Packaged MEMS device assembly

• US 20080272446A1
• Filed: 05/03/2006
• Published: 11/06/2008
• Est. Priority Date: 05/03/2006
• Status: Active Grant

• Current Assignee: Hewlett-Packard Development Company, L.P. (HP Inc.)
• Original Assignee: Hewlett-Packard Development Company, L.P. (HP Inc.)
• Inventors: Sand, Kirby, Chen, Chien-Hua, Haluzak, Charles C., Pollard, Jeffrey R., Smith, James Denning, Kang, Henry, Sterner, John R.
• Granted Patent: US 7,723,811 B2
• Time in Patent Office: Days
• US Class Current: 257/415
• CPC Class Codes: B81C 3/001 Bonding of two components
• CPC Class Codes: H01L 21/67092 Apparatus for mechanical treatment or grinding or cutting, see the relevant groups in subclasses B24B or B28D
• CPC Class Codes: H01L 25/0657 Stacked arrangements of devices
• CPC Class Codes: H01L 25/50 Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group H01L27/00 or H01L29/00 H01L21/50 takes precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

A packaged micro-electromechanical systems (MEMS) device assembly includes a MEMS device, a substrate within which the MEMS device is disposed, and a lid disposed over the substrate. The assembly may include one or more first cavities within the lid having a predetermined volume satisfying packaging specifications for the packaged MEMS device assembly. The assembly may include one or more second cavities within the lid and one or more corresponding overflow areas within the lid, where each second cavity contains a material and each corresponding overflow area is adapted to catch overflow of the material. The assembly may include one or more third cavities within the lid and one or more channels within one of the substrate and the lid to fluidically connect the MEMS device to the third cavities.

Claims

1. A packaged micro-electromechanical systems (MEMS) device assembly comprising:

a MEMS device;

a substrate within which the MEMS device is disposed;

a lid disposed over the substrate; and

,

one or more of;

one or more first cavities within the lid having a predetermined volume satisfying packaging specifications for the packaged MEMS device assembly;

one or more second cavities within the lid and one or more corresponding overflow areas within the lid, each second cavity containing a material and each corresponding overflow area adapted to catch overflow of the material; and

,

one or more third cavities within the lid and one or more channels within one of the substrate and the lid to fluidically connect the MEMS device to the third cavities.

2. The packaged MEMS device assembly of claim 1, wherein one or more of the first cavities, the second cavities, and the third cavities are a same cavity.

3. The packaged MEMS device assembly of claim 1, wherein a hermetic seal is defined at the interface between the substrate and the lid.

4. The packaged MEMS device assembly of claim 1, comprising at least the first cavities, such that within each of one or more of the first cavities a material is disposed therein, the material comprising one or more of:

a desiccant material, a getter material, and a lubricant.

5. The packaged MEMS device assembly of claim 1, comprising at least the second cavities and the corresponding overflow areas, each second cavity overlapped by a corresponding overflow area having a width greater than a width of the second cavity and a depth shallower than a depth of the second cavity.

6. The packaged MEMS device assembly of claim 1, comprising at least the second cavities and the corresponding overflow areas, each second cavity having desiccant disposed therein and a corresponding overflow area adapted to catch overflow of the desiccant.

7. The packaged MEMS device assembly of claim 1, comprising at least the third cavities within the lid and the channels within the substrate.

8. The packaged MEMS device assembly of claim 7, wherein the substrate comprises a first layer and one or more second layers, and the channels each comprise a plurality of holes within the second layers and one or more tubes within the first layer underneath the holes within the second layers.

9. The packaged MEMS device assembly of claim 1, wherein the lid is a glass lid in bonding contact with the substrate.

10. The packaged MEMS device assembly of claim 1, wherein the lid is at least substantially transparent, and the MEMS device comprises a plurality of display elements, such that the packaged MEMS device assembly is part of a display device.

11. A method comprising:

providing a lid for a packaged micro-electromechanical systems (MEMS) device assembly to be disposed over a substrate of the packaged MEMS device assembly within which a MEMS device of the packaged MEMS device assembly is disposed; and

,

one or more of;

forming one or more first cavities within the lid having a predetermined volume satisfying packaging specifications for the packaged MEMS device assembly; and

,

forming one or more second cavities within the lid and one or more corresponding overflow areas within the lid, each second cavity to contain a material and each corresponding overflow area adapted to catch overflow of the material.

12. The method of claim 11, comprising forming the first cavities by one or more of laser machining, sawing, hot molding, plasma etching, wet etching, and powder blasting.

13. The method of claim 11, comprising forming the first cavities, and further comprising disposing a desiccant within each of one or more of the first cavities.

14. The method of claim 11, comprising forming the second cavities and the corresponding overflow areas, by one or more of laser machining, sawing, hot molding, plasma etching, wet etching, and powder blasting.

15. The method of claim 11, comprising forming the second cavities and the corresponding overflow areas, and further comprising disposing the material within each of one or more of the second cavities.

16. The method of claim 11, further comprising bonding the lid directly to the substrate and to the MEMS device disposed within the substrate to form the packaged MEMS device assembly, such that a hermetic seal is defined between the lid and the substrate.

17. A method comprising:

providing a substrate of a packaged micro-electromechanical systems (MEMS) device assembly within which a MEMS device of the packaged MEMS device assembly is disposed and over which a lid of the packaged MEMS device assembly is to be disposed; and

,

forming one or more channels within the substrate to be fluidically connected to the MEMS device to one or more cavities of the lid.

18. The method of claim 17, wherein forming the channels within the substrate comprises:

etching a plurality of holes within a first layer of the substrate; and

,

etching one or more tubes within a second layer of the substrate underneath the first layer through the holes within the first layer.

19. The method of claim 17, further comprising forming the cavities within the lid to which the MEMS device is to be fluidically connected via the channels within the substrate.

20. The method of claim 17, further comprising bonding the lid directly to the substrate and to the MEMS device disposed within the substrate to form the packaged MEMS device assembly, such that the MEMS device is fluidically connected to the cavities of the lid via the channels within the substrate, and such that a hermetic seal is defined between the lid and the substrate.