PANEL-TYPE HEAT SINK MODULE

• US 20080253080A1
• Filed: 05/04/2007
• Published: 10/16/2008
• Est. Priority Date: 09/22/2006
• Status: Abandoned Application

• Current Assignee: Forcecon Technology Co., Ltd.
• Original Assignee: Forcecon Technology Co., Ltd.
• Inventors: HE, Sin-Wei, Chang, Jhong-Yan
• Application Number:
  US11/744,421
• Publication Number:
  US 20080253080A1
• Time in Patent Office: Days
• US Class Current: 361/687
• CPC Class Codes: F21K 9/00 Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
• CPC Class Codes: F21V 29/677 the fans being used for discharging
• CPC Class Codes: F21V 29/717 using split or remote units thermally interconnected, e.g. by thermally conductive bars or heat pipes
• CPC Class Codes: F21V 29/76 with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
• CPC Class Codes: F21Y 2105/10 comprising a two-dimensional array of point-like light-generating elements
• CPC Class Codes: F21Y 2115/10 Light-emitting diodes [LED]
• CPC Class Codes: F28D 15/0233 the conduits having a particular shape, e.g. non-circular cross-section, annular F28D15/0241, F28D15/0266 take precedence
• CPC Class Codes: F28D 15/0266 with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers F28D15/043 takes precedence
• CPC Class Codes: F28F 3/02 Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations F28F3/08 takes precedence
• CPC Class Codes: G02F 1/133385 with cooling means, e.g. fans
• CPC Class Codes: H05K 7/20972 Forced ventilation, e.g. on heat dissipaters coupled to components
• CPC Class Codes: H05K 7/2099 Liquid coolant with phase change

Abstract

The panel-type heat sink module combines the heat-conducting panel, fin heat sink, diversion tank, fan and heat pipe into a single module. There is a heat-conducting surface and an assembly surface of the heat-conducting panel. The fin heat sink is assembled onto the assembly surface. The diversion tank is adapted onto the assembly surface and located nearby the fin heat sink. The diversion tank includes a fan container and a diversion channel. The fan is assembled into the fan container, and the heat pipe is assembled between the assembly surface and the fin heat sink. The heat pipe penetrates through the diversion tank; thus, the heat sources guided by the heat-conducting panel will be uniformly guided into the fin heat sink and diversion tank via the heat pipe. An air stream generated by the fan flows towards the fin heat sink, improving heat-radiation, and reducing assembly space.

Claims

1. A panel-type heat sink module, comprising:

a heat-conducting panel with preset dimensions and thickness, said heat-conducting panel having a heat-conducting surface and an assembly surface;

a fin heat sink, being assembled in a preset location on said assembly surface, said fin heat sink being comprised of a plurality of fins arranged at intervals;

a diversion tank, being adapted onto said assembly surface and located nearby said fin heat sink, said diversion tank being comprised of a fan container and a diversion channel, said diversion channel connecting said fan container and said fin heat sink;

a fan, being assembled in said fan container and used to guide external air into said diversion tank, an air stream flowing towards said fin heat sink being generated by said fan; and

a heat pipe, being assembled between said assembly surface and said fin heat sink, said heat pipe having one end or one section thereof penetrating through the said diversion tank.

2. The module defined in claim 1, wherein said fin heat sink divides into two parts, said two parts being separately assembled at both sides of said assembly surface, said diversion tank being placed between said two parts of said fin heat sink.

3. The module defined in claim 1, wherein said fan is comprised of two misaligned fans separated by a wall, forming independent space for said diversion channels, said diversion channel being separately connected to said fin heat sink.

4. The module defined in claim 1, wherein said heat-conducting surface has a plurality of mounting holes arranged at interval thereon.

5. The module defined in claim 4, wherein said mounting holes position an LED display panel or lighting panel or LCD panel.