System for creating an inspection recipe, system for reviewing defects, method for creating an inspection recipe and method for reviewing defects

• US 20080240544A1
• Filed: 04/14/2008
• Published: 10/02/2008
• Est. Priority Date: 03/14/2003
• Status: Abandoned Application

• Current Assignee: Kabushiki Kaisha Toshiba (Toshiba Corporation)
• Original Assignee: Kabushiki Kaisha Toshiba (Toshiba Corporation)
• Inventors: Sato, Yoshiyuki
• Application Number:
  US12/081,287
• Publication Number:
  US 20080240544A1
• Time in Patent Office: Days
• US Class Current: 382/145
• CPC Class Codes: G01R 31/2831 Testing of materials or semi-finished products, e.g. semiconductor wafers or substrates G01R31/318511 takes precedence; testing during manufacture H01L22/00

Abstract

A system for creating an inspection recipe, includes an inspection target selection module selecting an inspection target; a critical area extraction module extracting corresponding critical areas for defect sizes in the inspection target; a defect density prediction module extracting corresponding defect densities predicted by defects to be detected in the inspection target for the defect sizes; a killer defect calculation module calculating corresponding numbers of killer defects in the defect sizes based on the critical areas and the defect densities; and a detection expectation calculation module calculating another numbers of the killer defects expected to be detected for prospective inspection recipes determining rates of defect detection for the defect sizes, based on the numbers of the killer defects and the rates of defect detection prescribed in the prospective inspection recipes.

Claims

1-20. -20. (canceled)

21. A system for creating an inspection recipe of a defect inspection apparatus, comprising:

an inspection target selection module configured to select an inspection target;

a critical area extraction module configured to extract corresponding critical areas for a plurality of defect sizes in the inspection target, respectively, each of the critical areas indicating probability where a failure occurs due to a presence of a defect, an extent of each of the critical areas depending on a layout pattern of the inspection target and each of the defect sizes;

a defect density prediction module configured to extract corresponding defect densities for the defect sizes, respectively, the defect densities being predicted by defects to be detected in the inspection target, respectively;

a killer defect calculation module configured to calculate corresponding numbers of killer defects for the defect sizes, respectively, based on the critical areas and the defect densities;

a detection expectation calculation module configured to calculate respectively another numbers of the killer defects expected to be detected for a plurality of prospective inspection recipes which determine rates of defect detection for the defect sizes, based on the numbers of the killer defects and the rates of defect detection prescribed in the prospective inspection recipes, each of the rates of defect detection determined by a sensitivity parameter of the defect inspection apparatus, the prospective inspection recipes having profiles of the rates of defect detection different from one another; and

an optimum inspection recipe determination module configured to obtain an optimum prospective inspection recipe from among the prospective inspection recipes by determining the largest another number of the killer defects expected to be detected from among the another numbers of the killer defects.

22. The system of claim 21, further comprising:

a critical area storage unit configured to store the critical areas;

a predicted defect density storage unit configured to store the defect densities; and

an prospective inspection recipe storage unit configured to store the prospective inspection recipes.

23. The system of claim 21, wherein the inspection target selection module designates a type of product, a manufacturing process of the product and a region in the product.

24. The system of claim 21, wherein the calculation of the numbers of the killer defects is an integral of products of the critical areas and the defect densities with the defect sizes, respectively.

25. A computer implemented method for creating an inspection recipe of a defect inspection apparatus, comprising:

selecting an inspection target;

obtaining corresponding critical areas for a plurality of defect sizes in the inspection target, respectively, each of the critical areas indicating probability where a failure occurs due to a presence of a defect, an extent of each of the critical areas depending on a layout pattern of the inspection target and each of the defect sizes;

obtaining corresponding defect densities for the defect sizes, respectively, the defect densities being predicted by defects to be detected in the inspection target, respectively;

calculating corresponding numbers of killer defects for the defect sizes, respectively, based on the critical areas and the defect densities;

calculating respectively another numbers of the killer defects expected to be detected for a plurality of prospective inspection recipes which determine rates of defect detection for the defect sizes, based on the numbers of killer defects and the rates of defect detection prescribed in the prospective inspection recipes, each of the rates of defect detection determined by a sensitivity parameter of the defect inspection apparatus, the prospective inspection recipes having profiles of the rates of defect detection different from one another; and

obtaining an optimum prospective inspection recipe from among the prospective inspection recipes by determining the largest another number of the killer defects expected to be detected from among the another numbers of the killer defects.

26. The method of claim 25, wherein the inspection target includes a type of product, a manufacturing process of the product and a region in the product.

27. The method of claim 25, wherein the numbers of the killer defects are calculated by integrals of products of the critical areas and the defect densities with the defect sizes, respectively.