Cooling System For Electronic Devices, In Particular, Computers

• US 20080247137A1
• Filed: 03/07/2006
• Published: 10/09/2008
• Est. Priority Date: 03/07/2005
• Status: Active Grant

• Current Assignee: Asetek Incorporated (Asetek Holdings Incorporated)
• Original Assignee: Asetek Incorporated (Asetek Holdings Incorporated)
• Inventors: Dautert, Thomas, Gunther, Eberhard
• Granted Patent: US 7,926,553 B2
• Time in Patent Office: Days
• US Class Current: 361/703
• CPC Class Codes: F28D 15/0266 with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers F28D15/043 takes precedence
• CPC Class Codes: G06F 1/20 Cooling means

Abstract

The invention concerns a cooling system for electronic devices, especially computers, comprising an evaporator (1), a vapor-distribution and condensate-collection element (3) and a condenser (2) with a plurality of condenser pipes (6) and a block of fins (5) connecting the condenser pipes (6), wherein the condenser pipes (6) are arranged parallel to each other and extend upwards from the vapor-distribution and condensate-collection element (3) and are closed at their upper ends.

Claims

1-10. -10. (canceled)

11. A cooling system for electronic devices, especially computers, comprising an evaporator (1), a vapor-distribution and condensate-collection element (3) and a condenser (2) with a plurality of condenser pipes (6) and a block of fins (5) connecting the condenser pipes (6), wherein the condenser pipes (6) are arranged parallel to each other and extend upwards from the vapor-distribution and condensate-collection element (3) and are closed at their top ends.

12. The cooling system according to claim 11, wherein the vapor-distribution and condensate-collection element (3) is designed as a horizontal pipe (3.1), into which the condenser pipes (6) are fitted radially along a surface line of the horizontal pipe (3.1).

13. The cooling system according to claim 11, wherein a connecting pipe (4) is fitted between the evaporator (1) and the vapor-distribution and condensate-collection element (3).

14. The cooling system according to claim 11, wherein a plurality of evaporators (1) is fitted and connected with the vapor-distribution and condensate-collection element (3).

15. The cooling system according to claim 14, wherein the pipe without heat pipe structure (8) is connected into the vapor-distribution and condensate-collection element (3.1) at a height (H) of 0.5 to 1 times the diameter (D) of the pipe with the heat pipe structure (7).

16. The cooling system according to claim 11, wherein the connecting pipe (4) is designed as a pipe with heat pipe structure (7) where the condenser (2) is arranged below the evaporator (1) and by the pipe with heat pipe structure (7) being connected into the vapor-distribution and condensate-collection element (3.1) with an insertion length (L) of one third to two thirds of the length of the tubular vapor-distribution and condensate-collection element (3.1).

17. The cooling system according to claim 16, wherein the pipe without heat pipe structure (8) is connected into the vapor-distribution and condensate-collection element (3.1) at a height (H) of 0.5 to 1 times the diameter (D) of the pipe with the heat pipe structure (7).

18. The cooling system according to claim 11, wherein the connecting pipe (4) is designed as a pipe without heat pipe structure (8) where the condenser (2) is arranged above the evaporator (1).

19. The cooling system according to claim 18, wherein the pipe without heat pipe structure (8) is connected into the vapor-distribution and condensate-collection element (3.1) at a height (H) of 0.5 to 1 times the diameter (D) of the pipe with the heat pipe structure (7).

20. The cooling system according to claim 11, wherein the level vapor-distribution and condensate-collection element (3.2) and evaporator (1) are designed as one integral unit.

21. The cooling system according to claim 20, wherein the vapor-distribution and condensate-collection element (3.2) has a level design and the condenser pipes (6) are fitted orthogonally to this level.

22. The cooling system according to claim 18, wherein the vapor-distribution and condensate-collection element (3.3) is designed as one assembly unit and has a longitudinal stay (11).

23. The cooling system according to claim 22, wherein the vapor-distribution and condensate-collection element (3.2) has a level design and the condenser pipes (6) are fitted orthogonally to this level.