Vertically Integrated Transceiver Array
First Claim
Patent Images
1. A transceiver array comprising:
- a digital wafer including digital integrated circuits; and
a plurality of RF cubes formed to the digital wafer, each of the RF cubes including a plurality of integrated circuit wafers including an antenna wafer and at least one lower wafer, said antenna wafer including an antenna and a resonating cavity and said lower wafer including a least one integrated circuit.
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Abstract
A transceiver array that employs vertically integrated circuits in one or more wafers. The array includes a digital wafer having digital circuits. A plurality of RF cubes are formed to the digital wafer, where each RF cube includes an antenna wafer and at least one lower wafer, and where each RF cube represents a separate channel of the array. The antenna wafer includes a patch antenna and a resonating cavity. The at least one lower wafer includes high frequency RF integrated circuits and intermediate frequency RF integrated circuits. The array has application as a front-end for a digital beam-forming system.
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Citations
31 Claims
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1. A transceiver array comprising:
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a digital wafer including digital integrated circuits; and a plurality of RF cubes formed to the digital wafer, each of the RF cubes including a plurality of integrated circuit wafers including an antenna wafer and at least one lower wafer, said antenna wafer including an antenna and a resonating cavity and said lower wafer including a least one integrated circuit. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18)
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19. A vertically integrated RF circuit comprising:
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an antenna wafer having a first surface and a second surface, said antenna wafer including an antenna formed to the first surface and a resonating cavity formed through the second surface; a first RF wafer covering the resonating cavity and including at least one integrated circuit; and a second RF wafer electrically coupled to the first RF wafer, said second RF wafer including at least one integrated circuit. - View Dependent Claims (20, 21, 22, 23, 24, 25, 26, 27)
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28. A transceiver array that provides digital beam-forming for both transmit and receive signals, said transceiver array comprising:
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a digital wafer including analog-to-digital converters, digital-to-analog converters, weighting junctions and a digital beam-forming processor; and a plurality of RF cubes formed to the digital wafer where each RF cube is a channel in the array, each of the RF cubes including an antenna wafer, a first lower wafer and a second lower wafer, said antenna wafer including a patch antenna and a resonating cavity, said first lower wafer covering the resonating cavity and including high frequency RF MMIC integrated circuits and said second lower wafer including intermediate frequency integrated MMIC circuits. - View Dependent Claims (29, 30, 31)
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Specification