Method of assembling chips
First Claim
Patent Images
1. A method for fabricating a chip package, comprising:
- providing a copper pillar on a chip and a gold-containing layer over said copper pillar, wherein said gold-containing layer has a thickness less than a thickness of said copper pillar;
screen printing a tin-containing layer on a substrate; and
joining said gold-containing layer with said tin-containing layer using a process comprising a reflow process.
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Abstract
A method of assembling chips. A first chip and a second chip are provided. At least one conductive pillar is formed on the first chip, and a conductive connecting material is formed on the conductive pillar. The second chip also comprises at least one conductive pillar. The first chip is connected to the second chip via the conductive pillars and the conductive connecting material.
11 Citations
20 Claims
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1. A method for fabricating a chip package, comprising:
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providing a copper pillar on a chip and a gold-containing layer over said copper pillar, wherein said gold-containing layer has a thickness less than a thickness of said copper pillar; screen printing a tin-containing layer on a substrate; and joining said gold-containing layer with said tin-containing layer using a process comprising a reflow process. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. A method for fabricating a chip package, comprising:
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providing a copper pillar on a chip and a first tin-containing layer over said copper pillar, wherein said first tin-containing layer has a thickness less than a thickness of said copper pillar; screen printing a second tin-containing layer on a substrate; and joining said first tin-containing layer with said second tin-containing layer using a process comprising a reflow process. - View Dependent Claims (9, 10, 11, 12, 13, 14, 15)
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16. A method for fabricating a chip package, comprising:
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providing a copper pillar on a chip and a gold-containing layer over said copper pillar, wherein said gold-containing layer has a thickness less than a thickness of said copper pillar; providing a substrate with a tin-containing layer; and joining said gold-containing layer with said tin-containing layer. - View Dependent Claims (17, 18, 19, 20)
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Specification