Apparatus and method for non-destructive testing

• US 20080257048A1
• Filed: 09/15/2005
• Published: 10/23/2008
• Est. Priority Date: 09/15/2004
• Status: Active Grant

• Current Assignee: Sunrise International, Inc.
• Original Assignee: LSP Technologies Incorporated
• Inventors: Toller, Steven M., Walters, Craig T.
• Granted Patent: US 8,156,811 B2
• Time in Patent Office: Days
• US Class Current: 73/588
• CPC Class Codes: G01N 2291/0231 Composite or layered materials
• CPC Class Codes: G01N 2291/267 Welds
• CPC Class Codes: G01N 2291/2694 Wings or other aircraft parts
• CPC Class Codes: G01N 29/043 in the interior, e.g. by shear waves
• CPC Class Codes: G01N 29/2412 using the magnetostrictive properties of the material to be examined, e.g. electromagnetic acoustic transducers [EMAT]; investigating the presence of flaws using eddy currents G01N27/90, magnetostrictive transducers B06B1/08, measuring magnetostrictive properties G01R33/18
• CPC Class Codes: G01N 29/4454 Signal recognition, e.g. specific values or portions, signal events, signatures

Abstract

A diagnostic means to enable real-time inspection of bonded structures. The disclosed apparatus detects bond failure stress waves on-axis from the front side (beam application side). Pi-box and pi-rail EMAT gauges can be used with the disclosed apparatus. An inductively coupled EMAT may also be employed. An improved means to remotely deliver an interrogating laser beam to a surface is provided. The process head may utilize a water column or a water film. The water film process head may include the use of either a single water film or two spaced apart water films. The disclosed apparatus can be used with bonded composite structures, bonded structures using various materials, and to determine the dynamic strength of unbonded solid materials. The apparatus may also be used in other applications that require remote flexible delivery of a localized stress wave to a material and/or diagnosis of the resultant stress waves.

Claims

1. An apparatus and method for non-destructive testing as disclosed herein.