SELECTIVE ALUMINUM DOPING OF COPPER INTERCONNECTS AND STRUCTURES FORMED THEREBY

• US 20080241575A1
• Filed: 03/28/2007
• Published: 10/02/2008
• Est. Priority Date: 03/28/2007
• Status: Abandoned Application

• Current Assignee: Adrein R. Lavoie, Arnel M. Fajardo, John Plombon, Kari Harkonen, Valery Dubin
• Original Assignee: Adrein R. Lavoie, Arnel M. Fajardo, John Plombon, Kari Harkonen, Valery Dubin
• Inventors: Fajardo, Arnel M., Harkonen, Kari, Plombon, John, Dubin, Valery, Lavoie, Adrein R.
• Application Number:
  US11/692,330
• Publication Number:
  US 20080241575A1
• Time in Patent Office: Days
• US Class Current: 428/620
• CPC Class Codes: H01L 21/28562 Selective deposition
• CPC Class Codes: H01L 21/76834 formation of thin insulating films on the sidewalls or on top of conductors H01L21/76831 takes precedence
• CPC Class Codes: H01L 21/76849 the layer being positioned on top of the main fill metal
• CPC Class Codes: H01L 21/7685 the layer covering a conductive structure H01L21/76849 takes precedence
• CPC Class Codes: H01L 21/76883 Post-treatment or after-treatment of the conductive material
• CPC Class Codes: H01L 21/76897 Formation of self-aligned vias or contact plugs, i.e. involving a lithographically uncritical step self-aligned silicidation on field effect transistors H01L29/665
• CPC Class Codes: H01L 29/78 with field effect produced by an insulated gate H01L29/7725, H01L29/775, H01L29/778 take precedence
• CPC Class Codes: Y10T 428/12528 Semiconductor component

Abstract

Methods and associated structures of forming a microelectronic device are described. Those methods may include heating a substrate comprising a patterned metallic region to about 145 C or below in a reaction space, introducing an aluminum co-reactant into the reaction space, wherein an aluminum material is formed on the patterned metallic region, but not on non-metallic regions.

Claims

1. A method comprising:

heating a substrate comprising a patterned metallic structure to about 145 C or below in a reaction space;

introducing an aluminum co-reactant into the reaction space, wherein an aluminum material is formed on the patterned metallic structure, but not on non-metallic regions.

2. The method of claim 1 further comprising wherein the patterned metallic structure comprises at least one of copper, copper alloy, copper oxide, copper nitride, nickel, cobalt, tungsten, molybdenum, ruthenium, osmium, rhodium, iridium, palladium, platinum, gold and silver.

3. The method of claim 1 further comprising wherein the aluminum co-reactant comprises at least one aluminum-hydrogen bond, and wherein the aluminum co-reactant comprises at least one of di-(i-butyl) aluminum hydride (DIBAH), methylpyrrolidine alane (MPA), Aluminum s-butoxide, Trimethylaluminum (AlMe₃ or TMA), Triethylaluminum (AlEt₃ or TEA), Di-i-butylaluminum chloride, Di-i-butylaluminum hydride, Diethylaluminum chloride, Tri-i-butylaluminum, and Triethyl(tri-sec-butoxy)dialuminum.

4. The method of claim 1 further comprising annealing the substrate prior to cooling at a temperature of about 140 to about 300 degrees Celsius, and wherein annealing is operated at a reduced pressure with inert gas and wherein additional forming gas is used.

5. The method of claim 1 wherein an aluminum material is formed on the patterned metallic substrate, but not on non-metallic regions comprises wherein an aluminum material is formed on the patterned metallic structure, but not on dielectric regions.

6. The method of claim 1 further comprising wherein the patterned metallic structure comprises a portion of a copper gate structure and further comprising:

oxidizing the aluminum material to form an aluminum oxide cap;

forming a dielectric layer on the aluminum cap; and

etching a gate contact opening and a source/drain contact opening in the dielectric layer.

7. The method of claim 6 further comprising wherein the aluminum material is not disposed on a sidewall of the copper gate structure.

8. The method of claim 1 wherein the aluminum material is formed by at least one of CVD, MOCVD and ALD.

9. A structure comprising:

a substrate comprising a patterned metallic region, wherein an aluminum material is disposed on at least one of a top surface and a bottom surface of the patterned metallic region, but is not disposed on a sidewall region of the patterned metallic region.

10. The structure of claim 9 wherein the patterned metal region comprises at least one of copper, copper alloy, copper oxide, copper nitride, nickel, cobalt, tungsten, molybdenum, ruthenium, osmium, rhodium, iridium, palladium, platinum, gold and silver.

11. The structure of claim 9 wherein the aluminum material comprises a copper percentage of about 0 to about 50 percent and an aluminum concentration of about 50 to about 100 percent.

12. The structure of claim 9 wherein the patterned metallic region comprises a copper interconnect structure, and the aluminum material is disposed on at least one of a top surface and a bottom surface of the copper interconnect structure.

13. The structure of claim 9 wherein the patterned metallic region comprises a portion of a copper gate contact, and the aluminum material comprises an aluminum oxide.

15. The structure of claim 9 wherein the resistivity comprises below about 30 micro-Ohm-cm.

14. The structure of claim 14 wherein the aluminum oxide comprises an etch stop layer.