BUILDING SLAB, FLOOR PANELS IN PARTICULAR, AND METHOD OF MANUFACTURING THE SAME
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Accused Products
Abstract
A building board, in particular a flooring panel, with a core comprising at least one upper layer and one lower layer of wood fibers or wood chips glued with an adhesive and pressed to one another, which is provided on at least its top side with a pattern that is covered with a sealing coat and in which sealing coat a structure corresponding to the pattern is embossed, is characterized in that at least the chips of the upper layer are glued with an adhesive having thermoplastic properties, and the upper layer has recesses formed at least directly beneath the pattern.
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Citations
40 Claims
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1-19. -19. (canceled)
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20. A building board with a core comprising:
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at least one upper layer and one lower layer of wood fibers or wood chips glued with an adhesive and pressed to one another; and a pattern provided on a top side that is covered with a sealing coat, wherein the sealing coat includes an embossed surface structure corresponding to the pattern the adhesive includes thermoplastic properties, and the upper layer includes recesses formed at least directly beneath the pattern. - View Dependent Claims (21, 22, 23, 24, 25, 26, 27, 28, 29, 30, 31, 32, 33, 34, 35)
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- 36. A method for manufacturing a building board from several plies of scattered wood fibers or wood chips glued with an adhesive and pressed to one another to form a core, wherein the wood fibers or wood chips are glued for at least the last ply with an adhesive having thermoplastic properties.
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40. A building board comprising:
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an upper layer and a lower layer of wood fibers or wood chips glued with an adhesive and pressed to one another by an adhesive, the adhesive for the upper layer having thermoplastic properties, which are different than properties of the adhesive for the lower layer; a pattern provided on a top side that is covered with a sealing coat having an embossed surface structure corresponding to the pattern, wherein the upper layer includes recesses formed directly beneath the pattern.
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Specification