Polymer Brushes

• US 20080262128A1
• Filed: 06/30/2008
• Published: 10/23/2008
• Est. Priority Date: 06/14/2005
• Status: Active Grant

• Current Assignee: Siemens Energy Incorporated (Siemens AG)
• Original Assignee: Siemens Power Generation, Inc.
• Inventors: Wood, John W., Stevens, Gary, Smith, James D.B.
• Granted Patent: US 8,357,433 B2
• Time in Patent Office: Days
• US Class Current: 523/400
• CPC Class Codes: C08G 83/001 Macromolecular compounds containing organic and inorganic sequences, e.g. organic polymers grafted onto silica
• CPC Class Codes: C08J 2363/00 Characterised by the use of epoxy resins; Derivatives of epoxy resins
• CPC Class Codes: C08J 5/046 with synthetic macromolecular fibrous material
• CPC Class Codes: C08K 3/14 Carbides
• CPC Class Codes: C08K 3/22 of metals
• CPC Class Codes: C08L 2666/54 Inorganic substances
• CPC Class Codes: C08L 63/00 Compositions of epoxy resins; Compositions of derivatives of epoxy resins
• CPC Class Codes: D21H 13/44 Flakes, e.g. mica, vermiculite
• CPC Class Codes: H05K 1/0373 containing additives, e.g. fillers H05K1/036 takes precedence
• CPC Class Codes: H05K 2201/0251 Non-conductive microfibers relatively short elongated particles H05K2201/0248
• CPC Class Codes: H05K 2201/0278 Polymeric fibers
• CPC Class Codes: Y10T 428/23943 Flock surface
• CPC Class Codes: Y10T 428/2907 with coating or impregnation
• CPC Class Codes: Y10T 428/2913 Rod, strand, filament or fiber
• CPC Class Codes: Y10T 428/292 In coating or impregnation
• CPC Class Codes: Y10T 428/2924 Composite
• CPC Class Codes: Y10T 428/2925 Helical or coiled
• CPC Class Codes: Y10T 428/2933 Coated or with bond, impregnation or core
• CPC Class Codes: Y10T 428/2936 Wound or wrapped core or coating [i.e., spiral or helical]
• CPC Class Codes: Y10T 428/2947 Synthetic resin or polymer in plural coatings, each of different type
• CPC Class Codes: Y10T 442/2738 : Coating or impregnation intended to function as an adhesive to solid surfaces subsequently associated therewith

Abstract

Polymer brushes (50) in a resin that create phonon pathways therein The polymer brushes themselves comprise structured polymer hairs having a density of 0.8 to 1.0 g/cc, a chain length of 1 to 1000 nm, and a thermal conductivity of 0.5 to 5.0 W/mK. The polymer brushes are 10-25% by volume of the resin, and the polymer hairs can orient surrounding resin molecules to the polymer hairs alignment (55).

Claims

1. A resin comprising:

polymer brushes comprising structured polymer hairs having a density of 0.8 to 1.0 g/cc and a chain length of 1 to 1000 nm, and a thermal conductivity of 0.5 to 5.0 W/mK;

wherein said polymer hairs are configured to be sufficiently rigid for ordering said polymer hairs at the density and the chain length effective to reduce entanglements; and

wherein an alignment of said polymer hairs orients surrounding resin molecules effective to form phonon channels within said resin.

2. The resin on claim 1, wherein said polymer brushes are created on the surface of a substrate.

3. The resin on claim 2, wherein said polymer brushes are formed from vinyl monomers.

4. The resin on claim 1, wherein said polymer brushes are formed from a liquid crystal thermoset epoxy.

5. The resin on claim 1, wherein filler materials are added to said resin, and wherein said filler materials comprise 5-40% by volume of said highly structured resin and wherein said filler materials have aspect ratios of 3-100.

6. The resin on claim 1, wherein said polymer brushes are formed after said resin is impregnated into a porous media.

7. The resin on claim 6, wherein said porous media is a paper matrix.

8. The resin on claim 7, wherein said paper matrix is a mica-glass insulating paper.

9. The resin on claim 1, wherein the polymer hairs have a chain length of 2 to 100 nm.

10. The resin on claim 1, wherein said resin is an epoxy resin.

11. The resin on claim 1, wherein said resin is a hydrocarbon.

12. The resin on claim 11, wherein said hydrocarbon is polybutadiene and other resins may include, polysiloxanes, aromatic polyesters and aromatic polyamides.

13. The resin of claim 1, wherein said polymer brushes comprise 10-25% by volume of said resin.

14. An insulating tape comprising the resin of claim 1.

15. An epoxy resin comprising:

filler materials that comprises 5-40% by volume of said highly structured resin and wherein said filler materials have aspect ratios of 3-100; and

polymer brushes, wherein said polymer brushes bridge said filler materials within said epoxy resin;

wherein said filler materials form a continuous organic-inorganic composite with said epoxy resin and said polymer brushes;

wherein said polymer brushes comprise 10-25% by volume of said epoxy resin;

wherein said bridged filler materials create phonon channels within said epoxy resin.

16. The epoxy resin of claim 15, wherein said epoxy resin is selected from at least one of liquid crystal thremoset polymers, interpenetrating networks, polymer brush type matrices, expanding polymers, ladder polymers, star polymers and structured organic-inorganic hybrids.

17. The epoxy resin of claim 16, wherein said filler materials comprise one or more of Al2O3, AlN, MgO, ZnO, BeO, BN, Si3N4, SiC and SiO2.

18. The epoxy resin of claim 15, wherein the polymer brushes comprise structured polymer hairs having a density of 0.8 to 1.0 g/cc and a chain length of 1 to 1000 nm, and a thermal conductivity of 0.5 to 5.0 W/mK, wherein said polymer hairs are configured to be sufficiently rigid for ordering the polymer hairs at the density and the chain length effective to reduce entanglements.

19. An insulating tape comprising the epoxy resin of claim 15.