USING MULTIVARIATE HEALTH METRICS TO DETERMINE MARKET SEGMENT AND TESTING REQUIREMENTS

• US 20080262769A1
• Filed: 04/23/2007
• Published: 10/23/2008
• Est. Priority Date: 04/23/2007
• Status: Abandoned Application

• Current Assignee: Advanced Micro Devices, Inc.
• Original Assignee: Advanced Micro Devices, Inc.
• Inventors: Vijayaraghavan, Rajesh, Cherry, Gregory A., De La Fuente, Luis, KADOSH, DANIEL, Bowen, Carl L.
• Application Number:
  US11/738,540
• Publication Number:
  US 20080262769A1
• Time in Patent Office: Days
• US Class Current: 702/82
• CPC Class Codes: G01R 31/2855 Environmental, reliability or burn-in testing
• CPC Class Codes: G01R 31/2894 Aspects of quality control [QC] G01R31/31718 takes precedence; program control for QC G05B19/41875

Abstract

A method includes receiving a first set of parameters associated with a particular die. A health metric for a particular die is determined using a multivariate analysis of the first set of parameters. The health metric incorporates at least one performance metric. At least one of a market segment designator or a testing plan associated with the particular die is determined based on the health metric.

Claims

1. A method, comprising:

receiving a first set of parameters associated with a particular die;

determining a health metric for the particular die using a multivariate analysis of the first set of parameters, the health metric incorporating at least one performance metric;

determining at least one of a market segment designator or a testing plan associated with the particular die based on the health metric.

2. The method of claim 1, further comprising testing the particular die in accordance with the testing plan.

3. The method of claim 1, wherein the testing plan specifies burn-in test requirements.

4. The method of claim 3, wherein the burn-in test requirements specify one of a reduced burn-in test or a full burn-in test.

5. The method of claim 1, further comprising:

determining health metrics for a plurality of die on a wafer;

determining if a percentage of the plurality of die have health metrics exceeding a first threshold; and

configuring the testing plan to specify that the plurality of die are to skip burn-in testing responsive to determining that the percentage of the plurality of die have health metrics exceeding the first threshold.

6. The method of claim 1, further comprising:

determining health metrics for a plurality of die on a wafer;

determining if a percentage of the plurality of die have health metrics exceeding a first threshold; and

assigning the plurality of die a common market segment designator responsive to determining that the percentage of the plurality of die have health metrics exceeding the first threshold.

7. The method of claim 1, further comprising:

determining first health metrics for a plurality of die on a wafer;

determining if a percentage of the plurality of die have first health metrics exceeding a first threshold; and

determining second health metrics for each die in the plurality by incorporating health data associated with neighboring die into the first health metrics responsive to determining that the percentage of the plurality of die have first health metrics does not exceed the first threshold.

8. The method of claim 1, wherein the performance metric comprises at least one of a speed metric, a leakage metric, and a minimum voltage metric.

9. The method of claim 1, wherein the health metric incorporates at least one non-yield performance component and at least one yield component.

10. The method of claim 1, further comprising determining the health metric using at least one of a principal component analysis model, a recursive principal component analysis model, and a k-nearest neighbor model.

11. A method, comprising:

receiving a first set of parameters associated with a particular die;

determining a health metric for the particular die using a multivariate analysis of the first set of parameters;

determining a market segment designator for the particular die based on the health metric.

12. The method of claim 11, further comprising:

determining health metrics for a plurality of die on a wafer;

determining if a percentage of the plurality of die have health metrics exceeding a first threshold; and

assigning the plurality of die a common market segment designator responsive to determining that the percentage of the plurality of die have health metrics exceeding the first threshold.

13. The method of claim 11, further comprising installing the particular die into a system matching the market segment designator.

14. The method of claim 11, wherein the health metric incorporates at least one of a speed metric, a leakage metric, and a minimum voltage metric.

15. The method of claim 11, wherein the health metric incorporates at least one non-yield performance component and at least one yield component.

16. The method of claim 11, further comprising determining the health metric using at least one of a principal component analysis model, a recursive principal component analysis model, and a k-nearest neighbor model.

17. A method, comprising:

receiving a first set of parameters associated with a particular die;

determining a health metric for the particular die using a multivariate analysis of the first set of parameters, the health metric incorporating at least one performance metric;

determining a testing plan associated with the particular die based on the health metric.

18. The method of claim 17, further comprising testing the particular die in accordance with the testing plan.

19. The method of claim 17, wherein the testing plan specifies burn-in test requirements.

20. The method of claim 19, wherein the burn-in test requirements specify one of a reduced burn-in test or a full burn-in test.

21. The method of claim 17, further comprising:

determining first health metrics for a plurality of die on a wafer;

determining if a percentage of the plurality of die have first health metrics exceeding a first threshold; and

determining second health metrics for each die in the plurality of die by incorporating health data associated with neighboring die into the first health metrics responsive to determining that the percentage of the plurality of die have first health metrics does not exceed the first threshold.

22. The method of claim 17, wherein the performance metric comprises at least one of a speed metric, a leakage metric, and a minimum voltage metric.

23. The method of claim 17, wherein the health metric incorporates at least one non-yield performance component and at least one yield component.

24. The method of claim 17, further comprising determining the health metric using at least one of a principal component analysis model, a recursive principal component analysis model, and a k-nearest neighbor model.