ELECTRICAL CIRCUIT ASSEMBLY FOR HIGH-POWER ELECTRONICS

• US 20080247139A1
• Filed: 10/09/2007
• Published: 10/09/2008
• Est. Priority Date: 10/10/2006
• Status: Active Grant

• Current Assignee: Deere & Company
• Original Assignee: Deere & Company
• Inventors: Hopman, Jeffrey Gerald, Alves, John Lopes, Springer, James Arthur, Karna, Kartheek, Godbold, Clement Vanden, Stahlhut, Ronnie D., Alves, Lise
• Granted Patent: US 7,903,417 B2
• Time in Patent Office: Days
• US Class Current: 361/709
• CPC Class Codes: H05K 1/0203 Cooling of mounted components H05K1/0272 takes precedence
• CPC Class Codes: H05K 1/0206 by printed thermal vias
• CPC Class Codes: H05K 1/0393 Flexible materials H05K1/038 takes precedence; specific organic compositions are classified in H05K1/0313 and subgroups
• CPC Class Codes: H05K 1/189 characterised by the use of a flexible or folded printed circuit H05K3/326 takes precedence
• CPC Class Codes: H05K 2201/0209 Inorganic, non-metallic particles
• CPC Class Codes: H05K 2201/09909 Special local insulating pattern, e.g. as dam around component
• CPC Class Codes: H05K 2201/10166 Transistor
• CPC Class Codes: H05K 2201/10189 Non-printed connector
• CPC Class Codes: H05K 3/0061 onto a metallic substrate, e.g. a heat sink heat sinks for electric apparatus H05K7/20
• CPC Class Codes: H05K 3/3452 Solder masks
• CPC Class Codes: H05K 3/386 by the use of an organic polymeric bonding layer, e.g. adhesive
• CPC Class Codes: H05K 7/209 Heat transfer by conduction from internal heat source to heat radiating structure H05K7/20909 takes precedence
• CPC Class Codes: Y10T 29/49124 On flat or curved insulated base, e.g., printed circuit, etc.

Abstract

An electrical circuit assembly includes an electrical circuit substrate having a first side; a heat sink including a metal base plate having a first side and a second side, and a plurality of fins extending from the second side; and a thermally conductive and electrically insulating adhesive directly interconnecting at least a portion of the first side of the electrical circuit substrate with the first side of the base plate.

Claims

1. An electrical circuit assembly, comprising:

an electrical circuit substrate including a first side;

a heat sink including a metal base plate having a first side and a second side, and a plurality of fins extending from said second side; and

a thermally conductive and electrically insulating adhesive directly interconnecting at least a portion of said first side of said electrical circuit substrate with said first side of said base plate.

2. The electrical circuit assembly of claim 1, wherein said electrical circuit substrate includes a second side, and further including a plurality of electrical components mounted to said second side.

3. The electrical circuit assembly of claim 2, wherein said electrical circuit substrate includes a plurality of copper traces on at least one side of said substrate.

4. The electrical circuit assembly of claim 3, further including a plurality of solder dams, each said solder dam extending across a corresponding one of said copper traces.

5. The electrical circuit assembly of claim 1, wherein said electrical circuit substrate includes at least one thermal via extending from said first side to said second side, each said thermal via comprising a plated hole associated with one of said electrical components.

6. The electrical circuit assembly of claim 1, wherein said heat sink is an aluminum heat sink of monolithic construction.

7. The electrical circuit assembly of claim 1, wherein said adhesive comprises a pressure sensitive adhesive.

8. The electrical circuit assembly of claim 1, wherein said electrical circuit substrate has an absence of a solder mask on said first side, thereby enhancing thermal conductivity to said adhesive.

23. The electrical circuit assembly of claim 1, wherein said adhesive comprises a prepreg material.

9. An electronic control module, comprising;

a housing;

a control board within said housing; and

an electrical circuit assembly mounted to said housing, said electrical circuit assembly including;

a electrical circuit substrate connected with said control board, said electrical circuit substrate including a first side;

a heat sink including a metal base plate having a first side and a second side, and a plurality of fins extending from said second side; and

a thermally conductive and electrically insulating adhesive directly interconnecting at least a portion of said first side of said electrical circuit substrate with said first side of said base plate.

10. The electronic control module of claim 9, wherein said electrical circuit substrate includes a second side, and further including a plurality of electrical components mounted to said second side.

11. The electronic control module of claim 10, wherein said electrical circuit substrate includes a plurality of copper traces on at least one side of said substrate.

12. The electronic control module of claim 11, further including a plurality of solder dams, each said solder dam extending across a corresponding one of said copper traces.

13. The electronic control module of claim 10, wherein said electrical circuit substrate includes at least one thermal via extending from said first side to said second side, each said thermal via comprising a plated hole associated with one of said electrical components.

14. The electronic control module of claim 9, wherein said heat sink is an aluminum heat sink of monolithic construction.

15. The electronic control module of claim 9, wherein said adhesive comprises a pressure sensitive adhesive.

16. The electronic control module of claim 9, wherein said electrical circuit substrate has an absence of a solder mask on said first side, thereby enhancing thermal conductivity to said adhesive.

24. The electronic control module of claim 9, wherein said adhesive comprises a prepreg material.

17. An electrical circuit assembly, comprising:

an electrical circuit including a substrate carrying a plurality of electrical components, said electrical circuit having a first side;

a heat sink including a metal base plate having a first side and a second side, and a plurality of fins extending from said second side; and

a thermally conductive and electrically insulating adhesive directly interconnecting at least a portion of said first side of said electrical circuit with said first side of said base plate.

18. The electrical circuit assembly of claim 17, wherein said electrical circuit comprises an electrical circuit substrate having a plurality of copper traces on at least one side of said substrate.

19. The electrical circuit assembly of claim 18, further including a plurality of solder dams, each said solder dam extending across a corresponding one of said copper traces.

20. A method of manufacturing an electrical circuit assembly, comprising the steps of:

providing an electrical circuit substrate including a first side;

providing a heat sink including a metal base plate having a first side and a second side, and a plurality of fins extending from said second side; and

adhesively bonding at least a portion of said first side of said electrical circuit substrate directly with said first side of said base plate using a thermally conductive and electrically insulating adhesive.

21. The method of manufacturing an electrical circuit assembly of claim 20, wherein said adhesively bonding step is carried out using a pressure sensitive adhesive.

22. The method of manufacturing an electrical circuit assembly of claim 20, wherein said electrical circuit substrate includes a plurality of copper traces on at least one side of said substrate, and further including the step of applying a plurality of solder dams to said electrical circuit substrate, each said solder dam extending across a corresponding one of said copper traces.

25. The method of manufacturing an electrical circuit assembly of claim 20, wherein said adhesively bonding step is carried out using a prepreg material.