INTERFACE FOR WAVEGUIDE PIN LAUNCH

• US 20080273843A1
• Filed: 05/02/2007
• Published: 11/06/2008
• Est. Priority Date: 05/02/2007
• Status: Active Grant

• Current Assignee: ViaSat Incorporated
• Original Assignee: ViaSat Incorporated
• Inventors: Zienkewicz, Rob, DeCamp, John, Harper, Dave, Buer, Ken
• Granted Patent: US 7,625,131 B2
• Time in Patent Office: Days
• US Class Current: 385/92
• CPC Class Codes: H01P 5/085 Coaxial-line/strip-line transitions

Abstract

in general, in accordance with an exemplary aspect of the present invention, a low-loss interface for connecting an integrated circuit such as a monolithic microwave integrated circuit to an energy transmission device such as a waveguide is disclosed. In one exemplary embodiment, the interface comprises a pin seated within an assembly that forms a hermetic sealed, coaxial structure to prevent signal loss at increasing frequencies.

Claims

1. An interface comprising:

a pin configured to transport energy from a circuit to a waveguide; and

an assembly surrounding the pin configured to reduce energy loss as compared to a pin without the assembly surrounding the pin.

2. The interface of claim 1, further comprising a space defined between the pin and the assembly.

3. The interface of claim 2, further comprising two beads that are connected to the assembly that further define the space.

4. The interface of claim 1, further comprising an insulator attached to the pin.

5. The interface of claim 1, wherein the interface comprises two opposing ends, wherein one end is attached to a circuit and the other end is attached to a waveguide, and a hermetic seal between the circuit and the waveguide.

6. An interface comprising:

a pin comprising first and second ends, wherein the first end is connected to a waveguide assembly and the other end is connected to a circuit, wherein the pin is configured to transport energy from the circuit to the waveguide;

an assembly with two opposing ends surrounding the pin and connected to the waveguide wherein the assembly is configured to reduce energy loss;

two beads contacting the pin and the assembly wherein one bead contacts one end of the assembly adjacent to the waveguide and the other bead contacts the opposing end of the assembly; and

a space defined by the pin, the assembly, and the two beads.

7. The interface of claim 6, wherein the circuit is a monolithic microwave integrated circuit.

8. The interface of claim 6, wherein the bead contacting the opposing end of the assembly from the waveguide forms a hermetic seal between the assembly and the pin.

9. The interface of claim 6, wherein the interface has a coaxial structure.

12. The interface of claim 6, wherein the pin is a commercially available feedthru pin.

13. The interface of claim 6, wherein the interface further comprises a hermetic seal between the circuit and the waveguide assembly.

10. The interface of claim 10, further comprising an insulator attached to the pin adjacent to the circuit.

11. The interface of claim 10, wherein the insulator is tape.

14. An interface comprising:

a feedthru pin with one end connected to a waveguide assembly and another end connected to a monolithic microwave integrated circuit wherein the feedthru pin is configured to transport energy from the monolithic microwave integrated circuit to the waveguide;

an assembly surrounding the pin and connected to the waveguide wherein the assembly is configured to reduce energy loss;

two beads connected to the feedthru pin and the assembly wherein one bead contacts one end of the assembly and the other bead is a glass bead contacting an opposing end of the assembly that forms a hermetic seal between the feedthru pin and assembly;

a space concentrically surrounding the feedthru pin defined by the feedthru pin, the assembly, and the two beads configured to reduce energy loss; and

a thin insulator attached to the pin adjacent to the monolithic microwave integrated circuit.

15. The interface of claim 14, further comprising a wire bond connecting the feedthru pin to the monolithic microwave integrated circuit.

16. The interface of claim 14, wherein the interface is a coaxial structure.

17. The interface of claim 14;

wherein the space has a radius of 0.086 inches and the interface is configured for a fifty ohm feedthru pin.

18. The interface of claim 14, wherein the assembly comprises metal coated with a low-loss metal coating.

19. The interface of claim 14, wherein the assembly comprises plastic coated with a low-loss material.

20. The interface of claim 14, wherein the feedthru pin is comprised substantially of gold.

21. The interface of claim 14, wherein the interface further comprises a hermetic seal between the monolithic microwave integrated circuit and the waveguide assembly.

22. A pathway for a microwaves comprising:

a monolithic microwave integrated circuit;

an interface connected to the monolithic integrated circuit comprising a feedthru pin and an assembly surrounding the feedthru pin and defining a space between the feedthru pin and the assembly; and

a waveguide attached to the interface.

23. The pathway of claim 22, wherein the interface further comprises two beads that contact the assembly and further define the space.

24. The pathway of claim 22, wherein at least one bead forms a hermetic seal.

25. The pathway of claim 22, wherein the interface has a coaxial structure.

26. The pathway of claim 22, wherein the interface further comprises a hermetic seal between the monolithic microwave integrated circuit and the waveguide assembly.

27. A low loss impedance interface configured to facilitate microwave signal transmission from a MMIC to a waveguide, wherein the interface comprises:

a pin having a first end configured to connect the waveguide to the pin, the pin further comprising a second end configured to connect to the MMIC via a wirebond;

a first bead configured to be around said pin;

a second bead configured to be around the pin wherein the first bead is closer to the first end than the second bead; and

an assembly comprising a low-loss material configured to surround the pin, the first bead, the second bead, and a hermetically sealed space between the MMIC and the waveguide.