METHOD FOR MANUFACTURING SEMICONDCUTOR SENSOR
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Abstract
A semiconductor sensor is disclosed that includes a substrate including at least a semiconductor layer. The substrate includes a weight arranging part in the vicinity of the center of the substrate, a flexible part around the weight arranging part, and supporting parts provided around the flexible part. The semiconductor sensor further includes a weight arranged on the weight arranging part. The weight is made of a material different from that of the weight arranging part and the flexible parts.
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Citations
24 Claims
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1-11. -11. (canceled)
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12. A method of manufacturing a semiconductor sensor, comprising the steps of:
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removing a predetermined portion of a semiconductor substrate selectively except for at least a region where a supporting part is to be formed so as to form a weight arranging part and a flexible part; and forming a weight on a surface of the semiconductor substrate at the weight arranging part. - View Dependent Claims (13, 14, 15, 16, 17, 18, 21, 22, 23, 24)
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Specification