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ATOMIC LAYER DEPOSITION REACTOR

  • US 20080241387A1
  • Filed: 03/29/2007
  • Published: 10/02/2008
  • Est. Priority Date: 03/29/2007
  • Status: Abandoned Application
First Claim
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1. A method for depositing a layer on a substrate positioned within a reaction chamber comprising the steps of:

  • (a) providing a first non-radical reactant to a reaction space through a showerhead plate;

    (b) removing excess first non-radical reactant from the reaction space;

    (c) providing a second radical reactant to the reaction space from a remote radical generator such that the second radical reactant does not go through the showerhead plate; and

    (d) removing excess second radical reactant from the reaction space through an exhaust outlet.

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