Semiconductor light emitting device packages and methods
First Claim
1. A submount for a light emitting device package, comprising:
- a generally rectangular substrate having a first surface and a second surface opposite the first surface, a first end and a second end opposite the first end;
a first bond pad on the first surface of the substrate, wherein the first bond pad includes a die attach region offset toward the first end of the substrate and configured to receive a light emitting diode thereon;
a second bond pad on the first surface of the substrate, wherein the second bond pad includes a bonding region that is between the first bond pad and the second end of the substrate and a second bond pad extension that extends from the bonding region along a side of the substrate toward a corner of the substrate at the first end of the substrate; and
first and second solder pads on the second surface of the substrate, wherein the first solder pad is adjacent the first end of the substrate and the second solder pad is adjacent the second end of the substrate, and wherein the second bond pad is in electrical contact with the first solder pad and the first bond pad is in electrical contact with the second solder pad.
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Accused Products
Abstract
A submount for a light emitting device package includes a rectangular substrate. A first bond pad and a second bond pad are on a first surface of the substrate. The first bond pad includes a die attach region offset toward a first end of the substrate and configured to receive a light emitting diode thereon. The second bond pad includes a bonding region between the first bond pad and the second end of the substrate and a second bond pad extension that extends from the bonding region along a side of the substrate toward a corner of the substrate at the first end of the substrate. First and second solder pads are a the second surface of the substrate. The first solder pad is adjacent the first end of the substrate and contacts the second bond pad. The second solder pad is adjacent the second end of the substrate and contacts the first bond pad. Related LED packages and methods of forming LED packages are disclosed.
55 Citations
32 Claims
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1. A submount for a light emitting device package, comprising:
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a generally rectangular substrate having a first surface and a second surface opposite the first surface, a first end and a second end opposite the first end; a first bond pad on the first surface of the substrate, wherein the first bond pad includes a die attach region offset toward the first end of the substrate and configured to receive a light emitting diode thereon; a second bond pad on the first surface of the substrate, wherein the second bond pad includes a bonding region that is between the first bond pad and the second end of the substrate and a second bond pad extension that extends from the bonding region along a side of the substrate toward a corner of the substrate at the first end of the substrate; and first and second solder pads on the second surface of the substrate, wherein the first solder pad is adjacent the first end of the substrate and the second solder pad is adjacent the second end of the substrate, and wherein the second bond pad is in electrical contact with the first solder pad and the first bond pad is in electrical contact with the second solder pad. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13)
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14. A light emitting device package, comprising:
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a generally rectangular substrate having a first surface and a second surface opposite the first surface, a first end and a second end opposite the first end; a first bond pad on the first surface of the substrate, wherein the first bond pad includes a die attach region offset from a center of the first surface toward the first end of the substrate and configured to receive a light emitting diode thereon; a second bond pad on the first surface of the substrate, wherein the second bond pad includes a bonding region that is between the first bond pad and the second end of the substrate and a second bond pad extension that extends from the bonding region along a side of the substrate toward a corner of the substrate at the first end of the substrate; first and second solder pads on the second surface of the substrate, wherein the first solder pad is adjacent the first end of the substrate and the second solder pad is adjacent the second end of the substrate, and wherein the second bond pad is in electrical contact with the first solder pad and the first bond pad is in electrical contact with the second solder pad; a light emitting device having an electrical contact and mounted on the first bond pad; a bond wire bonded to the electrical contact of the light emitting device and to the second bond pad; and an encapsulant on the first surface of the substrate. - View Dependent Claims (15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27)
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28. A method of forming a submount for a light emitting diode (LED) package, comprising:
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providing a generally rectangular substrate having a first surface and a second surface opposite the first surface, a first end and a second end opposite the first end, a first corner at the first end and a second corner at the second end and diagonally across the substrate from the first corner; forming a seed layer on the first surface of the substrate; patterning the seed layer to form a first bond pad pattern and a second bond pad pattern on the first surface of the substrate; forming first bond pad on the first bond pad pattern, wherein the first bond pad includes a die attach region offset from a center of the first surface toward the first end of the substrate and configured to receive a light emitting diode thereon; forming a second bond pad on the second bond pad pattern, wherein the second bond pad includes a bonding region that is between the first bond pad and the second end of the substrate and a second bond pad extension that extends from the bonding region along a side of the substrate toward a corner of the substrate at the first end of the substrate; and etching the first bond pad and the second bond pad to increase a separation between the first bond pad and the second bond pad. - View Dependent Claims (29, 30)
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31. A method of forming a plurality of packaged light emitting diodes, comprising:
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providing a sheet of ceramic material including a two-dimensional array of light emitting devices mounted thereon; providing a mold including a plurality of cavities therein; dispensing a liquid encapsulant material in respective ones of the plurality of cavities; bringing the sheet of ceramic material into contact with the mold so that respective ones of the light emitting devices extend into a corresponding one of the plurality of cavities; and at least partially curing the liquid encapsulant so as to form encapsulant coatings around the respective light emitting devices. - View Dependent Claims (32)
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Specification