BUILDING SLAB, FLOOR PANELS IN PARTICULAR, AND METHOD OF MANUFACTURING THE SAME

• US 20080263985A1
• Filed: 04/17/2008
• Published: 10/30/2008
• Est. Priority Date: 04/27/2007
• Status: Active Grant

• Current Assignee: SWISS KRONO Tec AG
• Original Assignee: Kronotec AG Luzern Switzrland
• Inventors: Hasch, Joachim, Grunwald, Dirk
• Granted Patent: US 7,989,050 B2
• Time in Patent Office: Days
• US Class Current: 52/506.01
• CPC Class Codes: B44C 5/043 containing wooden elements
• CPC Class Codes: B44C 5/0492 containing wooden elements
• CPC Class Codes: E04F 15/02 Flooring or floor layers composed of a number of similar elements of webs E04F15/16
• CPC Class Codes: Y10T 428/24091 with additional layer[s]
• CPC Class Codes: Y10T 428/24124 Fibers
• CPC Class Codes: Y10T 428/24438 Artificial wood or leather grain surface
• CPC Class Codes: Y10T 428/24612 Composite web or sheet
• CPC Class Codes: Y10T 428/24876 Intermediate layer contains particulate material [e.g., pigment, etc.]
• CPC Class Codes: Y10T 428/24934 including paper layer
• CPC Class Codes: Y10T 428/2495 Thickness [relative or absolute]
• CPC Class Codes: Y10T 428/24992 Density or compression of components
• CPC Class Codes: Y10T 428/31989 Of wood

Abstract

A building board, in particular a flooring panel, with a core comprising at least one upper layer and one lower layer of wood fibers or wood chips glued with an adhesive and pressed to one another, which is provided on at least its top side with a pattern that is covered with a sealing coat and in which sealing coat a structure corresponding to the pattern is embossed, is characterized in that at least the chips of the upper layer are glued with an adhesive having thermoplastic properties, and the upper layer has recesses formed at least directly beneath the pattern.

Claims

1-19. -19. (canceled)

20. A building board with a core comprising:

at least one upper layer and one lower layer of wood fibers or wood chips glued with an adhesive and pressed to one another; and

a pattern provided on a top side that is covered with a sealing coat, wherein

the sealing coat includes an embossed surface structure corresponding to the pattern

the adhesive includes thermoplastic properties, and

the upper layer includes recesses formed at least directly beneath the pattern.

21. The building board according to claim 20, wherein a composition of the adhesive for the upper layer is different from a composition of the adhesive for the lower layer.

22. The building board according to claim 21, wherein the adhesive for the upper layer has higher thermoplastic properties than the adhesive for the lower layer.

23. The building board according to claim 20, wherein the adhesive for the upper layer contains alone or in any desired combination at least one of:

a PF-novolak;

an acrylate dispersion;

an ethylene vinyl acetate dispersion (EVA);

a polyvinyl acetate dispersion (PVAc);

a polyvinyl alcohol (PVA); and

a silane-based system.

24. The building board according to claim 20, wherein a thickness of the upper layer is approximately one third of a thickness of the core.

25. The building board according to claim 24, wherein the upper layer is a postformable upper layer.

26. The building board according to claim 20, wherein the surface structure has at least in part a depth of at least 500 μ

m.

27. The building board according to claim 20, wherein the pattern is embodied as a printed paper ply.

28. The building board according to claim 20, wherein the pattern is embodied as at least one paint coat printed directly onto the core.

29. The building board according to claim 20, wherein the sealing coat comprises at least one varnish layer hardenable by UV or electron beams.

30. The building board according to claim 20, wherein the sealing coat comprises at least one resin layer, on a basis of UF, MF, MUF.

31. The building board according to claim 30, further comprising abrasion-resistant particles added to the sealing coat.

32. The building board according to claim 20, wherein the sealing coat is embodied as a resin-impregnated overlay.

33. The building board according to claim 20, further comprising a counteracting layer applied to an underside of the core.

34. The building board according to claim 33, wherein the counteracting layer is embodied as a resin-impregnated paper ply.

35. The building board according to claim 33, wherein the counteracting layer is embodied as a directly applied varnish layer or resin layer.

36. A method for manufacturing a building board from several plies of scattered wood fibers or wood chips glued with an adhesive and pressed to one another to form a core, wherein the wood fibers or wood chips are glued for at least the last ply with an adhesive having thermoplastic properties.

37. The method according to claim 36, wherein only the wood fibers or wood chips for the last ply are glued with an adhesive having thermoplastic properties.

38. The method according to claim 36, wherein the adhesive having thermoplastic properties is applied to the wood fibers or wood chips in addition to an adhesive having thermosetting properties.

39. The method according to claim 36, further comprising applying a decorative layer to a top side of the core and a sealing coat on top of that the decorative layer, and applying a counteracting layer to the underside of the core, and pressing under influence of pressure and temperature, and embossing a deep surface structure in the sealing coat such that an upper layer is deformed at least directly beneath the pattern.

40. A building board comprising:

an upper layer and a lower layer of wood fibers or wood chips glued with an adhesive and pressed to one another by an adhesive, the adhesive for the upper layer having thermoplastic properties, which are different than properties of the adhesive for the lower layer;

a pattern provided on a top side that is covered with a sealing coat having an embossed surface structure corresponding to the pattern, wherein

the upper layer includes recesses formed directly beneath the pattern.