and the die mounting substrate, i.e. chip-on-passive

Abstract

A method of fabricating a stacked electronic component package includes placing a single-sided film spacer on an upper surface of a lower electronic component inward of bond pad with a pickup tool. After being adhered to the upper surface of the lower electronic component, the pickup tool is retracted from the single-sided film spacer. An upper surface of a film, e.g., an organic film, of the single-sided film spacer is nonadhesive. Accordingly, the single-sided film spacer does not stick to the pickup tool during retraction of the pickup tool from the single-sided film spacer.

Claims

1. A stacked electronic component package comprising:

a first electronic component having a first surface and a second surface comprising a plurality of bond pads;

a single-sided film spacer coupled to the second surface of the first electronic component inward of the bond pads, the single-sided film spacer comprising;

a non-adhesive organic film; and

a spacer film adhesive; and

a second electronic component having a first surface coupled to the single-sided film spacer by a second electronic component film adhesive, wherein the second electronic component film adhesive is applied to the entire first surface of the second electronic component.

3. The stacked electronic component package of claim 1 wherein the second electronic component comprises a second surface comprising bond pads.

4. The stacked electronic component package of claim 3 wherein a substrate comprises first traces on a first surface of the substrate, the stacked electronic component package further comprising:

lower bond wires coupling the bond pads of the first electronic component to respective ones of the first traces; and

upper bond wires coupling the bond pads of the second electronic component to respective ones of the first traces.

5. The stacked electronic component package of claim 4 wherein the second electronic component film adhesive prevents the lower bond wires from directly contacting the first surface of the second electronic component.

6. The stacked electronic component package of claim 5 wherein the second electronic component film adhesive is a dielectric.

7. The stacked electronic component package of claim 6 wherein the lower bond wires contact the second electronic component film adhesive.

8. The stacked electronic component package of claim 1 wherein the second electronic component film adhesive is vertically between the bond pads of the first electronic component and the first surface of the second electronic component.

9. The stacked electronic component package of claim 1 wherein a package body is vertically between the bond pads of the first electronic component and the second electronic component film adhesive.

10. The stacked electronic component package of claim 1 wherein the second electronic component is larger than the first electronic component.

11. The stacked electronic component package of claim 1 wherein the spacer film adhesive comprises more than one film adhesive.

12. The stacked electronic component package of claim 11 wherein a substrate comprises first traces on a first surface of the substrate, the bond pads of the first electronic component being coupled to the first traces with first bond wires, the single-sided film spacer spacing the second electronic component film adhesive above the first bond wires.

13. The stacked electronic component package of claim 11 wherein a substrate comprises first traces on a first surface of the substrate, the bond pads of the first electronic component being coupled to the first traces with first bond wires, the single-sided film spacer providing a sufficient spacing between the second surface of the first electronic component and the second electronic component film adhesive to prevent shorting of the first bond wires.

28. The stacked electronic component package of claim 1 wherein the spacer film adhesive is a preformed film of adhesive and wherein the second electronic component film adhesive is a preformed film of adhesive.

2. (canceled)

14-27. -27. (canceled)

29. A stacked electronic component package comprising:

a first electronic component comprising;

a first surface;

a second surface; and

bond pads on the second surface;

a substrate comprising;

a first surface;

first traces on the first surface of the substrate;

a second surface; and

second traces on the second surface of the substrate, the first traces being coupled to the second traces;

means for connecting the stacked electronic component package to a larger substrate on the second traces;

first bond wires coupling the bond pads to respective ones of the first traces;

a single-sided film spacer comprising;

a non-adhesive film comprising a non-adhesive surface; and

a spacer film adhesive coupled to the second surface of the first electronic component inward of the bond pads and to the non-adhesive film, the spacer film adhesive comprising;

a first lower film adhesive; and

a second lower film adhesive;

a second electronic component comprising;

a first surface;

a second surface;

bond pads on the second surface of the second electronic component;

a second electronic component film adhesive coupling the first surface of the second electronic component to the non-adhesive surface of the non-adhesive film, the second electronic component film adhesive being located vertically between the bond pads of the first electronic component and the first surface of the second electronic component, wherein the second electronic component film adhesive is applied to the entire first surface of the second electronic component;

second bond wires coupling the bond pads on the second surface of the second electronic component to respective ones of the first traces; and

a package body enclosing the first electronic component, the single-sided film spacer, the second electronic component film adhesive, the second electronic component, the first bond wires, the second bond wires, and at least a portion of the first surface of the substrate.

30. A stacked electronic component package comprising:

a first electronic component comprising;

a first surface;

a second surface; and

bond pads on the second surface;

a substrate comprising;

a first surface; and

first traces on the first surface of the substrate;

first bond wires coupling the bond pads to respective ones of the first traces;

a single-sided film spacer coupled to the second surface of the first electronic component inward of the bond pads, the single-sided film spacer comprising;

a non-adhesive film; and

a spacer film adhesive comprising;

a first means for spacing; and

a second means for spacing;

a second electronic component comprising;

a first surface;

a second surface;

bond pads on the second surface of the second electronic component;

a second electronic component film adhesive coupling the first surface of the second electronic component to the non-adhesive film, the second electronic component film adhesive being located vertically between the bond pads of the first electronic component and the first surface of the second electronic component, wherein the second electronic component film adhesive is applied to the entire first surface of the second electronic component; and

second bond wires coupling the bond pads on the second surface of the second electronic component to respective ones of the first traces.

31. The stacked electronic component package of claim 30 wherein the bond pads on the second surface of the first electronic component comprise a first bond pad and a second bond pad, the first bond pad being inward of the second bond pad.

32. The stacked electronic component package of claim 31 wherein a first bond wire of the first bond wires is coupled to the first bond pad and a second bond wire of the first bond wires is coupled to the second bond pad.

33. The stacked electronic component package of claim 32 wherein the first means for spacing and the second means for spacing define a distance between the second electronic film adhesive and the second surface of the first electronic component.

34. The stacked electronic component package of claim 33 wherein the distance is sufficient to prevent the first bond wire from being pushed down into the second bond wire.

35. The stacked electronic component package of claim 30 wherein the first means for spacing is coupled to the second surface of the first electronic component and the second means for spacing is coupled to the non-adhesive film.