ENCAPSULATION METHOD AND APPARATUS
First Claim
1. A method for encapsulating an electronic device, comprising:
- dispensing a mold material onto the electronic device;
situating the electronic device between first and second molds;
moving the first mold towards the second mold so as to vary the size of a cavity defined by the first and second molds;
applying a vacuum to the cavity; and
varying the vacuum in response to the size of the cavity.
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Accused Products
Abstract
A method and apparatus for encapsulating items such as electronic devices. A mold material is dispensed onto the electronic device and the device is situated between first and second molds. One mold is moved towards the other so as to vary the size of a cavity defined by the first and second molds. A vacuum is applied to the cavity and the vacuum is varied in response to the size of the cavity. The vacuum can be varied in response to a predetermined vacuum profile. For example, in certain embodiments the vacuum is varied in response to the position of the first mold relative to the second mold, wherein the vacuum is increased as the cavity height is reduced.
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Citations
37 Claims
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1. A method for encapsulating an electronic device, comprising:
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dispensing a mold material onto the electronic device; situating the electronic device between first and second molds; moving the first mold towards the second mold so as to vary the size of a cavity defined by the first and second molds; applying a vacuum to the cavity; and varying the vacuum in response to the size of the cavity. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19)
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20. An apparatus for encapsulating an electronic device, comprising:
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a cavity defined between first and second molds for receiving the electronic device, the first mold being movable relative to the second mold so as to selectively vary the size of the cavity; a pump in communication with the cavity to create a vacuum in the cavity; and a controller connected to the pump and programmed to vary the vacuum applied to the cavity in response to the size of the cavity. - View Dependent Claims (21, 22, 23, 24, 25, 26, 27)
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28. An apparatus for encapsulating an electronic device, comprising:
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a cavity defined between first and second molds for receiving the electronic device, the first mold being movable relative to the second mold so as to selectively vary the size of the cavity; a pump in communication with the cavity to create a vacuum in the cavity; a valve in communication with the cavity and operable to selectively vent the cavity; and a controller connected to the valve and programmed to operate the valve to vary the vacuum applied to the cavity in response to the size of the cavity. - View Dependent Claims (29, 30, 31, 32, 33)
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34. An apparatus for encapsulating an electronic device, comprising:
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a cavity defined between first and second molds for receiving the electronic device, the first mold being movable relative to the second mold so as to selectively vary the size of the cavity; and means for dispersing a molding material over the electronic device. - View Dependent Claims (35, 36, 37)
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Specification