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CONDITIONING TOOLS AND TECHNIQUES FOR CHEMICAL MECHANICAL PLANARIZATION

  • US 20080271384A1
  • Filed: 09/19/2007
  • Published: 11/06/2008
  • Est. Priority Date: 09/22/2006
  • Status: Abandoned Application
First Claim
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1. A tool for conditioning a chemical mechanical planarization (CMP) pad comprising:

  • a support member having a first side and a second side; and

    a plurality of abrasive particles, coupled to at least one of the first and second sides of the support member by a metal bond, and at least 95% (by weight) of the abrasive particles have, independently, a particle size of less than about 85 micrometers;

    wherein the tool has an abrasive particle concentration of greater than about 4000 abrasive particles/inch2 (620 abrasive particles/centimeter2), an inter-particle spacing so that substantially no abrasive particles are touching other abrasive particles, and a plurality of narrow slots extending along the surface of at least one of the first and second sides.

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