CONDITIONING TOOLS AND TECHNIQUES FOR CHEMICAL MECHANICAL PLANARIZATION
First Claim
1. A tool for conditioning a chemical mechanical planarization (CMP) pad comprising:
- a support member having a first side and a second side; and
a plurality of abrasive particles, coupled to at least one of the first and second sides of the support member by a metal bond, and at least 95% (by weight) of the abrasive particles have, independently, a particle size of less than about 85 micrometers;
wherein the tool has an abrasive particle concentration of greater than about 4000 abrasive particles/inch2 (620 abrasive particles/centimeter2), an inter-particle spacing so that substantially no abrasive particles are touching other abrasive particles, and a plurality of narrow slots extending along the surface of at least one of the first and second sides.
2 Assignments
0 Petitions
Accused Products
Abstract
Tools for conditioning chemical mechanical planarization (CMP) pads comprise a substrate with abrasive particles coupled to at least one surface. The tools can have various particle and bond configurations. For instance, abrasive particles may be bonded (e.g., brazed or other metal bond technique) to one side, or to front and back sides. Alternatively, abrasive particles are bonded to a front side, and filler particles coupled to a back side. The abrasive particles can form a pattern (e.g., hexagonal) and have particle sizes that are sufficiently small to penetrate pores of a CMP pad during conditioning, leading to fewer defects on wafers polished with the conditioned CMP pad. Grain bonding can be accomplished using brazing films, although other metal bonds may be used as well. Also, balanced bond material (e.g., braze on both sides) allows for low out-of-flatness value.
158 Citations
46 Claims
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1. A tool for conditioning a chemical mechanical planarization (CMP) pad comprising:
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a support member having a first side and a second side; and a plurality of abrasive particles, coupled to at least one of the first and second sides of the support member by a metal bond, and at least 95% (by weight) of the abrasive particles have, independently, a particle size of less than about 85 micrometers; wherein the tool has an abrasive particle concentration of greater than about 4000 abrasive particles/inch2 (620 abrasive particles/centimeter2), an inter-particle spacing so that substantially no abrasive particles are touching other abrasive particles, and a plurality of narrow slots extending along the surface of at least one of the first and second sides. - View Dependent Claims (3, 9, 10, 11, 14, 16, 17, 18, 46)
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23. A tool for conditioning a chemical mechanical planarization (CMP) pad comprising:
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a metallic substrate having a first side and a second side; a brazing alloy; and a plurality of diamonds brazed to at least one of the first side and second side of the metallic substrate by the brazing alloy, at least 95% (by weight) of the diamonds having a particle size of less than about 85 micrometers; wherein the tool has an abrasive particle concentration of greater than about 4000 abrasive particles/inch2 (620 abrasive particles/centimeter2), an inter-particle spacing so that less than 5% by volume of the abrasive particles are touching other abrasive particles, and a plurality of narrow slots extending along the surface of at least one of the first and second sides. - View Dependent Claims (28, 29, 31)
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34. A method for manufacturing a tool for conditioning a chemical mechanical planarization (CMP) pad comprising the steps of:
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providing a support member having a first side and a second side; and coupling abrasive particles to at least one of the first and second sides of the support member with a metal bond, and at least 95% (by weight) of the abrasive particles have, independently, a particle size of less than about 85 micrometers; wherein the tool is manufactured to have an abrasive particle concentration of greater than about 4000 abrasive particles/inch2 (620 abrasive particles/centimeter2), an inter-particle spacing so that substantially no abrasive particles are touching other abrasive particles, and a plurality of narrow slots extending along the surface of at least one of the first and second sides. - View Dependent Claims (36, 37, 41, 42, 43)
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Specification