×

Method of Molding Rigid Polyurethane Foams with Enhanced Thermal Conductivity

  • US 20080255262A1
  • Filed: 11/03/2006
  • Published: 10/16/2008
  • Est. Priority Date: 11/14/2005
  • Status: Active Grant
First Claim
Patent Images

1. A molded rigid polyurethane foam having a ratio of molded foam density (kg/m3) to Lambda(10°

  • C.) (mW/m.K), measured 24 hours after foam production, from 1.65 to 2.15, obtained by the process of injecting into a closed mold cavity a reaction mixture at a packing factor of 1.03 to 1.9 wherein the mold cavity is under a reduced pressure and the reaction mixture comprises;

    A) an organic polyisocyanate;

    B) a physical blowing agent,C) a polyol composition containing at least one polyol with a functionality of 3 or greater and a hydroxyl number between 300 and 800D) water present at 0 to 2.5 weight percent of the total polyol formulation;

    E) catalyst andF) auxiliary substances and/or additives;

    wherein the foam has a molded density of 33 to 38 kg/m3.

View all claims
  • 6 Assignments
Timeline View
Assignment View
    ×
    ×