METHOD OF MANUFACTURING LAMINATED MATERIAL FOR SECURITY TAG

• US 20080248266A1
• Filed: 06/11/2008
• Published: 10/09/2008
• Est. Priority Date: 03/31/2004
• Status: Abandoned Application

• Current Assignee: CHECKPOINT SYSTEMS, INC. (CCL Industries Incorporated)
• Original Assignee: Checkpoint Manufacturing Japan Co., Ltd. (CCL Industries Incorporated)
• Inventors: Matsumoto, Takeshi, Yamada, Kazunori, Sasaki, Shogo, Ushino, Shun-ichi, Katagiri, Kaoru
• Application Number:
  US12/137,304
• Publication Number:
  US 20080248266A1
• Time in Patent Office: Days
• US Class Current: 428/209
• CPC Class Codes: B32B 15/08 of synthetic resin
• CPC Class Codes: B32B 15/18 comprising iron or steel B32B15/011, B32B15/012 and B32B15/013 take precedence
• CPC Class Codes: B32B 15/20 comprising aluminium or copper B32B15/016 and B32B15/017 take precedence
• CPC Class Codes: B32B 2457/08 PCBs, i.e. printed circuit boards
• CPC Class Codes: B32B 27/06 as the main or only constituent of a layer, which is next to another layer of the same or of a different material next to a layer of a particular substance B32B9/045; next to a bituminous or tarry layer B32B11/046; next to a water setting substance layer B32B13/12; next to a metal layer B32B15/08; next to a glass layer B32B17/10; next to a layer formed of natural mineral fibres or particles B32B19/045; next to a wood layer B32B21/08; next to a cellulosic plastic layer B32B23/08; next to a natural or synthetic rubber layer B32B25/08
• CPC Class Codes: B32B 7/12 using interposed adhesives or interposed materials with bonding properties
• CPC Class Codes: H05K 1/0393 Flexible materials H05K1/038 takes precedence; specific organic compositions are classified in H05K1/0313 and subgroups
• CPC Class Codes: H05K 3/022 Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
• CPC Class Codes: H05K 3/386 by the use of an organic polymeric bonding layer, e.g. adhesive
• CPC Class Codes: Y10T 428/24917 including metal layer
• CPC Class Codes: Y10T 428/31681 Next to polyester, polyamide or polyimide [e.g., alkyd, glue, or nylon, etc.]
• CPC Class Codes: Y10T 428/31692 Next to addition polymer from unsaturated monomers
• CPC Class Codes: Y10T 428/31786 Of polyester [e.g., alkyd, etc.]

Abstract

A laminated material suitable for fabricating miniaturized security tags which have the uniform resonance frequency, and security tags obtained by using the laminated material, are provided. A manufacturing method of a laminated material for security tags characterized in that metal foils are laminated on both sides of a previously formed synthetic resin film, and security tags obtained by using the laminated material by the manufacturing method, are provided. Because the lamination is performed on the previously formed resin film, the amount of variation in thickness of the resin film is small, and the thin resin film can be precisely manufactured. Further, because the oriented film has a relatively high strength even for a thin film, the laminated material is easy to be etched for forming a circuit. The security tag obtained by using a previously formed resin film can satisfy both uniformizing the resonance frequency and miniaturizing the security tag simultaneously, and has an excellent performance.

Claims

1-8. -8. (canceled)

9. A resonant tag resonating with a radio wave at a predetermined frequency, comprising:

a synthetic resin film;

a first circuit comprising a first metal foil including a coil portion and a plate portion, which comprises a first plate of a capacitor, formed on one side of said synthetic resin film;

a second circuit made of a second metal foil including a plate section which comprises a second plate of said capacitor, formed on the other side of said synthetic film; and

wherein said both circuits comprise an LC circuit by being electrically connected and wherein said metal foils and said synthetic resin film are laminated to each other by an olefin-based adhesive.

10. The resonant tag of claim 9 wherein said synthetic resin film comprises a polypropylene film.

11. The resonant tag of claim 10 wherein said polypropylene film comprises an oriented polypropylene film.

12. The resonant tag of claim 11 wherein the thickness of said oriented polypropylene film is approximately 25 μ

m or less.

13. The resonant tag of claim 9 wherein said first and second metal foils comprise aluminum.

14. The resonant tag of claim 9 wherein said first and second metal foils comprise silver.

15. The resonant tag of claim 9 wherein said first and second metal foils comprise copper.

16. A method for producing a resonant tag that resonates with a radio wave at a predetermined frequency, comprising:

providing a synthetic resin film;

applying a first adhesive to one side of said synthetic resin film;

applying a first metal foil to said first adhesive;

applying a second adhesive to the other side of said synthetic resin film;

applying a second metal foil to said second adhesive to form a laminate;

feeding said laminate to an etching process to remove portions of said first and second foils to form an LC circuit; and

wherein said first and second adhesives comprise an olefin-based adhesive.

17. The resonant tag of claim 16 wherein said synthetic resin film comprises a polypropylene film.

18. The method of claim 17 wherein said polypropylene film comprises an oriented polypropylene film.

19. The resonant tag of claim 18 wherein the thickness of said oriented polypropylene film is approximately 25 μ

m or less.

20. The method of claim 16 wherein said first and second metal foils comprise aluminum.

21. The resonant tag of claim 16 wherein said first and second metal foils comprise silver.

22. The resonant tag of claim 16 wherein said first and second metal foils comprise copper.

23. A method for producing a resonant tag that resonates with a radio wave at a predetermined frequency, comprising:

providing a synthetic resin film;

applying a first adhesive to one side of a first metal foil;

applying a second adhesive to one side of a second metal foil;

applying said first metal foil with said first adhesive and said second metal foil with said second adhesive to respective sides of a synthetic resin film to form a laminate;

feeding said laminate to an etching process to remove portions of said first and second foils to form an LC circuit; and

wherein said first and second adhesives comprise an olefin-based adhesive.