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Method of Manufacturing an Image Sensor and Image Sensor

  • US 20080265348A1
  • Filed: 05/12/2005
  • Published: 10/30/2008
  • Est. Priority Date: 06/09/2004
  • Status: Abandoned Application
First Claim
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1. Method of manufacturing a back-side (14) illuminated image sensor (1), comprising the steps of:

  • starting with a wafer (2) having a first (3) and a second (4) surface,providing light sensitive pixel regions (5) extending into the wafer from the first surface (3),securing the wafer onto a protective substrate (7) such that the first surface (3) faces the protective substrate (7),characterized in that the wafer comprises a substrate (8) of a first material with an optical transparent layer (9) and a layer of semiconductor material (10), wherein the substrate (8) is selectively removed from the layer (10) of semiconductor material by using the optical transparent layer (9) as stopping layer.

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