Phase change cooled power electronic module

• US 20080266801A1
• Filed: 04/30/2007
• Published: 10/30/2008
• Est. Priority Date: 04/30/2007
• Status: Abandoned Application

• Current Assignee: Rockwell Automation Technologies Incorporated (Rockwell Automation, Inc.)
• Original Assignee: Rockwell Automation Technologies Incorporated (Rockwell Automation, Inc.)
• Inventors: Kannenberg, Daniel G., Gollhardt, Neil, Weiss, Bruce W., Kaishian, Steven C., Ahangar, Abdolmehdi Kaveh
• Application Number:
  US11/796,765
• Publication Number:
  US 20080266801A1
• Time in Patent Office: Days
• US Class Current: 361/700
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/49111 the connectors connecting two common bonding areas, e.g. Litz or braid wires
• CPC Class Codes: H01L 2224/49113 the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body, e.g. converging wires
• CPC Class Codes: H01L 2224/49175 Parallel arrangements
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 23/427 Cooling by change of state, e.g. use of heat pipes by liquefied gas H01L23/445
• CPC Class Codes: H01L 25/072 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/13034 Silicon Controlled Rectifier [SCR]
• CPC Class Codes: H01L 2924/1305 Bipolar Junction Transistor [BJT]
• CPC Class Codes: H01L 2924/13055 Insulated gate bipolar transistor [IGBT]
• CPC Class Codes: H02M 7/003 Constructional details, e.g. physical layout, assembly, wiring or busbar connections
• CPC Class Codes: H05K 7/20927 Liquid coolant without phase change
• CPC Class Codes: H05K 7/20936 Liquid coolant with phase change

Abstract

A power electronic module is cooled by a phase change heat spreader or cooling device. The module may include switched or unswitched devices, such as power transistors, diodes, and so forth, forming circuits such as rectifiers, inverters, converters, or the like, or portions of such circuits. Heat is transferred to the heat spreader in which a continuous phase change cycle takes place to cool the circuit components. The heat spreader may extend over an area sufficient to reduce the temperature of the components, and ultimately will render portions of the overall structure more isothermal.

Claims

1. An electronic power module comprising:

a plurality of power electronic devices mounted to a first side of a support; and

a phase change heat spreader adjacent to a second side of the support opposite the first side and configured to draw heat from the devices during operation.

2. The electronic power module of claim 1, wherein the power electronic devices include a plurality of diodes.

3. The electronic power module of claim 2, wherein diodes are interconnected to form a rectifier.

4. The electronic power module of claim 1, wherein the power electronic devices include a plurality of solid state switches.

5. The electronic power module of claim 4, wherein the solid state switches are interconnected to form a power converter.

6. The electronic power module of claim 5, wherein the power converter is a three phase inverter.

7. The electronic power module of claim 1, wherein the power electronic devices include a plurality of solid state switches and diodes interconnected to form a rectifier and three phase inverter.

8. The electronic power module of claim 1, wherein the phase change heat spreader includes an evaporator side adjacent to the second side of the support, a wick structure for channeling condensate to the evaporator side, a condenser side opposite the evaporator side, and a cooling medium sealed between the evaporator side and the condenser side at a partial pressure that permits evaporation and condensation of the cooling medium during operation.

9. The electronic power module of claim 8, wherein the wick structure includes a primary wick structure disposed adjacent to the evaporator side and a secondary wick structure extending from the condenser side to the primary wick structure for wicking the cooling medium from the condenser to the primary wick structure.

10. The electronic power module of claim 8, wherein the support forms the evaporator side of the phase change heat spreader.

11. The electronic power module of claim 1, comprising a heat dissipation structure thermally coupled to the phase change heat spreader for dissipating heat transferred to the phase change heat spreader.

12. An electronic power module comprising:

a plurality of solid state power electronic switches mounted to a first side of a support, the power electronic switches being interconnected to form a power converter; and

a phase change heat spreader adjacent to a second side of the support opposite the first side and configured to draw heat from the power electronic switches during operation.

13. The electronic power module of claim 12, wherein the power electronic switches form a three phase inverter.

14. The electronic power module of claim 12, further comprising a plurality of diodes mounted on the first side of the support and forming a rectifier.

15. The electronic power module of claim 12, wherein the phase change heat spreader includes an evaporator side adjacent to the second side of the support, a wick structure for channeling condensate to the evaporator side, a condenser side opposite the evaporator side, and a cooling medium sealed between the evaporator side and the condenser side at a partial pressure that permits evaporation and condensation of the cooling medium during operation.

16. The electronic power module of claim 15, wherein the wick structure includes a primary wick structure disposed adjacent to the evaporator side and a secondary wick structure extending from the condenser side to the primary wick structure for wicking the cooling medium from the condenser to the primary wick structure.

17. The electronic power module of claim 15, wherein the support forms the evaporator side of the phase change heat spreader.

18. An electronic power module comprising:

a plurality of solid state power electronic switches and diodes mounted to a first side of a support, the power electronic switches being interconnected to form at least one portion of a power inverter; and

a phase change heat spreader adjacent to a second side of the support opposite the first side and configured to draw heat from the power electronic switches and diodes during operation.

19. The electronic power module of claim 18, wherein the power electronic switches include a plurality of switches in parallel.

20. The electronic power module of claim 18, wherein the power electronic switches and diodes form an inverter for one power phase.

21. The electronic power module of claim 18, wherein the power electronic switches and diodes form a three phase inverter.

22. A method for making an electronic power module comprising:

mounting a plurality of power electronic devices to a first side of a support; and

disposing a phase change heat spreader adjacent to a second side of the support opposite the first side and to draw heat from the devices during operation.

23. A method for making an electronic power module comprising:

mounting a plurality of solid state power electronic switches and diodes to a first side of a support, the power electronic switches being interconnected to form at least one portion of a power inverter; and

disposing a phase change heat spreader adjacent to a second side of the support opposite the first side and to draw heat from the power electronic switches and diodes during operation.