Cooling of High Power Density Devices Using Electrically Conducting Fluids

• US 20080239672A1
• Filed: 01/20/2005
• Published: 10/02/2008
• Est. Priority Date: 01/23/2004
• Status: Abandoned Application

• Current Assignee: Zagorin O'Brien Graham, LLP
• Original Assignee: Nanocoolers, Inc.
• Inventors: Ghoshal, Uttam, Miner, Andrew Carl
• Application Number:
  US10/597,327
• Publication Number:
  US 20080239672A1
• Time in Patent Office: Days
• US Class Current: 361/701
• CPC Class Codes: G06F 1/203 for portable computers, e.g. for laptops
• CPC Class Codes: G06F 1/206 comprising thermal management
• CPC Class Codes: G06F 2200/201 Cooling arrangements using cooling fluid
• CPC Class Codes: H01L 23/473 by flowing liquids H01L23/4332, H01L23/4338 take precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H02K 44/02 Electrodynamic pumps
• CPC Class Codes: H10N 10/00 Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects integrated devices or assemblies of multiple devices H10N19/00

Abstract

A system to extract heat from a high power density device and dissipate heat at a convenient distance. The system circulates liquid metal in a closed conduit using one or more electromagnetic pumps for carrying away the heat from high power density device and rejecting the heat at a heat sink located at a distance. The system may make use of a thermoelectric generator to power the electromagnetic pumps by utilizing the temperature difference between the inlet and outlet pipes of the heat sink. The system also provides networks of primary and secondary closed conduits having series and parallel arrangements of electromagnetic pumps for dissipating heat from multiple devices at a remotely located heat sink.

Claims

1. A system for dissipating heat from a high power density device, the system comprising:

a pathway for transport of a liquid metal thermal transfer fluid, the pathway including a portion in close thermal communication with the high power density device; and

at least one electromagnetic pump for motivating flow of the liquid metal thermal transfer fluid through the liquid metal thermal transfer pathway away from and back to the high power density device,

wherein the high power density device is located in a folding device, and

wherein at least a portion of the liquid metal thermal transfer pathway traverses a bend in the folding device.

2. The system of claim 1,

wherein the bend traversing portion of the liquid metal thermal transfer pathway includes a flexible conduit.

3. The system of claim 1,

wherein the bend traversing portion of the liquid metal thermal transfer pathway includes a hinge that defines an integrated conduit therethrough.

4. The system of claim 1, further comprising:

a heat pipe; and

a heat exchanger coupled to transfer heat between the liquid metal thermal transfer fluid and the heat pipe.

5. The system of claim 1, further comprising:

the liquid metal thermal transfer fluid.

6. The system as recited in claim 1,

wherein the pathway portion in close thermal communication with the high power density device includes a solid-fluid heat exchanger.

7. The system as recited in claim 1,

wherein the pathway portion in close thermal communication with the high power density device includes a liquid metal chamber that allows direct thermal contact between the high power density device and the liquid metal.

8. The system of claim 1, further comprising:

a heat sink separated from the high power density device by a beat transfer path that includes the bend traversing portion of the liquid metal thermal transfer pathway.

9. A system for dissipating heat from a high power density device, the system comprising:

a pathway for transport of a liquid metal thermal transfer fluid, the pathway including a portion in close thermal communication with a heat pipe; and

at least one electromagnetic pump-for motivating flow of the liquid metal thermal transfer fluid through the pathway away from and back to the heat pipe,

wherein the pathway for transport of the liquid metal thermal transfer fluid and the heat pipe together define a heat transfer path away from the high power density device.

10. The system of claim 9,

wherein the high power density device is located in a folding device, and

wherein at least a portion of the liquid metal thermal transfer pathway traverses a bend in the folding device.

11. The system of claim 10,

wherein the bend traversing portion of the liquid metal thermal transfer pathway includes a flexible conduit.

12. The system of claim 10,

wherein the bend traversing portion of the liquid metal thermal transfer pathway includes a hinge that defines an integrated conduit therethrough.

13. The system of claim 9,

wherein the liquid metal thermal transfer pathway includes a portion in close thermal communication with the high power density device.

14. The system of claim 9,

wherein at least a portion of the liquid metal thermal transfer pathway is formed using a flexible conduit

15. The system of claim 9, further comprising:

the liquid metal thermal transfer fluid.

16. A method for dissipating heat from a high power density device, the method comprising:

transferring heat from the high power density device to a liquid metal thermal transfer fluid;

motivating flow of the liquid metal thermal transfer fluid away from and back to the high power density device in a closed cycle fluid pathway; and

transferring heat from the liquid metal thermal transfer fluid flow to a heat pipe.

17. The method of claim 16, further comprising:

as part of the motivated flow of liquid metal thermal transfer fluid away from and back to the high power density device, transporting the liquid metal thermal transfer fluid through a flexible conduit portion of the closed cycle fluid pathway.

19. The system of claim 17, further comprising:

increasing and decreasing bend of the bend traversing portion of the closed cycle fluid pathway during the flow of liquid metal thermal transfer fluid.

18. The method of claim i 6, further comprising:

as part of the motivated flow of liquid metal thermal transfer fluid away from and back to the high power density device, transporting the liquid metal thermal transfer fluid through a bend traversing portion of the closed cycle fluid pathway.

20. The system of claim 18,

wherein the bend traversing portion of the closed cycle fluid pathway includes a flexible conduit portion.

21. The system of claim 18,

wherein the bend traversing portion of the closed cycle fluid pathway includes a hinge that defines an integrated conduit therethrough.

22. A method for dissipating heat from a high power density device, the method comprising:

transferring heat from the high power density device to a liquid metal thermal transfer fluid;

motivating flow of the liquid metal thermal transfer fluid away from and back to the high power density device in a closed cycle fluid pathway that traverses a bend in a folding device.

23. The method of claim 22, further comprising:

wherein the bend traversing portion of the closed cycle fluid pathway includes a flexible conduit portion.

24. The method of claim 22, further comprising:

wherein the bend traversing portion of the closed cycle fluid pathway includes a hinge that defines an integrated conduit therethrough.

25. The method of claim 22, further comprising:

increasing and decreasing the bend during the flow of liquid metal thermal transfer fluid.

26. The method of claim 22, further comprising:

transferring heat from the liquid metal thermal transfer fluid flow to a heat pipe.