MICROMECHANICAL DEVICE OF INCREASED RIGIDITY

• US 20080239431A1
• Filed: 03/12/2008
• Published: 10/02/2008
• Est. Priority Date: 04/02/2007
• Status: Abandoned Application

• Current Assignee: Fraunhofer Gesellschaft Zur Foerderung Der Angewandten Forsching E.V.
• Original Assignee: Fraunhofer Gesellschaft Zur Foerderung Der Angewandten Forsching E.V.
• Inventors: KLOSE, Thomas, DRABE, Christian
• Application Number:
  US12/046,657
• Publication Number:
  US 20080239431A1
• Time in Patent Office: Days
• US Class Current: 359/198
• CPC Class Codes: G02B 26/0841 the reflecting element being moved or deformed by electrostatic means

Abstract

A micromechanical device includes a deflectable micromechanical functional structure and a non-rigid biased suspension positioning the micromechanical functional structure in the micromechanical device.

Claims

1. A micromechanical device comprising:

a deflectable micromechanical functional structure; and

a non-rigid biased suspension positioning the micromechanical functional structure in the micromechanical device.

2. The micromechanical device of claim 1, wherein the deflectable micromechanical functional structure comprises a first comb electrode, the micromechanical device including a second comb electrode, and the non-rigid biased suspension positioning the first comb electrode relative to the second comb electrode.

3. The micromechanical device of claim 1, wherein the deflectable micromechanical functional structure is a one- or two-dimensional deflectable torsion-vibratable element.

4. The micromechanical device of claim 1, wherein the deflectable micromechanical functional structure is a translation-vibratable element.

5. The micromechanical device of claim 1, wherein the non-rigid biased suspension is biased by intrinsic stress in the suspension.

6. The micromechanical device of claim 1, wherein the non-rigid biased suspension is biased by the action of an external force.

7. The micromechanical device of claim 1, comprising a structure biasing the non-rigid suspension.

8. The micromechanical device of claim 7, wherein the structure applies compressive and/or tensile stress to the non-rigid suspension.

9. The micromechanical device of claim 8, wherein the structure defines an internal stress gradient in order to apply compressive and/or tensile stress to the non-rigid suspension.

10. The micromechanical device of claim 1, wherein the micromechanical functional structure comprises intrinsic stress which applies compressive and/or tensile stress to the non-rigid suspension for biasing same.

11. The micromechanical device of claim 1, comprising a casing to which the non-rigid suspension is mounted.

12. The micromechanical device of claim 11, comprising an actor arranged in the casing, the actor being operative to bias the non-rigid suspension.

13. The micromechanical device of claim 12, wherein the actor operates in accordance with the piezoelectric, thermal, electrostatic, magnetorestrictive principle or another physical-chemical principle.

14. The micromechanical device of claim 1, wherein the micromechanical device is a microsystem operated in resonance including an electrostatic drive and torsion spring suspension.

15. The micromechanical device of claim 1, wherein the micromechanical device is a microsystem operated quasi-statically including an electrostatic drive and torsion spring suspension.

16. The micromechanical device of claim 1, wherein the non-rigid biased suspension is a torsion or bending spring.