Film Formation Apparatus, Film Formation Method, Manufacturing Apparatus, and Method for Manufacturing Light-Emitting Device
First Claim
1. A film formation apparatus comprising:
- a film formation chamber;
a heat source provided in the film formation chamber;
a first supporting unit to hold a first substrate over the heat source; and
a second supporting unit to hold a second substrate over the first supporting unit,wherein a first layer containing a material is formed on one flat surface of the first substrate set on the first supporting unit, andwherein the first substrate is heated by the heat source to form a second layer containing the material on a lower flat surface of the second substrate facing downward opposite to the first substrate.
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Abstract
An object is to improve use efficiency of an evaporation material, to reduce manufacturing cost of a light-emitting device, and to reduce manufacturing time needed for a light-emitting device including a layer containing an organic compound. The pressure of a film formation chamber is reduced, a plate is rapidly heated by heat conduction or heat radiation by using a heat source, a material layer on a plate is vaporized in a short time to be evaporated to a substrate on which the material layer is to be formed (formation substrate), and then the material layer is formed on the formation substrate. The area of the plate that is heated rapidly is set to have the same size as the formation substrate and film formation on the formation substrate is completed by one application of heat.
68 Citations
26 Claims
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1. A film formation apparatus comprising:
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a film formation chamber; a heat source provided in the film formation chamber; a first supporting unit to hold a first substrate over the heat source; and a second supporting unit to hold a second substrate over the first supporting unit, wherein a first layer containing a material is formed on one flat surface of the first substrate set on the first supporting unit, and wherein the first substrate is heated by the heat source to form a second layer containing the material on a lower flat surface of the second substrate facing downward opposite to the first substrate. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. A film formation apparatus comprising:
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a film formation chamber; a first supporting unit to hold a first substrate provided in the film formation chamber; a second supporting unit to hold a second substrate disposed to face the first supporting unit; and a heat source over the second supporting unit, wherein a first layer containing a material is formed on one flat surface of a second substrate set on the second supporting unit, and wherein the second substrate is heated by the heat source to form a second layer containing the material on an upper flat surface of the first substrate facing upward opposite to the second substrate. - View Dependent Claims (9, 10, 11, 12, 13, 14)
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15. A manufacturing apparatus comprising:
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a load chamber; a first film formation chamber connected to the load chamber; a transfer chamber connected to the first film formation chamber; a second film formation chamber connected to the transfer chamber; an unload chamber connected to the second film formation chamber, a coating device provided in the first film formation chamber; a heat source provided in the second film formation chamber; a first supporting unit to hold a first substrate over the heat source; and a second supporting unit to hold a second substrate, disposed to face the first supporting unit, wherein a first substrate is introduced from the load chamber to the first film formation chamber, wherein a layer containing a material is coated onto the first substrate in the first film formation chamber, wherein the first substrate is introduced from the first film formation chamber to the second film formation chamber through the transfer chamber, wherein the first substrate is disposed in the second film formation chamber, the first substrate facing a second substrate and heated by the heat source, wherein the layer is formed on a surface of the second substrate disposed to face the first substrate, and wherein the second substrate provided with the layer is transferred to the unload chamber.
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16. A method of film formation comprising the steps of:
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forming a first layer containing a material onto one surface of a first substrate; disposing a second substrate so that one surface of the second substrate faces the one surface of the first substrate; and heating the first substrate to form a second layer containing the material on the one surface of the second substrate. - View Dependent Claims (17, 18)
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19. A method of film formation comprising the steps of:
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forming a first layer containing a material selectively on one surface of a first substrate; disposing a second substrate so that one surface of the second substrate faces the one surface of the first substrate; and heating the first substrate to form a second layer containing the material selectively on the one surface of the second substrate. - View Dependent Claims (20, 21)
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22. A method of film formation comprising the steps of:
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forming a thermal conductive layer selectively on one surface of a first substrate; forming a first layer containing a material on the thermal conductive layer; disposing a second substrate so that one surface of the second substrate faces the one surface of the first substrate; and heating the first substrate to form a second layer containing the material selectively on the one surface of the second substrate. - View Dependent Claims (23, 24)
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25. A method for manufacturing a light-emitting device, comprising the steps of:
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forming a first layer containing an organic compound on one surface of a first substrate; holding a second substrate having a first electrode on a surface thereof so as to face the first layer; heating the first substrate and evaporating the first layer to form a second layer containing the organic compound on the first electrode; and forming a second electrode on the second layer. - View Dependent Claims (26)
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Specification