VARIABLE DEVICE CIRCUIT AND METHOD FOR MANUFACTURING THE SAME
First Claim
1. A variable device circuit comprising:
- a substrate;
at least one movable switch device formed on a first principal surface of the substrate;
at least one fixed capacitor device formed on the first principal surface of the substrate;
at least one variable capacitor device formed on the first principal surface of the substrate;
at least one variable inductor device formed on the first principal surface of the substrate; and
wiring lines for electrically connecting the devices to one another, the wiring lines being formed on the first principal surface of the substrate;
wherein electrical connections among the devices can be selected by operation of the movable switch device.
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Accused Products
Abstract
There is provided a variable device circuit according to the present invention, including: a substrate; at least one movable switch device formed on a first principal surface of the substrate; at least one fixed capacitor device formed on the first principal surface of the substrate; at least one variable capacitor device formed on the first principal surface of the substrate; at least one variable inductor device formed on the first principal surface of the substrate; and wiring lines for electrically connecting the devices to one another, the wiring lines being formed on the first principal surface of the substrate; wherein electrical connections among the devices can be selected by operation of the movable switch device, whereby achieving stable, low-loss circuit characteristics with lower manufacturing cost.
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Citations
20 Claims
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1. A variable device circuit comprising:
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a substrate; at least one movable switch device formed on a first principal surface of the substrate; at least one fixed capacitor device formed on the first principal surface of the substrate; at least one variable capacitor device formed on the first principal surface of the substrate; at least one variable inductor device formed on the first principal surface of the substrate; and wiring lines for electrically connecting the devices to one another, the wiring lines being formed on the first principal surface of the substrate; wherein electrical connections among the devices can be selected by operation of the movable switch device. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. A method for manufacturing a variable device circuit, including steps of:
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forming a first conductive layer with a predetermined pattern on a first principal surface of a substrate; forming a dielectric layer with a predetermined pattern on the first principal surface of the substrate and the first conductive layer; forming a sacrificial layer with a predetermined pattern, which is thicker than the dielectric layer, on the first principal surface of the substrate, the first conductive layer and the dielectric layer; forming a second conductive layer with a predetermined pattern on the first principal surface of the substrate, the first conductive layer, the dielectric layer and the sacrificial layer; and forming an air layer between the first conductive layer and the second conductive layer by removing the sacrificial layer; wherein at least two out of a movable switch device, a fixed capacitor device, a variable capacitor device and a variable inductor device are formed concurrently. - View Dependent Claims (12, 13, 14, 15, 16, 17, 18, 19, 20)
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Specification