Electronic Circuit Testing Apparatus

• US 20080258744A1
• Filed: 09/21/2005
• Published: 10/23/2008
• Est. Priority Date: 09/30/2004
• Status: Active Grant

• Current Assignee: ThruChip Japan Inc.
• Original Assignee: KEIO University
• Inventors: Kuroda, Tadahiro, Mizoguchi, Daisuke, Mirua, Noriyuki
• Granted Patent: US 8,648,614 B2
• Time in Patent Office: Days
• US Class Current: 324/750
• CPC Class Codes: G01R 31/3025 Wireless interface with the DUT
• CPC Class Codes: G01R 31/315 by inductive methods

Abstract

The present invention has an object to provide an electronic circuit testing apparatus that is preferable for testing an electronic circuit which carries out communications between substrates based on inductive coupling and is capable of testing the electronic circuit without using test pads, wherein a probe 15 is caused to intervene in a communications channel composed by inductive coupling based on the first and second transmitter coils 21a, 21b; and the first and second receiver coils 23a, 23b, and an LSI is tested by a tester 11, buffers 12 and 13, and a Tx/Rx switch 14. Accordingly, it is not be necessary for that the electronic circuit testing apparatus is provided with a needle that touches pads and leads of the electronic circuit, and the service life there can be lengthened.

Claims

1. :

An electronic circuit testing apparatus according to the invention comprising;

a probe having coil for transmitting and receiving signal.

2. :

The electronic circuit testing apparatus according to claim 1, wherein said probe is two-dimensionally movable.

3. :

The electronic circuit testing apparatus according to claim 1, wherein the number of said probe is more than one.

4. :

An electronic circuit testing apparatus according to claim 2, wherein the number of said probe is more than one.

5. :

An electronic circuit testing apparatus according to the invention comprising;

a transmitter coil for transmitting a signal, and

a receiver coil for receiving a signal.

6. :

The electronic circuit testing apparatus according to claim 5, wherein said transmitter coil and said receiver coil are formed by wiring on a single substrate.

7. :

The electronic circuit testing apparatus according to claim 6, wherein said transmitter coil and said receiver coil corresponding thereto are coaxially disposed.