Pressure-contact power semiconductor module and method for producing the same

• US 20080266812A1
• Filed: 04/04/2008
• Published: 10/30/2008
• Est. Priority Date: 04/04/2007
• Status: Active Grant

• Current Assignee: Semikron Elektronik GmbH & Company KG (Heilbronner Holding GbR)
• Original Assignee: Semikron Elektronik GmbH & Company KG (Heilbronner Holding GbR)
• Inventors: Ebersberger, Frank, Steger, Jurgen
• Granted Patent: US 8,368,207 B2
• Time in Patent Office: Days
• US Class Current: 361/721
• CPC Class Codes: H01L 24/72 Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
• CPC Class Codes: H01L 25/072 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/01005 Boron [B]
• CPC Class Codes: H01L 2924/01006 Carbon [C]
• CPC Class Codes: H01L 2924/01033 Arsenic [As]
• CPC Class Codes: H01L 2924/01047 Silver [Ag]
• CPC Class Codes: H01L 2924/01068 Erbium [Er]
• CPC Class Codes: H01L 2924/01082 Lead [Pb]
• CPC Class Codes: H01L 2924/19041 being a capacitor

Abstract

A pressure-contact power semiconductor module is arranged on a heat sink. The power semiconductor module is used with at least one substrate provided with conductor tracks and power semiconductor components. The module has a mounting body, on the underside of which the at least one substrate is arranged, and which is formed with cutouts. The module also includes a load connection element which is provided with contact feet that project away from strip sections and make pressure contact with the conductor tracks. The power semiconductor module additionally has a dimensionally stable cover, which covers the mounting body on all sides and is connected to the mounting body by means of snap-action latching connections. At least one pad element is restrained between the cover and the strip sections of the load connection elements.

Claims

1. A pressure-contact power semiconductor module, for positioning on a heat sink and for use with a substrate, the substrate having a bottom side disposed in thermal contact with the heat sink and having conductor tracks and power semiconductor components on a top side thereof opposite to the heat sink, wherein the module comprises:

a mounting body positioned above the substrate and having cutouts therein;

a load connection element positioned on said mounting body, said load connection element having strip sections insulated from one another, and contact feet that extend away from said strip sections and through said cutouts to provide electrical contact with the conductor tracks of the substrate;

a dimensionally stable stiff cover which covers said mounting body on all sides and is connected to said mounting body by means of a snap-action latching connection for fixing the power semiconductor module to the heat sink; and

an elastic pad element disposed between said cover and said strip sections of said load connection element.

2. The power semiconductor module of claim 1, wherein said cover includes fixing holes for fixing the power semiconductor module to the heat sink.

3. The power semiconductor module of claim 1, wherein said mounting body has a peripheral frame web on its underside for the precise positioning of the substrate therebeneath.

4. The power semiconductor module of claim 1, wherein said snap-action latching connection comprises resilient latching fingers formed on said mounting body and mating associated latching holes formed in said cover.

5. The power semiconductor module of claim 1, wherein said mounting body includes pedestals formed on a top side thereof and said cover includes shafts for attaching to said pedestals and for aligning said cover with said mounting body and affixing said cover to said mounting body.

6. The power semiconductor module of claim 5, wherein said pedestals include threaded sleeves and said load connection elements include connection contacts having through holes formed therein, said through holes being axially aligned with said threaded sleeves for aligning said mounting body and said load connection element.

7. The power semiconductor module of claim 1, wherein said cover includes a fixing shaft for additionally fixing the power semiconductor module to the heat sink.

8. The power semiconductor module of claim 1, wherein a circuit board is fitted to said cover and includes auxiliary contacts projecting therefrom;

and

wherein said load connection element includes resilient auxiliary connection elements;

whereby the substrate may be electrically connected to the circuit board by means of pressure contact between said resilient auxiliary connection elements and the auxiliary contacts.

9. The power semiconductor module of claim 8, wherein said cover includes auxiliary shafts to provide access to the auxiliary contacts.

10. The power semiconductor module of claim 8, wherein said resilient auxiliary connection elements have through holes formed therein;

and

wherein said mounting body includes auxiliary pedestals into which threaded sleeves are integrated;

whereby said threaded sleeves may be axially aligned with said through to position said mounting body in place.

11. A method for producing a pressure-contact power semiconductor module for use with a substrate, the substrate having a top side with conductor tracks and power semiconductor components disposed thereon, and being covered by an insulating layer, the module comprising:

a mounting body positioned above the substrate and having cutouts therein;

a load connection element positioned on said mounting body, said load connection element having strip sections insulated from one another, and contact feet that extend away from said strip sections;

a dimensionally stable stiff cover which covers said mounting body on all sides and is connected to said mounting body by means of a snap-action latching connection for fixing the power semiconductor module to the cooling component; and

an elastic pad element disposed between said cover and said strip sections of said load connection element;

wherein the method comprises the steps of;

arranging said load connection elements on said mounting body, wherein said contact feet of said load connection element are disposed through said cutouts in said mounting body such that said contact feet project from said mounting body on the underside thereof and through said cutouts to provide electrical contact with the conductor tracks of the substrate;

arranging said pad element on the strip sections of said load connection element;

positioning said resilient auxiliary connection elements on said mounting body;

fitting said cover to said mounting body;

connecting said cover to said mounting body by closing said snap-action latching connections; and

fixing the substrate coated with the insulating layer to the underside of said mounting body.