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System and method for providing even heat distribution and cooling return pads

  • US 20080249524A1
  • Filed: 04/03/2007
  • Published: 10/09/2008
  • Est. Priority Date: 04/03/2007
  • Status: Abandoned Application
First Claim
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1. A return pad for use with an electrosurgical system, comprising:

  • a contact layer configured to engage patient skin;

    a conductive layer disposed on the contact layer; and

    a heating layer, operatively associated with at least one of the contact layer and the conductive layer, the heating layer configured to heat the return pad.

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