Synthetic Resin Card and Method for Producing the Same

• US 20080248332A1
• Filed: 06/09/2008
• Published: 10/09/2008
• Est. Priority Date: 06/24/2003
• Status: Abandoned Application

• Current Assignee: Sony Corporation (Sony Group Corp.)
• Original Assignee: Sony Corporation (Sony Group Corp.)
• Inventors: Matsumura, Shinichi, Ohta, Eiji, Sudo, Miki
• Application Number:
  US12/135,737
• Publication Number:
  US 20080248332A1
• Time in Patent Office: Days
• US Class Current: 428/800
• CPC Class Codes: B32B 2250/05 5 or more layers
• CPC Class Codes: B32B 2250/244 All polymers belonging to those covered by group B32B27/36
• CPC Class Codes: B32B 2250/40 Symmetrical or sandwich layers, e.g. ABA, ABCBA, ABCCBA
• CPC Class Codes: B32B 2270/00 Resin or rubber layer containing a blend of at least two different polymers
• CPC Class Codes: B32B 2307/518 bi-axially
• CPC Class Codes: B32B 2307/746 Slipping, anti-blocking, low friction
• CPC Class Codes: B32B 2425/00 Cards, e.g. identity cards, credit cards
• CPC Class Codes: B32B 2519/02 RFID tags
• CPC Class Codes: B32B 27/08 of synthetic resin
• CPC Class Codes: B32B 27/36 comprising polyesters
• CPC Class Codes: B32B 27/365 comprising polycarbonates
• CPC Class Codes: B42D 25/00 Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof printing processes to produce identification or security features B41M3/14
• CPC Class Codes: Y10T 428/24942 including components having same physical characteristic in differing degree
• CPC Class Codes: Y10T 428/2495 Thickness [relative or absolute]
• CPC Class Codes: Y10T 428/24959 of adhesive layers
• CPC Class Codes: Y10T 428/24975 No layer or component greater than 5 mils thick
• CPC Class Codes: Y10T 428/269 including synthetic resin or polymer layer or component
• CPC Class Codes: Y10T 428/31504 Composite [nonstructural laminate]
• CPC Class Codes: Y10T 428/31786 Of polyester [e.g., alkyd, etc.]
• CPC Class Codes: Y10T 428/31797 Next to addition polymer from unsaturated monomers
• CPC Class Codes: Y10T 428/31855 : Of addition polymer from unsaturated monomers
• CPC Class Codes: Y10T 428/31935 : Ester, halide or nitrile of addition polymer
• CPC Class Codes: Y10T 428/31938 : Polymer of monoethylenically unsaturated hydrocarbon

Abstract

A synthetic resin card having a substantially planar core section and a first outer layer and a second outer layer laminated on front and back surfaces of the core section, respectively, the first outer layer and the second outer layer having molecular orientations, the difference Δ in the angle of orientation between the molecular orientations of the first and second outer layers is 20° or less, and at least one of the first and second outer layers is provided with a recording layer.

Claims

1. A synthetic resin card comprising:

a substantially planar core section; and

a first outer layer and a second outer layer laminated on front and back surfaces of the core section, respectively,

wherein,

the first outer layer and the second outer layer have molecular orientations,

the difference Δ

in the angle of orientation between the molecular orientations of the first and second outer layers is 20°

or less; and

at least one of the first and second outer layers is provided with a recording layer.

2. The synthetic resin card according to claim 1, wherein the thicknesses of the first and second outer layers are symmetrical with respect to the core section.

3. The synthetic resin card according to claim 1, wherein the first and second outer layers each have a thickness of 25 to 125 μ

m.

4. The synthetic resin card according to claim 1, wherein the first and second outer layers are each formed of a biaxially oriented film.

5. The synthetic resin card according to claim 4, wherein the biaxially oriented film is composed of an oriented PET material.

6. The synthetic resin card according to claim 1, wherein the core section comprises an electronic module sandwiched between a pair of core components.

7. The synthetic resin card according to claim 6, wherein the electronic module comprises an IC chip and an IC module connected to the IC chip.

8. The synthetic resin card according to claim 1, wherein the recording layer comprises a reversible thermosensitive material.

9. The synthetic resin card according to claim 1, wherein the core section is composed of a copolymer of terephthalic acid, cyclohexanedimethanol, and ethylene glycol, and polycarbonate, the compounding ratio of the copolymer being 70% or less.

10. The synthetic resin card according to claim 1, wherein the core section and the first and second outer layers are each composed of a halogen-free material.

11. A method for producing a synthetic resin card comprising:

laminating a first outer layer and a second outer layer on front and back surfaces of a substantially planar core section,

wherein,

the first and second outer layers are selected so that the difference Δ

in the angle of orientation between the molecular orientations of the first and second outer layers is 20°

or less,

the first and second outer layers are laminated so that the thicknesses of the first and second outer layers are symmetrical with respect to the core section, and

a recording layer is formed on at least one of the first outer layer and the second outer layer.