Lithographic projection apparatus and a device manufacturing method using such lithographic projection apparatus

• US 20080252870A1
• Filed: 06/16/2008
• Published: 10/16/2008
• Est. Priority Date: 07/08/2004
• Status: Active Grant

• Current Assignee: ASML Netherlands BV (ASML Holding NV)
• Original Assignee: ASML Netherlands BV (ASML Holding NV)
• Inventors: Baselmans, Johannes Jacobus Matheus, Jeunink, Andre Bernardus, De Groot, Simon, Akhssay, M'hamed, Tel, Wim Tjibbo, Van Der Hoff, Alexander Hendrikus Martinus, Van De Stadt, Amout, Chrysogonus Marie Commissaris, Franciscus Antonius, Van Dijk, Remco Marcel
• Granted Patent: US 7,626,684 B2
• Time in Patent Office: Days
• US Class Current: 355/53
• CPC Class Codes: G03F 7/70258 Projection system adjustments, e.g. adjustments during exposure or alignment during assembly of projection system
• CPC Class Codes: G03F 7/70491 Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
• CPC Class Codes: G03F 7/705 Modelling or simulating from physical phenomena up to complete wafer processes or whole workflow in wafer productions
• CPC Class Codes: G03F 7/706 Aberration measurement
• CPC Class Codes: G03F 7/70891 Temperature
• CPC Class Codes: G03F 9/7046 Strategy, e.g. mark, sensor or wavelength selection

Abstract

A lithographic projection apparatus is disclosed that includes a predictive system configured to predict changes in projection system aberrations with time with respect to measured aberration values, a modelling system configured to determine an application-specific effect of said predicted projection system aberration changes on at least one parameter of an image for a selected pattern, a control system configured to generate a control signal specific to the selected pattern according to said predicted projection system aberration changes and their application-specific effect on the at least one parameter of the image, and an image adjusting system, responsive to the control signal, to compensate for the application-specific effect of said predicted projection system aberration changes on the image.

Claims

1-12. -12. (canceled)

13. A device manufacturing method using a lithographic projection apparatus, the method comprising:

illuminating a patterning device for a desired patterning application, with a beam of radiation to produce a patterned beam;

projecting the patterned beam onto a target portion to form an image thereon;

predicting changes in projection aberrations with time with respect to measured aberration values;

determining an application-specific effect of said predicted projection aberration changes on at least one parameter of the image;

generating a control signal specific to the desired patterning application according to said predicted projection system aberration changes and their application-specific effect; and

adjusting the imaging based on the control signal.

14. The device manufacturing method according to claim 13, wherein the generating further comprises preferentially compensating predicted changes in features of the image in one of two directions in the plane of the image, in accordance with known sensitivities of the patterning device to projection system aberrations in the two directions.

15. The device manufacturing method according to claim 13, wherein the generating further comprises preferentially compensating changes in features of the image in a direction normal to the plane of the image, in accordance with known sensitivities of the patterning device to projection system aberrations in said direction.

16. The device manufacturing method according to claim 13, wherein the control signal further takes into account a defined merit function determining relative weightings to be given to selected effects of projection system aberrations on different parameters of the image.

17. The device manufacturing method according to claim 13, wherein said predicting is performed on the basis of a lens heating model that predicts changes in at least one aberration value with time as a result of lens heating or cooling.

18. The device manufacturing method according to claim 13, wherein the application-specific effect is determined on the basis of data indicative of the patterning device and an illumination mode used in the illuminating.

19. The device manufacturing method according to claim 13, wherein the generating is performed on the basis of known correspondence between changes in imaging adjustments and aberration changes being compensated for by such imaging adjustments.

20. The device manufacturing method according to claim 13, further comprising feeding back overlay metrology information to correct for a shift in a metrology overlay target for a current layer measured with respect to a metrology overlay target for a previous layer, as a result of said predicted changes and said adjusting, on the basis of an optimization procedure providing for changes in aberrations to which the image is most sensitive to be compensated for according to a defined merit-function.

21. The device manufacturing method according to claim 13, further comprising, re-measuring at least one aberration value when the determined effect on the at least one parameter is greater than a corresponding threshold value.

22. The device manufacturing method according to claim 13, wherein the adjusting is carried out over successive scan positions during scanning exposure of the substrate to allow for variations in the scanned image over the extent of the substrate, in order to optimize the image as a function of scan position.

34. The device manufacturing method according to claim 13, further comprising compensating for effects of a shift in a respective substrate alignment mark provided for the alignment of each layer of successive layers of images to be applied to the target portion of the substrate, the shift resulting from the predicted projection system aberration changes and adjusting the imaging, on the basis of an optimization procedure providing for the changes in aberrations to which the image is most sensitive to be compensated for according to a defined merit-function.

35. The device manufacturing method according to claim 13, further comprising compensating for effects of a shift in a respective patterning device alignment mark provided for the alignment of each layer of successive layers of images to be applied to the target portion, the shift resulting from the predicted projection system aberration changes and adjusting the imaging, on the basis of an optimization procedure providing for the changes in aberrations to which the image is most sensitive to be compensated for according to a defined merit-function.

23. A machine readable medium encoded with machine executable instructions for performing a method, the method comprising:

predicting changes in projection aberrations with time with respect to measured aberration values for a desired patterning application on a lithographic projection apparatus;

determining an application-specific effect of said predicted projection aberration changes on at least one parameter of an image;

generating a control signal specific to the desired patterning application according to said predicted projection system aberration changes and their application-specific effect; and

adjusting the imaging based on the control signal.

24. The machine readable medium according to claim 23, wherein the generating further comprises preferentially compensating predicted changes in features of the image in one of two directions in the plane of the image, in accordance with known sensitivities of the patterning device to projection system aberrations in the two directions.

25. The machine readable medium according to claim 23, wherein the generating further comprises preferentially compensating changes in features of the image in a direction normal to the plane of the image, in accordance with known sensitivities of the patterning device to projection system aberrations in said direction.

26. The machine readable medium according to claim 23, wherein the control signal further takes into account a defined merit function determining relative weightings to be given to selected effects of projection system aberrations on different parameters of the image.

27. The machine readable medium according to claim 23, wherein said predicting is performed on the basis of a lens heating model that predicts changes in at least one aberration value with time as a result of lens heating or cooling.

28. The machine readable medium according to claim 23, wherein the application-specific effect is determined on the basis of data indicative of the patterning device and an illumination mode used in the illuminating.

29. The machine readable medium according to claim 23, wherein the generating is performed on the basis of known correspondence between changes in imaging adjustments and aberration changes being compensated for by such imaging adjustments.

30. The machine readable medium according to claim 23, wherein the method further comprises feeding back overlay metrology information to correct for a shift in a metrology overlay target for a current layer measured with respect to a metrology overlay target for a previous layer, as a result of said predicted changes and said adjusting, on the basis of an optimization procedure providing for changes in aberrations to which the image is most sensitive to be compensated for according to a defined merit-function.

31. The machine readable medium according to claim 23, wherein the method further comprises re-measuring at least one aberration value when the determined effect on the at least one parameter is greater than a corresponding threshold value.

32. The machine readable medium according to claim 23, wherein the adjusting is carried out over successive scan positions during scanning exposure of the substrate to allow for variations in the scanned image over the extent of the substrate, in order to optimize the image as a function of scan position.

33. A method, comprising:

predicting changes in projection system aberrations with time with respect to measured aberration values;

determining an application-specific effect of the predicted projection system aberration changes on a parameter of an image of a pattern;

generating a control signal specific to the pattern according to the predicted projection system aberration changes and their application-specific effect on the parameter of the image; and

based on the control signal, compensating for the application-specific effect of the predicted projection system aberration changes on the image.