Phase change cooled electrical connections for power electronic devices

• US 20080266802A1
• Filed: 04/30/2007
• Published: 10/30/2008
• Est. Priority Date: 04/30/2007
• Status: Abandoned Application

• Current Assignee: Rockwell Automation Technologies Incorporated (Allen-Bradley Co., Inc.)
• Original Assignee: Rockwell Automation Technologies Incorporated (Allen-Bradley Co., Inc.)
• Inventors: Weiss, Bruce W., Phillips, Mark G.
• Application Number:
  US11/796,826
• Publication Number:
  US 20080266802A1
• Time in Patent Office: Days
• US Class Current: 361/700
• CPC Class Codes: H01L 2224/04042 Bonding areas specifically adapted for wire connectors, e.g. wirebond pads
• CPC Class Codes: H01L 2224/45015 being circular
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/49111 the connectors connecting two common bonding areas, e.g. Litz or braid wires
• CPC Class Codes: H01L 2224/49175 Parallel arrangements
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2224/85 using a wire connector
• CPC Class Codes: H01L 23/427 Cooling by change of state, e.g. use of heat pipes by liquefied gas H01L23/445
• CPC Class Codes: H01L 24/02 Bonding areas on insulating substrates, e.g. chip carriers, H01L23/49816, H01L23/49838, H01L23/5389; Manufacturing methods related thereto
• CPC Class Codes: H01L 24/05 of an individual bonding area
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 24/49 of a plurality of wire connectors
• CPC Class Codes: H01L 24/85 using a wire connector wire bonding in general B23K20/004
• CPC Class Codes: H01L 25/072 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/13034 Silicon Controlled Rectifier [SCR]
• CPC Class Codes: H01L 2924/1305 Bipolar Junction Transistor [BJT]
• CPC Class Codes: H01L 2924/207 Diameter ranges
• CPC Class Codes: H02M 7/003 : Constructional details, e.g. physical layout, assembly, wiring or busbar connections
• CPC Class Codes: H05K 7/20936 : Liquid coolant with phase change

Abstract

A technique is disclosed for cooling connections points in power electronic circuits, such as points at which wire bonding connections are made. A phase change heat spreader is thermally coupled at or near the connection point and a continuous phase change takes place in the heat spreader to extract heat from the connection point during operation. The heat spreader may extend over a area larger than the connection point to enhance cooling and to dissipate heat over a larger area. Small, specifically directed applications are possible in which specific points are cooled together or individually.

Claims

1. A power electronic device comprising:

an electrical connection point;

an electrical conductor mechanically and electrically coupled to the connection point for conducting current to or from power electronic circuitry; and

a phase change heat spreader disposed adjacent to the electrical connection point and configured to draw heat from the connection point during operation.

2. The power electronic device of claim 1, further comprising a power electronic circuit, wherein the connection point is a conductive pad disposed on the power electronic circuit.

3. The power electronic device of claim 1, wherein the electrical connection point is a conductive pad of a terminal.

4. The power electronic device of claim 1, wherein the electrical conductor is a conductive wire bonded to the connection point.

5. The power electronic device of claim 1, wherein the electrical conductor includes a plurality of wires separately bonded to the connection point.

6. The power electronic device of claim 1, wherein the connection point is provided on a first side of a support assembly, and wherein the phase change heat spreader is disposed adjacent to a second side of the support assembly opposite the first side.

7. The power electronic device of claim 1, wherein the phase change heat spreader extends over an area greater than an area of the connection point.

8. The power electronic device of claim 1, wherein the phase change heat spreader includes an evaporator side adjacent to the connection point, a wick structure for channeling condensate to the evaporator side, a condenser side opposite the evaporator side, and a cooling medium sealed between the evaporator side and the condenser side at a partial pressure that permits evaporation and condensation of the cooling medium during operation.

9. The power electronic device of claim 8, wherein the wick structure includes a primary wick structure disposed adjacent to the evaporator side and a secondary wick structure extending from the condenser side to the primary wick structure for wicking the cooling medium from the condenser to the primary wick structure.

10. The power electronic device of claim 8, wherein the cooling medium a water-based liquid.

11. A power electronic device comprising:

a support structure;

a power electronic circuit disposed on a first side of the support structure;

a connection point;

an electrical conductor mechanically and electrically coupled to the connection point for conducting current to or from power electronic circuit; and

a phase change heat spreader disposed on a second side of the support opposite the first side and configured to draw heat from the connection point during operation.

12. The power electronic device of claim 11, wherein the electrical conductor is a conductive wire bonded to the connection point.

13. The power electronic device of claim 11, wherein the electrical conductor includes a plurality of wires separately bonded to the connection point.

14. The power electronic device of claim 11, wherein the phase change heat spreader extends over an area greater than an area of the connection point.

15. The power electronic device of claim 11, wherein the phase change heat spreader includes an evaporator side adjacent to the connection point, a wick structure for channeling condensate to the evaporator side, a condenser side opposite the evaporator side, and a cooling medium sealed between the evaporator side and the condenser side at a partial pressure that permits evaporation and condensation of the cooling medium during operation.

16. The power electronic device of claim 15, wherein the wick structure includes a primary wick structure disposed adjacent to the evaporator side and a secondary wick structure extending from the condenser side to the primary wick structure for wicking the cooling medium from the condenser to the primary wick structure.

17. The power electronic device of claim 15, wherein the cooling medium a water-based liquid.

18. A power electronic device comprising:

a support structure;

a power electronic circuit disposed on a first side of the support structure, the power electronic circuit including a connection pad;

a connection point disposed adjacent to the power electronic circuit;

a wire bond connection between the connection pad and the connection point; and

a phase change heat spreader disposed on adjacent to at least one of the connection pad and the connection point and configured to draw heat from the connection pad or the connection point during operation.

19. The power electronic device of claim 18, wherein the power electronic circuit includes a chip enclosure and the phase change heat spreader extends beneath the chip enclosure.

20. The power electronic device of claim 18, wherein the wire bond connection includes a plurality of wires separately bonded to the connection pad and to the connection point.

21. The power electronic device of claim 18, wherein the phase change heat spreader extends over an area greater than an area of the connection pad and the connection point.

22. A method for making a power electronic device comprising:

establishing an electrical connection between a power electronic circuit and a connection point; and

disposing a phase change heat spreader adjacent to the connection point to draw heat from the connection point during operation of the power electronic circuit.