Semiconductor Device and Method For Manufacturing Same

• US 20080237872A1
• Filed: 01/19/2005
• Published: 10/02/2008
• Est. Priority Date: 01/21/2004
• Status: Abandoned Application

• Current Assignee: Pioneer Corporation
• Original Assignee: Pioneer Corporation
• Inventors: Nagayama, Kenichi
• Application Number:
  US10/586,584
• Publication Number:
  US 20080237872A1
• Time in Patent Office: Days
• US Class Current: 257/773
• CPC Class Codes: H01L 22/34 Circuits for electrically characterising or monitoring manufacturing processes, e. g. whole test die, wafers filled with test structures, on-board-devices incorporated on each die, process control monitors or pad structures thereof, devices in scribe line switching, multiplexing, gating devices G01R19/25; process control with lithography, e.g. dose control, G03F7/20; structures for alignment control by optical means G03F7/70633
• CPC Class Codes: H10K 50/844 Encapsulations
• CPC Class Codes: H10K 71/70 Testing, e.g. accelerated lifetime tests
• CPC Class Codes: H10K 71/861 Repairing

Abstract

Disclosed is a semiconductor apparatus having a sealing structure that allows high-precision detection of defects occurring in a protective film, and a method of manufacturing the same. A semiconductor apparatus 1 includes a substrate 10, a semiconductor device 14 formed on the substrate 10, and a protective film 17 for sealing the semiconductor device 14. The semiconductor apparatus 1 further includes a first conductive layer 16 in contact with a back surface of the protective film 17, and a second conductive layer 18 in contact with a front surface of the protective film 17.

Claims

1. A semiconductor apparatus comprising a substrate, a semiconductor device formed on said substrate, and a protective film for sealing said semiconductor device, said semiconductor apparatus further comprising:

a first conductive layer in contact with a back surface of said protective film; and

a second conductive layer in contact with a front surface of said protective film.

2. The semiconductor apparatus according to claim 1, further comprising an insulating film of electrical insulation formed on said semiconductor device, said first conductive layer being formed on said insulating film.

3. The semiconductor apparatus according to claim 1, wherein said semiconductor device includes an outermost electrode layer as said first conductive layer.

4. The semiconductor apparatus according to claim 1, wherein at least one of said first conductive layer and said second conductive layer is patterned into stripes.

5. The semiconductor apparatus according to claim 1, wherein said first conductive layer and said second conductive layer are patterned into stripes so as to cross each other.

6. The semiconductor apparatus according to claim 1, further comprising:

a first electrode terminal in connection with said first conductive layer; and

a second electrode terminal in connection with said second conductive layer.

7. The semiconductor apparatus according to claim 6, wherein said first and second electrode terminals are formed on a peripheral part of said substrate, said peripheral part being located outside an area in which said semiconductor device is formed.

8. The semiconductor apparatus according to claim 6, wherein at least either one of said first electrode terminal and said second electrode terminal is made of a plurality of electrode pieces arranged at predetermined intervals along a peripheral part of said substrate.

9. The semiconductor apparatus according to claim 1, wherein said semiconductor device includes an electroluminescent device.

10. A method of manufacturing a semiconductor apparatus for detecting a defect within a protective film which seals a semiconductor device formed on a substrate, said method comprising the steps of:

(a) forming a first conductive layer;

(b) forming a protective film for covering said semiconductor device on said first conductive layer;

(c) forming a second conductive layer on said protective film; and

(d) measuring electrical conduction between said first conductive layer and said second conductive layer, and detecting a defect within said protective film based on the measurement result.

11. The method of manufacturing a semiconductor apparatus according to claim 10, further comprising the step of, after a defect of said protective film is detected in said step (d), forming a repair layer for covering a surface of said second conductive layer corresponding to at least a region of and in the vicinity of the detected defect of said protective film.

12. The method of manufacturing a semiconductor apparatus according to claim 10, further comprising the step of forming an insulating film of electrical insulation on said semiconductor device, and wherein said first conductive layer is formed on said insulating film in said step (a).

13. The method of manufacturing a semiconductor apparatus according to claim 10, wherein said semiconductor device includes an outermost electrode layer as said first conductive layer.

14. The method of manufacturing a semiconductor apparatus according to claim 10, wherein said first conductive layer is patterned in stripes in said step (a).

15. The method of manufacturing a semiconductor apparatus according to claim 10, wherein said second conductive layer is formed in stripes in said step (c).

16. The method of manufacturing a semiconductor apparatus according to claim 10, wherein said steps (a) and (c) include patterning said first conductive layer and said second conductive layer in stripes so as to cross each other.

17. The method of manufacturing a semiconductor apparatus according to claim 10, wherein:

said step (a) includes forming a first electrode terminal in connection with said first conductive layer; and

said step (c) includes forming a second electrode terminal in connection with said second conductive layer.

18. The method of manufacturing a semiconductor apparatus according to claim 17, wherein said step (d) includes:

measuring electrical conduction between first and second probes, said first probe being in contact with a surface of either one of said first electrode terminal and said second electrode terminal, while scanning said second probe in contact with and across a surface of the other of said first electrode terminal and said second electrode terminal; and

identifying a region of the defect of said protective film based on the measurement result.

19. The method of manufacturing a semiconductor apparatus according to claim 17, wherein said step (d) includes:

measuring electrical conduction between first and second probes, said first probe being into contact with a surface of either one of said first electrode terminal and said second electrode terminal, while sequentially connecting said second probe to a plurality of predetermined points on a surface of the other of said first electrode terminal and said second electrode terminal; and

identifying a region of the defect;

of said protective film based on the measurement results.

20. The method of manufacturing a semiconductor apparatus according to claim 17, wherein, in each of said steps (a) and (c), said first and second electrode terminals are formed on a peripheral part of said substrate, said peripheral part being located outside an area in which said semiconductor device is formed.

21. The method of manufacturing a semiconductor apparatus according to claim 17, wherein said step (a) includes forming a plurality of electrode pieces as said first electrode terminal, said electrode pieces being arranged at predetermined intervals along a peripheral part of said substrate.

22. The method of manufacturing a semiconductor apparatus according to claim 17, wherein said step (c) includes forming a plurality of electrode pieces as said second electrode terminal, said electrode pieces being arranged at predetermined intervals along a peripheral part of said substrate.

23. The method of manufacturing a semiconductor apparatus according to claim 10, wherein said semiconductor device includes an electroluminescent device.