SEMICONDUCTOR DIE PACKAGE AND INTEGRATED CIRCUIT PACKAGE AND FABRICATING METHOD THEREOF
First Claim
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1. A semiconductor die package comprising:
- a substrate;
a semiconductor die mounted on the substrate;
a molding covering the semiconductor die and formed on the substrate; and
a conductive layer laminated on the molding, said molding and conductive layer being selectively etched around said die.
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Abstract
A semiconductor die package includes a substrate, a semiconductor die mounted on the substrates a molding covering the semiconductor die and which is formed on the substrate and a conductive layer laminated on the molding.
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Citations
16 Claims
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1. A semiconductor die package comprising:
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a substrate; a semiconductor die mounted on the substrate; a molding covering the semiconductor die and formed on the substrate; and a conductive layer laminated on the molding, said molding and conductive layer being selectively etched around said die. - View Dependent Claims (2, 3, 4, 5)
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6. An integrated circuit package comprising:
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a printed circuit board provided with at least one ground terminal, at least one electrical terminal, and at least one electronic component electrically connected to the ground and the electrical terminal; a semiconductor die package mounted on the printed circuit board; a molding covering the semiconductor die package and the electronic component, said molding being formed on the printed circuit board; and a conductive layer laminated onto the molding, said molding and conductive layer being selective etched. - View Dependent Claims (7, 8)
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9. A method for fabricating a semiconductor die package, the method comprising:
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forming circuit patterns including ground and electrical terminals on a substrate; mounting multiple semiconductor dies on the substrate; electrically connecting adjacent ground terminals by electrical wirings; forming a molding covering the circuit patterns and the semiconductor dies on the substrate; cutting the electrical wirings connecting adjacent ground terminals and the molding; and laminating a conductive layer onto an outer surface of the molding. - View Dependent Claims (10, 11)
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12. A method for fabricating a semiconductor die package, the method comprising:
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forming circuit patterns including ground and electrical terminals on a substrate; mounting multiple semiconductor dies on the substrate; forming a molding covering the circuit patterns and the semiconductor dies on the substrate; cutting the ground terminals and the molding; and laminating a conductive layer on an outer surface of the molding.
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13. A method for fabricating an integrated circuit package, the method comprising:
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forming circuit patterns including ground and electrical terminals on a printed circuit board; mounting multiple semiconductor die packages on the printed circuit board; electrically connecting adjacent ground terminals from the circuit patterns by electrical wirings; forming a molding covering the circuit patterns and the semiconductor die packages on the printed circuit board; etching the molding and selected electrical wirings between the ground terminals and the molding; and laminating a conductive layer on an outer surface of the molding, said conductive layer in electrical contact with said exposed electrical wiring ends.
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14. An EMI protected semiconductor die package comprising:
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a substrate; at least one semiconductor die mounted on the substrate; at least one electrical terminal electrically connected to the semiconductor die; a plurality of ground terminals, wherein adjacent ground terminals are electrically connected by electrical wiring, a molding covering the semiconductor die and formed on the substrate; a conductive layer laminated on the molding, said molding and conductive layer being selectively etched to expose wire ends of adjacent ground connections. - View Dependent Claims (15, 16)
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Specification