Vertical system integration
First Claim
7. A stacked integrated circuit comprising:
- a plurality of closely-coupled integrated circuit layers in stacked relation to one another; and
a plurality of vertical interconnections in a standardized placement interconnecting at least two of the plurality of closely-coupled integrated circuit layers;
wherein said at least two of the closely-coupled integrated circuit layers are used in at least one different stacked integrated circuit.
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Accused Products
Abstract
The Vertical System Integration (VSI) invention herein is a method for integration of disparate electronic, optical and MEMS technologies into a single integrated circuit die or component and wherein the individual device layers used in the VSI fabrication processes are preferably previously fabricated components intended for generic multiple application use and not necessarily limited in its use to a specific application. The VSI method of integration lowers the cost difference between lower volume custom electronic products and high volume generic use electronic products by eliminating or reducing circuit design, layout, tooling and fabrication costs.
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Citations
18 Claims
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7. A stacked integrated circuit comprising:
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a plurality of closely-coupled integrated circuit layers in stacked relation to one another; and a plurality of vertical interconnections in a standardized placement interconnecting at least two of the plurality of closely-coupled integrated circuit layers; wherein said at least two of the closely-coupled integrated circuit layers are used in at least one different stacked integrated circuit. - View Dependent Claims (8, 9, 10, 11, 12)
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13. A stacked integrated circuit comprising:
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a plurality of closely-coupled integrated circuit layers in stacked relation to one another, at least one of the plurality of closely-coupled integrated circuit layers having a specified interconnection pattern; wherein there exists at least one additional integrated circuit layer having the specified interconnection pattern, whereby the additional integrated circuit layer can, without modification, be added to the stacked integrated circuit. - View Dependent Claims (1, 2, 3, 4, 5, 6, 14, 15, 16, 17, 18)
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17-1. The stacked integrated circuit of claim 13, comprising vertical interconnections formed by bonding the plurality of closely-coupled integrated circuit layers by metal diffusion bonding.
Specification