APPARATUS AND METHOD FOR PRE AND POST TREATMENT OF ATOMIC LAYER DEPOSITION

• US 20080260963A1
• Filed: 04/17/2007
• Published: 10/23/2008
• Est. Priority Date: 04/17/2007
• Status: Abandoned Application

• Current Assignee: Lam Research Corporation
• Original Assignee: Lam Research Corporation
• Inventors: Korolik, Mikhail, Dordi, Yezdi, Redeker, Fritz C., Boyd, John M., Yoon, Hyungsuk Alexander
• Application Number:
  US11/736,514
• Publication Number:
  US 20080260963A1
• Time in Patent Office: Days
• US Class Current: 427/534
• CPC Class Codes: C23C 16/45517 Confinement of gases to vicinity of substrate
• CPC Class Codes: C23C 16/45536 Use of plasma, radiation or electromagnetic fields
• CPC Class Codes: C23C 16/45551 for relative movement of the substrate and the gas injectors or half-reaction reactor compartments
• CPC Class Codes: H01L 21/02063 the processing being the formation of vias or contact holes
• CPC Class Codes: H01L 21/02068 during, before or after processing of conductive layers, e.g. polysilicon or amorphous silicon layers
• CPC Class Codes: H01L 21/28562 Selective deposition
• CPC Class Codes: H01L 21/76814 post-treatment or after-treatment, e.g. cleaning or removal of oxides on underlying conductors
• CPC Class Codes: H01L 21/76826 by contacting the layer with gases, liquids or plasmas
• CPC Class Codes: H01L 21/76843 formed in openings in a dielectric
• CPC Class Codes: H01L 21/76861 Post-treatment or after-treatment not introducing additional chemical elements into the layer
• CPC Class Codes: H01L 21/76862 Bombardment with particles, e.g. treatment in noble gas plasmas; UV irradiation

Abstract

The embodiments fill the needs of systems and processes that perform substrate surface treatment to provide homogenous, clean, and sometimes activated surface in order to provide good adhesion between layers to improve metal migration and void propagation. In an exemplary embodiment, a proximity head for treating a substrate surface is provided. The proximity head is configured to dispense a treatment gas to treat an active process region of a substrate surface under the proximity head. The proximity head covers the action process region of the substrate surface and the proximity head includes at least one vacuum channel to pull excess treatment gas from a reaction volume between the proximity head and the substrate. The proximity head has an excitation chamber to excite the treatment gas before the treatment gas being dispensed on the active process region portion of the substrate surface.

Claims

1. An apparatus for treating a surface of a substrate, comprising:

a substrate support configured to support the substrate;

a proximity head configured to dispense a treatment gas to treat an active process region of a substrate surface under the proximity head, wherein the proximity head covers the action process region of the substrate surface and the proximity head includes at least one vacuum channel to pull excess treatment gas from a reaction volume between the proximity head and the substrate, the proximity head having an excitation chamber to excite the treatment gas before the treatment gas being dispensed on the active process region portion of the substrate surface.

2. The apparatus of claim 1, wherein there are two vacuum channels, one on each side of at least one gas channel to dispense the treatment gas.

3. The apparatus of claim 1, wherein there is one vacuum channel surrounding at least one gas channel to dispense the treatment gas.

4. The apparatus of claim 1, wherein the length of the proximity head is greater than the diameter of the substrate, the dispensed treatment gas covering a length equal to or greater than the diameter of the substrate.

5. The apparatus of claim 1, wherein the length of the proximity head is less than the diameter of the substrate, the dispensed treatment gas covering a length less than the diameter of the substrate.

6. The apparatus of claim 1, wherein the proximity head rotates about an axis perpendicular to the substrate.

7. The apparatus of claim 1, wherein the proximity head is configured to move to a next surface treatment location.

8. The apparatus of claim 1, wherein the dispensed treatment gas is plasmarized.

9. The apparatus of claim 1, wherein the dispensed treatment gas is plasmarized by a radio-frequency (RF) power source coupled to a substrate support or coupled to the proximity head, or in a remote plasma reactor.

10. The apparatus of claim 1, wherein the treatment gas is selected form a group consisting of H₂, NH₃, NF₃, NH₄F, O₂, and N₂.

11. The apparatus of claim 10, wherein the treatment gas is diluted by an inert gas.

12. The apparatus of claim 1, wherein the treatment gas is excited by a hot-filament, by laser, by ultra-violent (UV), or by plasma.

13. The apparatus of claim 1, wherein the proximity head is made of material selected from a group consisting of stainless steel, alumina (Al₂O₃), quartz, SiC, and Silicon.

14. A proximity head for treating a substrate surface, comprising:

the proximity head configured to dispense a treatment gas to treat an active process region of a substrate surface under the proximity head, wherein the proximity head covers the action process region of the substrate surface and the proximity head includes at least one vacuum channel to pull excess treatment gas from a reaction volume between the proximity head and the substrate, the proximity head having an excitation chamber to excite the treatment gas before the treatment gas being dispensed on the active process region portion of the substrate surface.

15. A method of treatment a substrate surface, comprising:

moving a proximity head for surface treatment above a substrate, wherein the proximity head has at least one gas channel configured to dispense a treatment gas on a region of the substrate surface, the proximity head having at least one vacuum channel used to vacuum excess treatment gas from a reaction volume underneath the proximity head, and the proximity head for surface treatment covering the region of the substrate surface;

exciting the treatment gas in an excitation chamber of the proximity head before the treatment gas is dispensed on the region of the substrate surface; and

dispensing the excited treatment gas on the region of the substrate surface to treat the substrate surface.

16. The method of claim 15, wherein the surface treatment is used to remove surface impurities prior to the deposition of a film on the substrate.

17. The method of claim 15, wherein the surface treatment is used to increase initial deposition sites for an ALD of a barrier layer for copper.

18. The method of claim 15, wherein the surface treatment is performed on a deposited liner layer to enhance nucleation for an electroless copper seed layer to be deposited, or to remove contaminants on the deposited liner layer prior to the deposition of a copper seed layer.

19. The method of claim 17, wherein the metals in the barrier layer is selected from the group consisting of tantalum (Ta), titanium (Ti), tungsten (W), zirconium (Zr), hafnium (Hf), molybdenum (Mo), niobium (Nb), vanadium (V), ruthenium (Ru) and chromium (Cr).

20. The method of claim 18, wherein the metals in the deposited liner layer is selected from the group consisting of tantalum (Ta), titanium (Ti), tungsten (W), zirconium (Zr), hafnium (Hf), molybdenum (Mo), niobium (Nb), vanadium (V), ruthenium (Ru) and chromium (Cr).

21. The method of claim 15, wherein the treatment gas is excited by a hot-filament, by laser, by ultra-violent (UV), or by plasma.