System and method for providing even heat distribution and cooling return pads

• US 20080249520A1
• Filed: 04/03/2007
• Published: 10/09/2008
• Est. Priority Date: 04/03/2007
• Status: Active Grant

• Current Assignee: Covidien LP (Medtronic Plc)
• Original Assignee: Tyco Healthcare Group LP (Medtronic Plc)
• Inventors: Dunning, James E., Gadsby, Peter, Rick, Kyle R., Gresback, David
• Granted Patent: US 8,021,360 B2
• Time in Patent Office: Days
• US Class Current: 606/34
• CPC Class Codes: A61B 18/16 Indifferent or passive electrodes for grounding
• CPC Class Codes: A61B 2018/00005 Cooling or heating of the probe or tissue immediately surrounding the probe
• CPC Class Codes: A61B 2018/00011 with fluids
• CPC Class Codes: A61B 2018/00023 closed, i.e. without wound contact by the fluid
• CPC Class Codes: A61B 2018/00047 using Peltier effect
• CPC Class Codes: A61F 2007/0075 using a Peltier element, e.g. near the spot to be heated or cooled

Abstract

A return pad for use with an electrosurgical system is disclosed. The return pad includes a conductive layer, a contact layer configured to engage a patient'"'"'s skin and an intermediate layer disposed between the conductive layer and the contact layer. The intermediate layer is adapted to distribute energy.

Claims

1. A return pad for use with an electrosurgical system, comprising:

a conductive layer;

a contact layer disposed on the conductive layer and configured to engage patient skin; and

a cooling section disposed on the conductive layer and configured to reduce the temperature of at least one of the contact layer and the conductive layer.

2. The return pad according to claim 1, wherein the cooling section includes a heat exchanger.

3. The return pad according to claim 1, wherein the cooling section includes an evaporative material.

4. The return pad according to claim 1, wherein the cooling section includes a passive cooling device.

5. The return pad according to claim 1, wherein the cooling section includes a Peltier cooling device.

6. The return pad according to claim 1, wherein the cooling section includes a chemical layer.

7. The return pad according to claim 1, further including a backing layer disposed on the cooling section and adapted to allow heat to dissipate therethrough.

8. The return pad according to claim 1, wherein the cooling section further includes:

an intermediate layer disposed on the conductive layer and constructed from a material that distributes energy; and

a cooling device disposed on the intermediate layer.

9. The return pad according to claim 8, wherein the cooling device is selected from a group consisting of an active cooling device and a passive cooling device.

10. The return pad according to claim 8, wherein the intermediate layer is selected from a group consisting of a dielectric layer and a carbon layer.

11. The return pad according to claim 1, wherein at least a portion of the cooling section includes at least one cooling chamber configured to allow fluid to flow therethrough.

12. A return pad cooling system for electrosurgical surgery comprising:

a return pad including;

a conductive layer;

a contact layer disposed on the conductive layer and configured to engage patient skin;

a cooling section disposed on the conductive layer and configured to reduce the temperature of at least one of the contact layer and the conductive layer, the cooling section including one or more cooling chambers configured to allow fluid to flow therethrough; and

a cooling system that supplies cooling fluid to the cooling chamber.

13. The cooling system according to claim 12, wherein the cooling system includes a pump that circulates cooling fluid through the cooling chamber.

14. The cooling system according to claim 12, where the cooling section further includes an intermediate layer disposed on the conductive layer and configured to distribute energy.