METHODS FOR FORMING METAL INTERCONNECT STRUCTURE FOR THIN FILM TRANSISTOR APPLICATIONS

• US 20080254613A1
• Filed: 04/10/2007
• Published: 10/16/2008
• Est. Priority Date: 04/10/2007
• Status: Abandoned Application

• Current Assignee: Applied Materials Incorporated
• Original Assignee: Applied Materials Incorporated
• Inventors: Zhang, Hong, Li, Yanping, Wang, Jenn Yue, Le, Hien-Minh
• Application Number:
  US11/733,203
• Publication Number:
  US 20080254613A1
• Time in Patent Office: Days
• US Class Current: 438/624
• CPC Class Codes: H01L 21/2855 by physical means, e.g. sputtering, evaporation H01L21/28518 - H01L21/28537 and H01L21/28568 take precedence
• CPC Class Codes: H01L 21/67207 comprising a chamber adapted to a particular process
• CPC Class Codes: H01L 21/67236 the substrates being processed being not semiconductor wafers, e.g. leadframes or chips
• CPC Class Codes: H01L 27/124 with a particular composition, shape or layout of the wiring layers specially adapted to the circuit arrangement, e.g. scanning lines in LCD pixel circuits wiring structures per se H01L23/52
• CPC Class Codes: H01L 29/458 for thin film silicon, e.g. source or drain electrode
• CPC Class Codes: H01L 29/4908 for thin film semiconductor, e.g. gate of TFT

Abstract

Methods for forming a metal interconnection structure in thin-film transistor applications are provided in the present invention. In one embodiment, the method may include providing a substrate into a processing chamber, supplying a first gas mixture into the chamber to deposit a metal layer on the substrate, and supplying a second gas mixture into the chamber to deposit a barrier layer on the metal layer. In another embodiment, a metal interconnection structure may include a substrate, a first barrier layer disposed on the substrate, a metal layer disposed on the substrate in a processing chamber, a second barrier layer disposed on the metal layer formed in the processing chamber a second barrier layer disposed on the metal layer formed in the processing chamber, wherein the first barrier layer, the metal layer and the second barrier layer are configured to form a metal interconnection structure for TFT devices.

Claims

1. A method of forming a metal interconnection structure in thin-film transistor applications, comprising:

providing a substrate into a processing chamber configured to form a metal interconnection structure for TFT devices thereon;

supplying a first gas mixture into the chamber to deposit a metal layer on the substrate; and

supplying a second gas mixture into the chamber to deposit a barrier layer on the metal layer.

2. The method of claim 1, wherein the step of supplying the first gas mixture further comprises:

sputtering source material from a target disposed in the processing chamber; and

reacting the sputtered material with the first gas mixture to form the metal layer on the substrate.

3. The method of claim 2, wherein the source material is at least one of Al or Al alloy.

4. The method of claim 3, wherein the metal layer is aluminum layer.

5. The method of claim 1, wherein the metal layer is deposited on a pre-disposed barrier layer formed on the substrate.

6. The method of claim 5, wherein the pre-disposed barrier layer is formed from a material selected from a group consisting of molybdenum (Mo), chromium (Cr), titanium (Ti), tantalum (Ta), tungsten (W), zinc (Zn), tin (Sn), molybdenum nitride, chromium nitride, titanium nitride, tantalum nitride, tungsten nitride, aluminum nitride, zinc nitride and combination thereof.

7. The method of claim 1, wherein the step of supplying the first gas mixture further comprises:

supplying the first gas mixture selected from a group consisting of Ar, He and Kr.

8. The method of claim 1, wherein the step of supplying the second gas mixture further comprises:

supplying a reactive gas and an inert gas in the second gas mixture.

9. The method of claim 8, wherein the reactive gas is selected from a group consisting of N₂, N₂O, NO₂, NH₃, and the inert gas is selected from a group consisting of Ar, He and Kr.

10. The method of claim 8, wherein the step of supplying the reactive gas in the second gas mixture further comprises:

sputtering source material from a target disposed in the processing chamber; and

reacting the sputtered material with the reactive gas in the second gas mixture to form the barrier layer on the substrate.

11. The method of claim 10, wherein the barrier layer is an aluminum nitride layer.

12. The method of claim 1, wherein the step of supplying the first gas mixture further comprises:

supplying a preliminary gas mixture into the processing chamber to form a underlying barrier layer on the substrate prior to supplying the first gas mixture.

13. The method of claim 12, wherein the step of supplying the preliminary gas mixture further comprises:

supplying a reactive gas and an inert gas in the preliminary gas mixture.

14. The method of claim 13, wherein the reactive gas is selected from a group consisting of N₂, N₂O, NO₂, NH₃ and the inert gas is selected from a group consisting of Ar, He and Kr.

15. The method of claim 12, wherein the underlying barrier layer is an aluminum nitride layer.

16. A method of forming a metal interconnection structure in thin-film transistor applications, comprising:

providing a substrate into a processing chamber;

supplying a first gas mixture into the chamber;

sputtering source material from a target disposed in the processing chamber using the first gas mixture;

reacting the sputtered material with the first gas mixture to form a metal layer on the substrate;

supplying a second gas mixture into the chamber;

sputtering source material from the target disposed in the processing chamber using the second gas mixture; and

reacting the sputtered material with the second gas mixture to form a barrier layer on the metal layer.

17. The method of claim 16, further comprising:

forming a underlying barrier layer on the substrate in the processing chamber prior to depositing the metal layer.

18. The method of claim 16, wherein the substrate has a barrier layer underlying on the substrate, wherein the pre-disposed barrier layer is formed from a material selected from a group consisting of molybdenum (Mo), chromium (Cr), titanium (Ti), tantalum (Ta), tungsten (W), zinc (Zn), tin (Sn), molybdenum nitride, chromium nitride, titanium nitride, tantalum nitride, tungsten nitride, aluminum nitride, zinc nitride and combination thereof.

19. The method of claim 16, wherein the first gas mixture is selected from a group consisting of Ar, He and Kr.

20. The method of claim 20, wherein the second gas mixture including a reactive gas and an inert gas, wherein the reactive gas is selected from a group consisting of N₂, N₂O, NO₂, NH₃ and the inert gas is selected from a group consisting of Ar, He and Kr.

21. A metal interconnection structure utilized to form a gate electrode layer in a thin-film transistor, comprising:

a substrate;

a first barrier layer disposed on the substrate;

a metal layer disposed on the substrate in a processing chamber;

a second barrier layer disposed on the metal layer formed in the processing chamber, wherein the first barrier layer, the metal layer and the second barrier layer are configured to form a metal interconnection structure for TFT devices.

22. The method of claim 21, wherein the first barrier layer is formed from a material selected from a group consisting of molybdenum (Mo), chromium (Cr), titanium (Ti), tantalum (Ta), tungsten (W), zinc (Zn), tin (Sn), molybdenum nitride, chromium nitride, titanium nitride, tantalum nitride, tungsten nitride, aluminum nitride, zinc nitride and combination thereof.

23. The method of claim 21, wherein the first barrier layer is formed in the processing chamber.

24. The method of claim 21, wherein the metal layer is an aluminum layer.

25. The method of claim 21, wherein the second barrier layer is an aluminum nitride layer.