Substrate holding apparatus, exposure apparatus, exposing method, and device fabricating method

• US 20080239275A1
• Filed: 06/05/2008
• Published: 10/02/2008
• Est. Priority Date: 12/08/2005
• Status: Active Grant

• Current Assignee: Nikon Corporation
• Original Assignee: Nikon Corporation
• Inventors: Shibazaki, Yuichi, Shibuta, Makoto, MIZUTANI, Takeyuki
• Granted Patent: US 8,089,615 B2
• Time in Patent Office: Days
• US Class Current: 355/73
• CPC Class Codes: G03F 7/70341 Details of immersion lithography aspects, e.g. exposure media or control of immersion liquid supply chemical composition of immersion liquids G03F7/2041
• CPC Class Codes: G03F 7/707 Chucks, e.g. chucking or un-chucking operations or structural details
• CPC Class Codes: G03F 7/70875 Temperature, e.g. temperature control of masks or workpieces via control of stage temperature
• CPC Class Codes: H01L 21/68714 the wafers being placed on a susceptor, stage or support
• CPC Class Codes: H01L 21/68735 characterised by edge profile or support profile
• CPC Class Codes: H01L 21/6875 characterised by a plurality of individual support members, e.g. support posts or protrusions
• CPC Class Codes: Y10T 279/11 Vacuum

Abstract

The some aspects of the present invention provides a substrate holding apparatus that comprises: a base part; a support part that is formed on the base part and supports a rear surface of the substrate; a first circumferential wall that: is formed on the base part; has a first upper surface that opposes the rear surface of the substrate, which is supported by the support part; and surrounds a first space that is between the substrate, which is supported by the support part, and the base part; a second circumferential wall that: is formed on the base part; has a second upper surface that opposes the rear surface of the substrate, which is supported by the support part, with a gap interposed therebetween; and surrounds the first circumferential wall; a third circumferential wall that: is formed on the base part; has a third upper sure that opposes the rear surface of the substrate, which is supported by the support part; and surrounds the support part and the second circumferential wall; a fluid flow port that is capable of supplying gas to a second space that is between the first circumferential wall and the second circumferential wall; and a first suction port that suctions fluid from a third space that is between the second circumferential wall and the third circumferential wall.

Claims

1. A substrate holding apparatus that holds a substrate which is irradiated by exposure light, comprising:

a base part;

a support part that is formed on the base part and supports a rear surface of the substrate;

a first circumferential wall that;

is formed on the base part;

has a first upper surface that opposes the rear surface of the substrate, which is supported by the support part; and

surrounds a first space that is between the substrate, which is supported by the support part, and the base part;

a second circumferential wall that;

is formed on the base part;

has a second upper surface that opposes the rear surface of the substrate, which is supported by the support part, with a gap interposed therebetween; and

surrounds the first circumferential wall;

a third circumferential wall that;

is formed on the base part;

has a third upper surface that opposes the rear surface of the substrate, which is supported by the support part; and

surrounds the support part and the second circumferential wall;

a fluid flow port that is capable of supplying gas to a second space that is between the first circumferential wall and the second circumferential wall; and

a first suction port that suctions fluid from a third space that is between the second circumferential wall and the third circumferential wall.

2. A substrate holding apparatus according to claim 1, wherein

a suction operation of the first suction port generates a gas flow that flows from the second space toward the third space via the gap.

3. A substrate holding apparatus according to claim 2, wherein

the gas flow prevent a liquid from leaking into the first space and the second space.

4. A substrate holding apparatus according to claim 1, wherein

the second space is open to the atmosphere via the fluid flow port.

5. A substrate holding apparatus according to claim 1, wherein

the fluid flow port comprises multiple ports that are formed in the base part between the first circumferential wall and the second circumferential wall at prescribed intervals along a circumferential direction of the first circumferential wall.

6. A substrate holding apparatus according to claim 1, flier comprising:

a first groove that is formed in the base part between the first circumferential wall and the second circumferential wall so that the first groove surrounds the first circumferential wall;

wherein,

the fluid flow port is formed inside the first groove.

7. A substrate holding apparatus according to claim 1, wherein

the first suction port comprises multiple ports that are formed in the base part between the second circumferential wall and the third circumferential wall at prescribed intervals along the second circumferential wall.

8. A substrate holding apparatus according to claim 1, further comprising:

a second groove that is formed in the base part between the second circumferential wall and the third circumferential wall so that the second groove surrounds the second circumferential wall;

wherein,

the first suction port is formed inside the second groove.

9. A substrate holding apparatus according to claim 8, wherein

the support part comprises a plurality of pin shaped projecting parts, which are disposed in the base part between the second circumferential wall and the second groove and between the second groove and the third circumferential wall.

10. A substrate holding apparatus according to claim 1, wherein

the third circumferential wall is formed so that the rear surface of the substrate, which is supported by the support part, and the third upper surface contact one another.

11. A substrate holding apparatus according to claim 1, further comprising:

a second suction port that is provided in the base part at the inner side of the first circumferential wall and between the second circumferential wall and the third circumferential wall, and that suctions the fluid from the first space and the second space in order to negatively pressurize the first space and the third space.

12. A substrate holding apparatus according to claim 11, wherein

the negative pressurization of the first space and the third space chucks the rear surface of the substrate to the support member.

13. A substrate holding apparatus according to claim 11, wherein

the second suction port between the second circumferential wall and the third circumferential wall is formed so that the second suction port is further spaced apart from the second circumferential wall than the first suction port is.

14. A substrate holding apparatus according to claim 1, further comprising:

a fourth circumferential wall that;

is formed on the base part;

has a fourth upper surface that opposes the rear surface of the substrate, which is supported by the support part; and

surrounds the third circumferential wall; and

a third suction port that suctions the fluid between the third circumferential wall and the fourth circumferential wall.

15. A substrate holding apparatus according to claim 14, wherein

the third suction port comprises multiple ports that are formed in the base part between the third circumferential wall and the four circumferential wall at prescribed intervals along a circumferential direction of the third circumferential wall.

16. A substrate holding apparatus according to claim 14, further comprising:

a third groove that is formed on the base part between the third circumferential wall and the fourth circumferential wall so that the third groove surrounds the third circumferential wall;

wherein,

the third suction port is formed inside the third groove.

17. A substrate holding apparatus according to claim 14, comprising:

a passageway through which the gas can circulate between a fourth space, which is between the third circumferential wall and the fourth circumferential wall, and an exterior space, which is at the outer side of the fourth circumferential wall with respect to the third circumferential wall.

18. A substrate holding apparatus according to claim 17, wherein

the passageway comprises a slit, which is provided to part of the fourth circumferential wall.

19. A substrate holding apparatus according to claim 17, wherein

the passageway is formed by the fourth upper surface of the fourth circumferential wall.

20. A substrate holding apparatus according to claim 1, wherein

a gap is formed between the rear surface of the substrate, which is held by the support member, and the first upper surface of the first circumferential wall.

21. A substrate holding apparatus according to claim 1, wherein

the first, second, and third circumferential walls each have an annular shape that is substantially similar to the external shape of the substrate.

22. A substrate holding apparatus according to claim 21, wherein

the center of the first space and the center of the substrate substantially coincide.

23. An exposure apparatus, comprising:

a substrate holding apparatus according to claim 1;

wherein,

a substrate, which is held by the substrate holding apparatus, is exposed through a liquid.

24. An exposure apparatus according to claim 23, further comprising:

a transport apparatus that is capable of transporting the substrate with respect to the substrate holding apparatus;

wherein,

the first space is set in accordance with an area of the rear surface of the substrate that contacts the transport apparatus.

25. A device fabricating method, comprising:

exposing a substrate using an exposure apparatus according to claim 23; and

developing the exposed substrate.

26. An exposing method that performs an immersion exposure, the method comprising:

holding a substrate with a substrate holding apparatus; and

exposing the substrate, which is held by the substrate holding apparatus;

wherein,

the substrate holding apparatus comprises;

a base part;

a support part that is formed on the base part and supports a rear surface of the substrate;

a first circumferential wall that is formed on the base part has a first upper surface that opposes the rear surface of the substrate, which is supported by the support part; and

surrounds a first space that is between the substrate, which is supported by the support part, and the base part;

a second circumferential wall that is formed on the base part;

has a second upper surface that opposes the rear surface of the substrate, which is supported by the support part, with a gap interposed therebetween; and

surrounds the first circumferential wall;

a third circumferential wall that;

is formed on the base part;

has a third upper surface that opposes the rear surface of the substrate, which is supported by the support part; and

surrounds the support part and the second circumferential wall;

a fluid flow port that is capable of supplying gas to a second space that is between the first circumferential wall and the second circumferential wall; and

a first suction port that suctions fluid from a third space that is between the second circumferential wall and the third circumferential wall.

27. An exposing method according to claim 26, further comprising:

forming an immersion region of a liquid in part of a front surface of the substrate;

wherein,

the substrate is exposed through the liquid.

28. An exposing method according to claim 26, further comprising:

suctioning the fluid from the third space via the first suction port during the exposure of the substrate.

29. An exposing method according to claim 26, wherein

the substrate holding apparatus further comprises a second suction port that is formed on the base part and suctions the gas from the first space in order to chuck the substrate;

and

a suction operation wherein the first suction port is used is started after the start of a suction operation wherein the second suction port is used.

30. An exposing method according to claim 29, further comprising:

stopping the suction operation wherein the second suction port is used after the exposure of the substrate is complete; and

stopping the suction operation wherein the first suction port is used after the completion of the suction operation wherein the second suction port is used.

31. The exposing method according to claim 30, wherein

the substrate holding apparatus further comprises a third suction port that is provided on the base part and is provided at the outer side of the third circumferential wall;

the method further comprising;

suctioning the fluid at the outer side of the third circumferential wall using the third suction port after the exposure of the substrate is complete and before the suction operation wherein the second suction port is used is stopped.

32. A device fabricating method, comprising:

exposing the substrate using an exposing method according to claim 26; and

developing the exposed substrate.