Apparatus and Methods for Constructing Antennas Using Vias as Radiating Elements Formed in a Substrate

• US 20080272977A1
• Filed: 07/21/2008
• Published: 11/06/2008
• Est. Priority Date: 12/09/2003
• Status: Active Grant

• Current Assignee: Globalfoundries US Incorporated (GlobalFoundries, Inc.)
• Original Assignee: Brian Paul Gaucher, Duixian Liu, Thomas Martin Zwick, Ullrich Richard Rudolf Pfeiffer
• Inventors: Zwick, Thomas Martin, Gaucher, Brian Paul, Liu, Duixian, Pfeiffer, Ullrich Richard Rudolf
• Granted Patent: US 7,999,753 B2
• Time in Patent Office: Days
• US Class Current: 343/860
• CPC Class Codes: H01L 2223/6677 for antenna, e.g. antenna included within housing of semiconductor device antennas per se H01Q
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/73207 Bump and wire connectors
• CPC Class Codes: H01L 23/66 High-frequency adaptations
• CPC Class Codes: H01L 24/73 Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/12042 LASER
• CPC Class Codes: H01L 2924/14 Integrated circuits
• CPC Class Codes: H01L 2924/3011 Impedance
• CPC Class Codes: H01Q 1/38 formed by a conductive layer on an insulating support patch antennas H01Q9/0407; microstrip dipole antennas H01Q9/065; microstrip slot antennas H01Q13/106; transmission line microstrip antennas H01Q13/206; manufacturing reflecting surfaces using insulating material for supporting the reflecting surface H01Q15/142
• CPC Class Codes: H01Q 1/48 Earthing means; Earth screens; Counterpoises
• CPC Class Codes: H01Q 23/00 Antennas with active circuits or circuit elements integrated within them or attached to them
• CPC Class Codes: H01Q 9/0407 Substantially flat resonant element parallel to ground plane, e.g. patch antenna dipole H01Q9/285; monopole H01Q9/40
• CPC Class Codes: H01Q 9/28 Conical, cylindrical, cage, strip, gauze, or like elements having an extended radiating surface; Elements comprising two conical surfaces having collinear axes and adjacent apices and fed by two-conductor transmission lines waveguide horns or mouths H01Q13/00; slot antennas H01Q13/00
• CPC Class Codes: H01Q 9/40 Element having extended radiating surface
• CPC Class Codes: Y10T 29/49016 Antenna or wave energy "plumbing" making
• CPC Class Codes: Y10T 29/49018 with other electrical component

Abstract

Antennas are provided which are constructed using one or more conductive via stubs as radiating elements formed in a substrate. The antennas can be integrally packaged with IC chips (e.g., IC transceivers, receivers, transmitters, etc.) to build integrated wireless or RF (radio frequency) communications systems.

Claims

1. An antenna, comprising:

a substrate; and

a conductive via stub formed in the substrate, wherein the conductive via stub is a radiating element.

2. The antenna of claim 1, further comprising a ground plane formed on a surface of the substrate.

3. The antenna of claim 1, wherein the antenna is an omni-directional antenna or a directional antenna.

4. The antenna of claim 2, further comprising an impedance matching network, wherein the impedance matching network comprises:

a insulation layer formed on the ground plane; and

a conductive layer formed on the insulation layer, wherein the conductive layer is patterned to form the impedance matching network.

5. The antenna of claim 4, wherein the impedance matching network comprises a transmission line.

6. The antenna of claim 1, wherein the antenna has a resonant frequency of about 20 GHz or greater.

7. The antenna of claim 1, wherein the radiating element further comprises a hat element formed on one end of the conductive via stub.

8. The antenna of claim 1, wherein the substrate comprises a printed circuit board.

9. The antenna of claim 1, wherein the substrate is comprised of a dielectric material or a semiconductor material.

10. A wireless device having an antenna as defined in claim 1.

11. An integrated circuit package comprising an antenna as defined in claim 1.

12. An integrated communications device, comprising:

an IC (integrated circuit) chip; and

an antenna bonded to the IC chip, the antenna comprising;

a substrate; and

a conductive via stub formed in the substrate, wherein the conductive via stub is a radiating element.

13. The device of claim 12, wherein the IC chip comprises a transceiver, a receiver, or a transmitter.

14. The device of claim 12, further comprising a plurality of patterned layers between the antenna and IC chip for providing electrical interconnections.

15. The device of claim 14, wherein the plurality of patterned layers comprise:

an insulation layer formed on a ground plane formed on a surface of the substrate of the antenna; and

a conductive layer formed on the insulation layer, wherein the conductive layer is patterned to form a plurality of contact pads or transmission lines.

16. The device of claim 15, wherein the insulation layer comprises a plurality of grounding vias formed therein, wherein the grounding vias provide ground connections between the IC chip and the ground plane of the antenna.

17. The device of claim 15, wherein the insulation layer comprises a feeding via formed therein, wherein the feeding via provides a connection to the radiating element of the antenna.

18. The device of claim 15, further comprising an impedance matching network that is formed from the plurality of patterned layers.

19. The device of claim 18, wherein the impedance matching network comprises a microstrip transmission line patterned on the conductive layer.

20. The device of claim 12, wherein the antenna is an omni-directional antenna or a directional antenna.

21. The device of claim 12, wherein the antenna has a resonant frequency of about 20 GHz or greater.

22. The device of claim 12, wherein the at least one radiating element of the antenna further comprises a hat element formed on the conductive via stub opposite the ground plane.

23. A wireless device having an integrated device as defined in claim 12.

24. The device of claim 12, wherein the antenna further comprises a ground plane formed on a surface of the substrate.