Deposited Microarchitectured Battery and Manufacturing Method

• US 20080248382A1
• Filed: 03/31/2008
• Published: 10/09/2008
• Est. Priority Date: 03/30/2007
• Status: Active Grant

• Current Assignee: Board of Regents of the University of Michigan (University of Michigan)
• Original Assignee: Board of Regents of the University of Michigan (University of Michigan)
• Inventors: Albano, Fabio, Sastry, Ann M.
• Granted Patent: US 8,231,998 B2
• Time in Patent Office: Days
• US Class Current: 429/129
• CPC Class Codes: H01M 10/0436 Small-sized flat cells or batteries for portable equipment
• CPC Class Codes: H01M 10/052 Li-accumulators
• CPC Class Codes: H01M 10/0525 Rocking-chair batteries, i.e. batteries with lithium insertion or intercalation in both electrodes; Lithium-ion batteries
• CPC Class Codes: H01M 4/13 Electrodes for accumulators with non-aqueous electrolyte, e.g. for lithium-accumulators; Processes of manufacture thereof
• CPC Class Codes: H01M 50/209 adapted for prismatic or rectangular cells H01M50/216 takes precedence
• CPC Class Codes: H01M 6/40 Printed batteries , e.g. thin film batteries
• CPC Class Codes: Y02E 60/10 Energy storage using batteries
• CPC Class Codes: Y02P 70/50 Manufacturing or production processes characterised by the final manufactured product

Abstract

A battery includes a first portion including a substrate having formed thereon a current collector and an anode electrode material. A second portion is formed on a substrate and includes a current collector and a cathode electrode material. The first portion is joined to the second portion and a separator is disposed between the first portion and the second portion as joined to separate the anode electrode material from the cathode electrode material. An electrolyte is placed in contact with the anode electrode material, the cathode electrode material and the separator.

Claims

1. A battery comprising:

a first portion including a substrate having formed thereon a thin-film current collector and a thin-film anode electrode material characterized by a highly porous microstructure and provided by a physical vapor deposition process;

a second portion including a substrate having formed thereon a thin-film current collector and a thin-film cathode electrode material characterized by a highly porous microstructure provided by a physical vapor deposition process; and

the first portion being coupled to the second portion and a separator placed between the first portion and the second portion to separate the anode electrode material from the cathode electrode material.

2. The battery of claim 1, wherein each of the thin-film anode electrode materials and the thin-film cathode electrode materials comprise highly porous microstructures.

3. The battery of claim 1, comprising an electrolyte in contact with the anode electrode material, the cathode electrode material and the separator.

4. The battery of claim 1, each substrate comprising a glass, the glass being etched or ablated to provide a cavity to receive the current collector and the anode or cathode electrode material, respectively.

5. The battery of claim 1, the glass comprising an oxide of silicon.

6. The battery of claim 1, the anode electrode material comprising a material selected from the group including:

zinc;

lithium metal (Li), graphite (C), meso carbon micro beads (MCMB);

or other carbon intercalation compounds.

7. The battery of claim 1, the cathode electrode material comprising a material selected from the group including:

silver oxide;

lithium manganese oxide (LiMn₂O₄), lithium iron phosphate (LiFePO₄), LiNi_xCo_yAl_zO₂, and LiNi_xCo_yMn_zO₂.

8. The battery of claim 1, the electrolyte material comprising a material potassium hydroxide (KOH), diethyl carbonate (DEC), dimethyl carbonate (DMC), ethylene carbonate (EC), ethyl methyl carbonate (EMC), propylene carbonate (PC), or other electrolyte that conducts ions and is electrically neutral.

9. A MEMS system comprising a substrate into which or onto which a MEMS device is disposed and a microbattery deposited directly onto the substrate, device chip or chip carrier and electrically coupled to the MEMS device.

10. The MEMS system of claim 9, wherein the microbattery is formed directly onto a substrate, device chip or chip carrier of the MEMS device.

11. The MEMS device of claim 9, wherein the microarchitectured battery is bonded by an adhesive to the substrate.

12. The MEMS device of claim 9, wherein the adhesive is a polymer adhesive.

13. The MEMS device of claim 9, wherein a adhesive modifying coating is applied to at least one of the substrate and the micromachined battery.

14. The MEMS device of claim 9, wherein the adhesive modifying coating comprises a metallic, metal oxide or ceramic layer.

15. The MEMS device of claim 9, wherein the adhesive modifying coating comprises a gold layer or a plasma enhanced chemical vapor deposition (PECVD) silicon nitride film.

17. The microarchitectured battery of claim 9, wherein the first microarchitectured cell and any additional microarchitectured cells are formed on a common substrate.

18. The microarchitectured battery of claim 9, wherein the first microarchitectured battery cell and any additional microarchitectured cells are electrically coupled in series or in parallel.

16. A microarchitectured battery comprising a first microarchitectured cell coupled to one or more additional microarchitectured cell(s).

19. A method of making a battery comprising etching or ablating a first substrate to form a first cavity;

disposing within the first cavity a current collector material and an anode electrode material;

etching or ablating a portion of a second substrate to form a second cavity;

disposing within the second cavity a current collector material and a cathode electrode material;

providing a separator between the first substrate and the second substrate separating the anode material from the cathode material.

20. The method of claim 19, comprising providing an electrolyte in contact with the anode electrode material, the cathode electrode material and the separator.

21. The method of claim 19, wherein etching or ablating a first substrate and etching or ablating a second substrate include etching with or without masking, or ablation via application of a laser.

22. The method of claim 19, wherein placing anode and cathode materials includes use of chemical vapor deposition, plasma vapor deposition, chemical fluid deposition, electroplating, sintering or sputtering.

23. The method of claim 19, wherein joining the first substrate and the second substrate comprises bonding the first substrate and the second substrate.