Semiconductor Device Comprising a Semiconductor Chip Stack and Method for Producing the Same
First Claim
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1. A semiconductor device comprising:
- a semiconductor chip stack including at least one lower semiconductor chip as base of the semiconductor chip stack, and at least one upper semiconductor chip;
an insulating intermediate plate arranged between the semiconductor chips, andconnecting elements which electrically connect the semiconductor chips, the intermediate plate and external terminals to one another;
wherein the semiconductor device has surface-mountable external contacts on its underside.
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Abstract
A semiconductor device includes a semiconductor chip stack having at least one lower semiconductor chip as a base of the semiconductor chip stack, and at least one upper semiconductor chip. An insulating intermediate plate is arranged between the semiconductor chips. Connecting elements wire the semiconductor chips, the intermediate plate and external terminals to one another.
34 Citations
41 Claims
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1. A semiconductor device comprising:
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a semiconductor chip stack including at least one lower semiconductor chip as base of the semiconductor chip stack, and at least one upper semiconductor chip; an insulating intermediate plate arranged between the semiconductor chips, and connecting elements which electrically connect the semiconductor chips, the intermediate plate and external terminals to one another; wherein the semiconductor device has surface-mountable external contacts on its underside. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24)
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25. A method for producing a semiconductor device, comprising:
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stacking a lower semiconductor chip, an intermediate plate and at least one further semiconductor chip one above another on a chip island of a semiconductor device carrier to provide a semiconductor chip stack; fitting connecting elements from the semiconductor chips to the intermediate plate, between the semiconductor chips among one another, and to external terminals of the semiconductor device on the semiconductor device carrier; and embedding the semiconductor chip stack and the connecting elements in a plastic housing composition. - View Dependent Claims (26, 27, 28, 29, 30, 31, 32, 33, 34, 35, 36, 37, 38, 39, 40)
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41. A method for producing a plurality of semiconductor devices, comprising:
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applying lower semiconductor chips on chip islands of a semiconductor device carrier in semiconductor device positions; cohesively fixing intermediate plates on the lower semiconductor chips; cohesively fixing at least one further semiconductor chip on the intermediate plates to form semiconductor chip stacks; fitting connecting elements; embedding the semiconductor chip stacks and the connecting elements in a plastic housing composition; and separating the semiconductor device carrier into individual semiconductor devices.
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Specification