Thermally and Electrically Conductive Apparatus

• US 20080239675A1
• Filed: 01/05/2006
• Published: 10/02/2008
• Est. Priority Date: 01/05/2005
• Status: Active Grant

• Current Assignee: Signify Holding B.V. (Signify N.V.)
• Original Assignee: TIR Systems Limited (Koninklijke Philips N.V.)
• Inventors: Speier, Ingo
• Granted Patent: US 9,111,822 B2
• Time in Patent Office: Days
• US Class Current: 361/712
• CPC Class Codes: F21V 29/71 using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements
• CPC Class Codes: F21V 3/10 characterised by coatings
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 23/13 characterised by the shape
• CPC Class Codes: H01L 23/142 Metallic substrates having insulating layers
• CPC Class Codes: H01L 23/367 Cooling facilitated by shape of device H01L23/38, H01L23/40, H01L23/42, H01L23/44, H01L23/46 take precedence
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/12044 OLED
• CPC Class Codes: H01L 33/647 the elements conducting electric current to or from the semiconductor body
• CPC Class Codes: H05K 1/0272 Adaptations for fluid transport, e.g. channels, holes

Abstract

The present invention provides a thermally and electrically conductive apparatus that can provide both thermal conductivity and electrical conductivity for one or more electronic devices connected thereto. The apparatus comprises a thermally conductive element that is in thermal contact with one or more electronic devices and optionally in contact with a heat dissipation system. A portion of the thermally conductive element is surrounded by a multilayer coating system comprising two or more layers. The multilayer coating system includes alternating electrically insulating and electrically conductive layers in order to provide paths for the supply of electric current to the one or more electronic devices. A conductive layer of the multilayer coating system may be selectively patterned to connect to one or more electronic devices. In this manner, the combination of an electronic circuit carrier and a thermally conductive element can unify thermal conductivity with the provision of power and/or communication into a single integrated unit for use with electronic devices.

Claims

1. A thermally and electrically conductive apparatus to which one or more electronic devices can be operatively connected, the apparatus comprising:

a) a thermally conductive element in thermal contact with the one or more electronic devices; and

b) a multilayer coating system including two or more layers, said two or more layers being a sequence of electrically insulating and electrically conductive layers integrally formed on a portion of the thermally conductive element, said electrically conductive layers providing one or more paths for supplying electric current to the one or more electronic devices.

2. The thermally and electrically conductive apparatus according to claim 1, wherein one or more of the layers of the multilayer coating system include circuit traces for connection of the one or more electronic devices thereto, thereby providing a means for controlling the one or more electronic devices individually or in one or more groups of electronic devices.

3. The thermally and electrically conductive apparatus according to claim 1, wherein the thermally conductive element is electrically conductive, and thereby capable of providing a path for supplying electric current to the one or more electronic devices.

4. The thermally and electrically conductive apparatus according to claim 1, wherein one or more of the two or more layers of the multilayer coating system are formed by deposition.

5. The thermally and electrically conductive apparatus according to claim 1, wherein the apparatus is coupled to a support structure comprising a circuit carrier.

6. The thermally and electrically conductive apparatus according to claim 5, wherein the multilayer coating system is configured to matingly connect with the circuit carrier, thereby providing one or more electrical connections between the support structure and the thermally and electrically conductive apparatus.

7. The thermally and electrically conductive apparatus according to claim 6, wherein the thermally and electrically conductive apparatus is permanently connected to the support structure.

8. The thermally and electrically conductive apparatus according to claim 6, wherein the thermally and electrically conductive apparatus is removably connected to the support structure.

9. The thermally and electrically conductive apparatus according to claim 5, wherein the thermally and electrically conductive apparatus is embedded within the support structure.

10. The thermally and electrically conductive apparatus according to claim 5, wherein the support structure includes a heat dissipation system.

11. The thermally and electrically conductive apparatus according to claim 1, wherein the multilayer coating system is formed on an end of the thermally conductive element.

12. The thermally and electrically conductive apparatus according to claim 1, wherein the multilayer coating system is formed on a side of the thermally conductive element.

13. The thermally and electrically conductive apparatus according to claim 1, wherein the multilayer coating system sheaths at least a portion of the thermally conductive element.

14. The thermally and electrically conductive apparatus according to claim 1, wherein the thermally conductive element is a passive thermal device selected from the group comprising heat pipe, thermosyphon, microchannel cooler and macrochannel cooler.

15. The thermally and electrically conductive apparatus according to claim 1, wherein the thermally conductive element is an active thermal device selected from the group comprising thermoelectric cooler, thermionic cooler and forced convection cooler.

16. The thermally and electrically conductive apparatus according to claim 1, wherein the thermally conductive element has a shape selected from the group comprising pin, planar element, curved element, cylinder, paraboloid and ellipsoid.

17. The thermally and electrically conductive apparatus according to claim 1, wherein the thermally conductive element has a cross sectional shape selected from the group comprising circular, parabolic, elliptical, prismatic and rectangular.

18. The thermally and electrically conductive apparatus according to claim 1, wherein the thermally conductive element has a curvilinear shape.