METHOD FOR CLEANING ELEMENTS IN VACUUM CHAMBER AND APPARATUS FOR PROCESSING SUBSTRATES
First Claim
1. An element cleaning method which causes particles sticking to an element in a vacuum chamber to scatter, whereinby applying a voltage to said element, the particles sticking to said element are caused to scatter in accordance with a permittivity difference between said element and said particles.
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Abstract
To clean an element in a vacuum chamber by causing particles sticking to the element to scatter, the present invention uses a means for applying a voltage to the element and causing the particles to scatter by utilizing Maxwell'"'"'s stress, a means for electrically charging the particles and causing the particles to scatter by utilizing the Coulomb force, a means for introducing a gas into the vacuum chamber and causing the particles sticking to the element to scatter by causing a gas shock wave to hit the element, a means for heating the element and causing the particles to scatter by utilizing the thermal stress and thermophoretic force, or a means for causing the particles to scatter by applying mechanical vibrations to the element. The thus scattered particles are removed by carrying them in a gas flow in a relatively high pressure atmosphere.
15 Citations
5 Claims
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1. An element cleaning method which causes particles sticking to an element in a vacuum chamber to scatter, wherein
by applying a voltage to said element, the particles sticking to said element are caused to scatter in accordance with a permittivity difference between said element and said particles.
Specification