Antenna in Package with Reduced Electromagnetic Interaction with on Chip Elements
First Claim
Patent Images
1. An integrated circuit package for an electronic device comprising:
- an integrated circuit die;
a first set of electrically conductive elements coupled to the integrated circuit die; and
an antenna;
the antenna and elements of the first set of electrically conductive elements being spaced within the integrated circuit package such that no element of the first set of electrically conductive elements is in the projection of the antenna.
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Abstract
A IC package for a wireless device includes an antenna that is attached to the chip. The electrically conductive elements of the antenna are spaced away from the antenna and particularly the endpoint of the antenna to prevent interference with the antenna. An element on the IC package may be shielded antenna. The antenna may have the shape of a space-filling curve, including a Hilbert, box-counting or grid dimension curve.
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Citations
48 Claims
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1. An integrated circuit package for an electronic device comprising:
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an integrated circuit die; a first set of electrically conductive elements coupled to the integrated circuit die; and an antenna; the antenna and elements of the first set of electrically conductive elements being spaced within the integrated circuit package such that no element of the first set of electrically conductive elements is in the projection of the antenna. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29, 30, 31, 32, 33, 34, 35, 36, 37, 38, 39, 40, 41, 42, 43, 44, 46, 47, 48)
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45. A wireless device comprising:
a radio frequency (RF) communication integrated circuit package, including; an integrated circuit die; a first set of electrically conductive elements coupled to the integrated circuit die; an antenna; the antenna and the first set of electrically conductive elements being spaced within the integrated circuit package such that no element of the first set of electrically conductive elements is in the projection of the antenna; and a metallic shielding structure coupled to a ground potential and positioned within the integrated circuit package to electrically isolate the antenna from the integrated circuit die.
Specification