Wireless communication device with RF integrated circuit having an on-chip gyrator

• US 20080238703A1
• Filed: 03/29/2007
• Published: 10/02/2008
• Est. Priority Date: 03/29/2007
• Status: Active Grant

• Current Assignee: Avago Technologies International Sales Pte Limited (Broadcom, Inc.)
• Original Assignee: Broadcom Corporation (Broadcom, Inc.)
• Inventors: Rofougaran, Ahmadraza (Reza)
• Granted Patent: US 9,052,193 B2
• Time in Patent Office: Days
• US Class Current: 340/670
• CPC Class Codes: A63F 2300/1037 being specially adapted for converting control signals received from the game device into a haptic signal, e.g. using force feedback
• CPC Class Codes: A63F 2300/105 using inertial sensors, e.g. accelerometers, gyroscopes
• CPC Class Codes: G01C 19/56 Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces
• CPC Class Codes: H04B 7/0413 MIMO systems
• CPC Class Codes: H04W 72/20 Control channels or signalling for resource management

Abstract

An integrated circuit includes an on-chip gyrating circuit that generates a motion parameter based on motion of the IC. An RF transceiver generates an outbound RF signal from outbound data and that generates inbound data from an inbound RF signal. A processing module processes the motion parameter, generates the outbound data, and receives the inbound data.

Claims

1. An integrated circuit (IC) comprising:

a on-chip gyrating circuit that generates a motion parameter based on motion of the IC, wherein the on-chip gyrating circuit is implemented with microelectromechanical systems (MEMS) technology;

an RF transceiver, that generates an outbound RF signal from outbound data and that generates inbound data from an inbound RF signal;

a processing module, coupled to the on-chip gyrating circuit and the RF transceiver, and that processes the motion parameter, generates the outbound data, and receives the inbound data.

2. The IC of claim 1 wherein the on-chip gyrating circuit includes one of:

a piezoelectric gyroscope;

a vibrating wheel gyroscope;

a tuning fork gyroscope;

a hemispherical resonator gyroscope; and

a rotating wheel gyroscope.

3. The IC of claim 1 wherein the IC is integrated in a package having a substrate and a first die and wherein the RF transceiver and the on-chip gyrating circuit are implemented on the first die.

4. The IC of claim 1 wherein the IC is integrated in a package having a substrate, a first die and a second die and wherein the RF transceiver is implemented on the first die and the on-chip gyrating circuit is implemented on the second die.

5. The IC of claim 1 wherein the IC is integrated in a package having a substrate and a first die wherein the RF transceiver, processing module and the on-chip gyrating circuit are implemented on the first die.

6. The IC of claim 1 wherein the IC is integrated in a package having a substrate and a first die and a second die, and wherein the RF transceiver and processing module are implemented on the first die and the on-chip gyrating circuit is implemented on the second die.

7. The IC of claim 1 wherein the IC is integrated in a package with a top and a bottom having a plurality of bonding pads to connect the IC to a circuit board and wherein the on-chip gyrating circuit is integrated along the bottom of the package.

8. The IC of claim 7 wherein the bonding pads are arrayed in an area of the bottom with an open center portion and wherein the on-chip gyrating circuit is integrated in the open center portion.

9. The IC of claim 1 wherein the IC is integrated in one of, a surface mount package, and an in-line package.

10. The IC of claim 1 wherein the outbound data is based on the motion parameter.

11. An integrated circuit (IC) comprising:

an on-chip gyrating circuit that generates a motion parameter based on motion of the IC; and

an RF transceiver that generates an outbound RF signal from outbound data and that generates inbound data from an inbound RF signal, and wherein the outbound data includes an indication of the motion parameter.

12. The IC of claim 11 wherein the IC is integrated in a package having a substrate and a first die and wherein the RF transceiver and the on-chip gyrating circuit are implemented on the first die.

13. The IC of claim 11 wherein the IC is integrated in a package having a substrate, a first die and a second die and wherein the RF transceiver is implemented on the first die and the on-chip gyrating circuit is implemented on the second die.

14. The IC of claim 11 further comprising:

a processing module, coupled to the memory module, the on-chip gyrating circuit and the RF transceiver, and that processes the motion parameter to produce motion data, generates the outbound data that includes the motion data, and receives the inbound data.

15. The IC of claim 14 wherein the IC is integrated in a package having a substrate and a first die wherein the RF transceiver, processing module and the on-chip gyrating circuit are implemented on the first die.

16. The IC of claim 14 wherein the IC is integrated in a package having a substrate and a first die and a second die, and wherein the RF transceiver and processing module are implemented on the first die and the on-chip gyrating circuit is implemented on the second die.

17. The IC of claim 11 wherein the IC is integrated in a package with a top and a bottom having a plurality of bonding pads to connect the IC to a circuit board and wherein the on-chip gyrating circuit is integrated along the bottom of the package.

18. The IC of claim 17 wherein the bonding pads are arrayed in an area of the bottom with an open center portion and wherein the on-chip gyrating circuit is integrated in the open center portion.

19. The IC of claim 11 wherein the IC is integrated in one of a surface mount package and a in-line package.

20. The IC of claim 11 wherein the on-chip gyrating circuit is implemented with microelectromechanical systems (MEMS) technology.

21. The IC of claim 11 wherein the on-chip gyrating circuit includes one of:

a piezoelectric gyroscope;

a vibrating wheel gyroscope;

a tuning fork gyroscope;

a hemispherical resonator gyroscope; and

a rotating wheel gyroscope.

22. The IC of claim 11 wherein the indication of the motion parameter includes one of velocity data and acceleration data.

23. A wireless communication device comprises:

an integrated circuit (IC) that includes;

a die that supports;

a processing module coupled to process a motion parameter to produce motion data, to convert outbound data into the outbound symbol stream, to convert the inbound symbol stream into inbound data, and to generate a transmit control signal in accordance with the motion data; and

a radio frequency (RF) transceiver that generates an outbound RF signal from an outbound symbol stream in accordance with the transmit control signal, and that generates an inbound symbol stream from an inbound RF signal; and

a package substrate that supports the die and an on-chip gyrating circuit that generates the motion parameter based on motion of the wireless communication device; and

an antenna structure coupled to receive the inbound RF signal and to transmit the outbound RF signal.

24. The wireless communication device of claim 23 wherein the transmit control signal includes one of in-air beamforming phases, diversity antenna selection, and polarization antenna selection.

25. The wireless communication device of claim 24 wherein the antenna structure includes one of is configured as a diversity antenna structure, a polarized antenna structure, as a multi-input multi-output (MIMO) antenna structure, as a single-input single-output (SISO) antenna structure and wherein the antenna structure modifies an antenna configuration based on the transmit control signal.

26. The wireless communication device of claim 23 wherein the transmit control signal includes one of transmit power and a protocol parameter.

27. The wireless communication device of claim 23 wherein the processing module further generates a receive control signal to adjust a receive parameter of the RF transceiver based on the motion data.