MAGNETICALLY COUPLED COOLING BLOCK

• US 20080273308A1
• Filed: 05/01/2007
• Published: 11/06/2008
• Est. Priority Date: 05/01/2007
• Status: Abandoned Application

• Current Assignee: Hewlett-Packard Development Company, L.P. (HP Inc.)
• Original Assignee: Hewlett-Packard Development Company, L.P. (HP Inc.)
• Inventors: Tye, Trentent, Handy, Ryan, Kells, Trevor A.
• Application Number:
  US11/742,592
• Publication Number:
  US 20080273308A1
• Time in Patent Office: Days
• US Class Current: 361/704
• CPC Class Codes: H01L 23/40 Mountings or securing means for detachable cooling or heating arrangements heating H01L23/345; fixed by friction, plugs or springs
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

A cooling mechanism comprises a first cooling block and a second cooling block. At least one of the first and second cooling blocks comprises a magnet to retain at least one of the blocks in place when cooling a heat-producing component.

Claims

1. A cooling mechanism, comprising:

a first cooling block; and

a second cooling block;

wherein at least one of said first and second cooling blocks comprises a magnet to retain at least one of the blocks in place when cooling a heat-producing component.

2. The cooling mechanism of claim 1 wherein at least one of the first and second cooling blocks comprises a water block.

3. The cooling mechanism of claim 1 wherein both of the first and second cooling blocks comprise water blocks.

4. The cooling mechanism of claim 1 further comprising at least one guide mechanism provided on at least one of said first and second cooling blocks.

5. The cooling mechanism of claim 4 wherein the at least one guide mechanism comprises a guide pin.

6. The cooling mechanism of claim 4 wherein the at least one guide mechanism comprises a slot for a guide pin.

7. The cooling mechanism of claim 1 wherein said magnet comprises a rare earth magnet.

8. The cooling mechanism of claim 1 wherein said magnet comprises an electromagnet.

9. The cooling mechanism of claim 8 further comprising an attachment mechanism other than a magnetic attachment mechanism to couple the first and second cooling blocks together when said electromagnet is not activated.

10. A system, comprising:

a heat-producing component; and

a cooling mechanism magnetically coupled to said heat-producing component.

11. The system of claim 10 the cooling mechanism comprises a water block.

12. The system of claim 10 wherein the cooling mechanism comprises at least two portions each magnetically coupled to opposing sides of the heat-producing component.

13. The system of claim 10 further comprising at least one guide mechanism provided cooling mechanism.

14. The system of claim 10 wherein said cooling mechanism comprises a rare earth magnet.

15. The system of claim 10 wherein said cooling mechanism comprises an electromagnet.

16. The system of claim 15 wherein the cooling mechanism comprises an attachment mechanism other than a magnetic attachment mechanism to couple the cooling mechanism to the heat-producing mechanism when said electromagnet is not activated.

17. The system of claim 10 wherein the heat-producing component comprises a component selected from a group consisting of a graphics card and a processor.

18. The system of claim 10 wherein the cooling mechanism comprises a water block.

19. A system, comprising:

first means for magnetically coupling to and for cooling a heat-producing component; and

second means for magnetically coupling to and for cooling the heat-producing component.

20. The cooling mechanism of claim 19 wherein the first and second means for magnetically coupling are for electromagnetically coupling.