HEAT DISSIPATION PACKAGE FOR HEAT GENERATION ELEMENT

• US 20080251805A1
• Filed: 11/07/2007
• Published: 10/16/2008
• Est. Priority Date: 04/13/2007
• Status: Active Grant

• Current Assignee: Epistar Corporation
• Original Assignee: Industrial Technology Research Institute
• Inventors: Lin, Ming-Te
• Granted Patent: US 7,816,698 B2
• Time in Patent Office: Days
• US Class Current: 257/98
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 33/642 characterized by the shape
• CPC Class Codes: H01L 33/647 the elements conducting electric current to or from the semiconductor body

Abstract

A heat dissipation package is provided. Conducting leads of the package are located between two dissipating parts of a heat dissipation carrier to form the heat dissipation package with a structure of heat outside and electricity inside. Consequently, there is no limitation caused by electrical elements surrounding the heat dissipation carrier, so as to enhance the expandability of the heat dissipation carrier and improve the efficiency for heat dissipation of the heat generation element.

Claims

1. A heat dissipation package for the heat generation element, comprising:

the heat generation element having at least two electrodes;

a heat dissipation carrier having two dissipating parts and a carrier part, wherein the carrier part connects the dissipating parts, and the heat generation element is disposed on the carrier part; and

conducting leads electrically coupled to the electrodes of the heat generation element, located between two dissipating parts of the heat dissipation carrier, and electrically insulated from the heat dissipation carrier, so as to form the heat dissipation package with a structure of heat outside and electricity inside.

2. The heat dissipation package for the heat generation element as claimed in claim 1, further comprising a heat dissipation base for mounting the heat dissipation carrier therein and the heat dissipation base having a thorough hole for housing the conducting leads.

3. The heat dissipation package for the heat generation element as claimed in claim 2, further comprising fin-shaped heat sinks located at peripheries of the heat dissipation base.

4. The heat dissipation package for the heat generation element as claimed in claim 2, further comprising a plug disposed in the thorough hole of the heat dissipation base and electrically coupled to the conducting leads.

5. The heat dissipation package for the heat generation element as claimed in claim 2, wherein the heat dissipation base is shaped as a rectangle.

6. The heat dissipation package for the heat generation element as claimed in claim 2, wherein the heat dissipation base is shaped as a letter U.

7. The heat dissipation package for the heat generation element as claimed in claim 6, wherein the U-shaped heat dissipation base further comprises sliding grooves located at respective arms of the U-shaped heat dissipation base for sliding and mounting the heat dissipation carrier.

8. The heat dissipation package for the heat generation element as claimed in claim 1, wherein the heat generation element is a semiconductor chip.

9. The heat dissipation package for the heat generation element as claimed in claim 1, wherein the heat generation element is a light emitting diode (LED).

10. The heat dissipation package for the heat generation element as claimed in claim 9, further comprising a lens located at a light emitting end of the LED, so as to modify the light emitted from the light emitting end of the LED.

11. The heat dissipation package for the heat generation element as claimed in claim 1, wherein a section of the heat dissipation carrier is substantially shaped as an inverted letter U, or a letter M, or a letter W.

12. The heat dissipation package for the heat generation element as claimed in claim 1, further comprising an encapsulating material for packaging and protecting the heat generation element, the heat dissipation carrier and the conducting leads.

13. The heat dissipation package for the heat generation element as claimed in claim 12, wherein the encapsulating material is transparent.

14. The heat dissipation package for the heat generation element as claimed in claim 12, wherein a surface of the heat dissipation carrier has at least one notch thereon, and the notch is filled with the encapsulating material.

15. The heat dissipation package for the heat generation element as claimed in claim 12, wherein a surface of one of the conducting leads has at least one notch thereon, and the notch is filled with the encapsulating material.

16. The heat dissipation package for the heat generation element as claimed in claim 1, farther comprising an enhanced encapsulating material for securing the heat dissipation carrier and the conducting leads.

17. The heat dissipation package for the heat generation element as claimed in claim 16, wherein the enhanced encapsulating material is opaque.

18. The heat dissipation package for the heat generation element as claimed in claim 16, wherein the enhanced encapsulating material is transparent.

19. The heat dissipation package for the heat generation element as claimed in claim 16, wherein the conducting leads are suitable to be plugged into plug holes of a plug, portion of each of the conducting leads in the plug holes is encircled by a tube-shaped portion of the enhanced encapsulating material, the outer surface of each of the tube-shaped portions has a circular groove, and each of the circular grooves is suitable for a waterproofing ring to be disposed therein.

20. The heat dissipation package for the heat generation element as claimed in claim 16, wherein the enhanced encapsulating material has a positioning pin suitable to be wedged in a positioning hole of a plug, the positioning pin has at least one recess, and a spring inside the positioning hole is wedged in the recess while the positioning pin is wedged in the positioning hole.

21. The heat dissipation package for the heat generation element as claimed in claim 1, wherein the heat dissipation carrier has at least one positioning indentation.

22. The heat dissipation package for the heat generation element as claimed in claim 1, wherein the heat dissipation carrier is shaped as a letter U, and the surfaces facing to each other of the dissipating parts have bumps thereon.

23. The heat dissipation package for the heat generation element as claimed in claim 1, further comprising a plug electrically coupled to the conducting leads.

24. The heat dissipation package for the heat generation element as claimed in claim 1, wherein the portions of the conducting leads away from the heat generation element have different widths.