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METHOD FOR FABRICATING A HIGH-K DIELECTRIC LAYER

  • US 20080265380A1
  • Filed: 04/16/2008
  • Published: 10/30/2008
  • Est. Priority Date: 10/20/2005
  • Status: Active Grant
First Claim
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1. A method of fabricating a high-k dielectric layer comprising:

  • depositing onto a substrate a high-k dielectric material so as to form a high-k dielectric layer with a first thickness; and

    thinning the high-k dielectric layer to a second thickness to form the high-k dielectric layer having a higher density than is obtained by depositing the high-k dielectric material with the second thickness.

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